66AK2H12AXAAW2 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments 66AK2H12AXAAW2 is a multicore DSP plus ARM SoC with floating-point DSP cores, up to 156.25 MHz clock, 24-bit address bus, and boundary scan support in 1517-pin BGA package. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 1517
- Lifecycle
- OBSOLETE
- Datasheet
- 66AK2H12AXAAW2 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 66AK2H12AXAAW2?
- Multicore DSP and ARM SoC architecture combining floating-point DSP performance with ARM application processing in a single device
- Up to 156.25 MHz maximum clock frequency with integrated cache and low-power mode for high-throughput signal processing
- 1517-pin BGA package with 24-bit address bus, 16-bit external data bus, and JTAG boundary scan for system debug
What is 66AK2H12AXAAW2 used for?
The 66AK2H12AXAAW2 is designed for high-performance wireless basestation infrastructure, radar signal processing, and industrial machine vision where parallel DSP throughput combined with ARM control is essential. Its multicore floating-point architecture enables real-time FFT, filtering, and beamforming operations without offloading to discrete DSP chips. The integrated low-power mode supports energy-efficient deployment in always-on signal acquisition systems.
What are the specifications of 66AK2H12AXAAW2?
| Pbfree Code | No |
| YTEOL | 0 |
| Address Bus Width | 24 |
| Boundary Scan | YES |
| Clock Frequency-Max | 156.25MHz |
| External Data Bus Width | 16 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B1517 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Speed | 1200MHz |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.30 |
Where can I find the 66AK2H12AXAAW2 datasheet?
66AK2H12AXAAW2 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 66AK2H12AXAAW2?
Compatible alternatives and drop-in replacements for 66AK2H12AXAAW2:
Frequently Asked Questions
What is the maximum clock frequency of the 66AK2H12AXAAW2 DSP cores?
The 66AK2H12AXAAW2 supports a maximum clock frequency of 156.25 MHz across its DSP cores, delivering high-throughput floating-point computation suited for real-time signal processing tasks such as FFT, FIR filtering, and matrix operations in telecom and radar applications.
How many pins does the 66AK2H12AXAAW2 BGA package have and what board design implications does that create?
The 66AK2H12AXAAW2 comes in a 1517-ball BGA package, which requires high-density PCB routing with multiple signal layers, controlled-impedance traces, and careful power delivery network design to support the 24-bit address bus and 16-bit external data bus at full speed.
Which wireless basestation and infrastructure designs benefit from the 66AK2H12AXAAW2 multicore architecture?
4G LTE and 5G small-cell basestations benefit from the 66AK2H12AXAAW2's combined DSP and ARM multicore architecture, where DSP cores handle physical layer processing such as channel coding and equalization at 156.25 MHz while ARM cores manage protocol stack and system management tasks concurrently.
Does the 66AK2H12AXAAW2 support boundary scan for board-level testing?
Yes, the 66AK2H12AXAAW2 includes IEEE 1149.1 JTAG boundary scan support across its 1517-pin BGA, enabling production board-level interconnect testing and in-circuit debug without physical probe access to every signal pin, which simplifies test fixture design for complex multi-chip assemblies.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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