US2230 XITCORP Solid State Drive (BGA 156-ball) In Stock

Extreme-endurance pSLC BGA SATA SSD on XT6121, 32-128GB in 156-ball package, TBW up to 3,200TB, -45 to +85C, for UAVs, vehicle devices and ruggedized embedded boards.

PRODUCTIONSolid State DriveVerified Jul 2026
Product Image
US2230 - electronic component
Quick Facts
Manufacturer
XITCORP
Package
BGA 156-ball
Lifecycle
PRODUCTION
Datasheet
N/A
Category
Solid State Drive
Temp Range
-45.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • pSLC NAND with TBW up to 3,200 TB
  • -45°C to +85°C extended operating range
  • Solder-down 156-ball BGA, 16 x 20 x 1.4 mm
  • Up to 558/410 MB/s over SATA 3.0
  • RAID, SRAM ECC, secure erase, wear leveling
  • Optional PLP and soft/hard destruction

Applications

The US2230 targets the harshest embedded storage sockets: storage and interface boards, ruggedized cards, UAVs, intelligent vehicle equipment and mission-critical portable systems where pSLC endurance and sub-zero cold starts are required.

Specifications

ControllerXITCORP XT6121
NAND FlashpSLC
InterfaceSATA 3.0 (6Gb/s)
PackageBGA 156-ball, 16 x 20 x 1.4 mm
Capacity Options32 GB / 64 GB / 128 GB
Sequential Read (max)Up to 558 MB/s
Sequential Write (max)Up to 410 MB/s
Random Read (max)Up to 43,191 IOPS
Random Write (max)Up to 55,092 IOPS
TBW800 TB (32 GB) / 1,600 TB (64 GB) / 3,200 TB (128 GB)
MTBF2,000,000 hours
Power ConsumptionActive ≤1.5 W, Idle ≤0.5 W
Operating Temperature-45°C to +85°C
Storage Temperature-55°C to +95°C
Vibration (non-operating)15 G, 7–2,000 Hz
Shock (non-operating)1,500 G, 0.5 ms, 3 axis
Key FeaturesRAID, SRAM ECC, secure erase, online upgrade, smart wear leveling; optional PLP and soft/hard destruction
CertificationsRoHS, FCC
OS CompatibilityWindows 7/8.1/10, Linux, Kylin/UOS
PackageBGA 156-ball

Compliance & Regulatory

RoHS StatusCompliant

Additional Information

Product FamilyEmbedded Storage

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What endurance does the US2230's pSLC memory deliver?

Its pSLC NAND is rated 800 TB TBW at 32 GB, 1,600 TB at 64 GB and 3,200 TB at 128 GB — roughly triple an equivalent TLC BGA drive — with a 2-million-hour MTBF.

What temperature range and package does the US2230 use?

It operates from -45°C to +85°C (storage -55°C to +95°C) in a solder-down 156-ball BGA measuring 16 x 20 x 1.4 mm on the XT6121 controller.

What interface speed does it reach?

Over SATA 3.0 6Gb/s the US2230 delivers up to 558 MB/s sequential read, 410 MB/s sequential write, and random performance up to 43,191 read and 55,092 write IOPS.

How does the US2230 compare with the similar US2200?

The US2230 swaps TLC for pSLC NAND, trading maximum capacity (128 GB versus 1 TB) for far higher endurance and a wider -45°C cold-start limit, at the same package size and power.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About XITCORP

XITCORP is a leading electronic component manufacturer. FindMyChip sources XITCORP ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.

TM
Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany