66AK2H12DAAWA24 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments 66AK2H12DAAWA24 is a high-performance multi-core KeyStone II SoC combining ARM Cortex-A15 and C66x DSP cores for baseband and signal processing. Features 1.05 V max supply in a 1517-ball PBGA package for advanced telecommunications and wireless infrastructure. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 1517
- Lifecycle
- ACTIVE
- Datasheet
- 66AK2H12DAAWA24 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 66AK2H12DAAWA24?
- Heterogeneous multi-core architecture integrating ARM Cortex-A15 application cores and TI C66x DSP cores on a single SoC for maximum compute density
- Designed for LTE baseband and wireless infrastructure, offering purpose-built hardware accelerators for protocol processing and signal conditioning tasks
- 1517-ball PBGA package provides high pin-count I/O density for DDR memory interfaces, PCIe, Ethernet, and high-speed serial fabric connectivity
- Introduced 2017 with 15-year estimated product lifespan, ensuring long-term availability for infrastructure and defense program designs with extended procurement windows
What is 66AK2H12DAAWA24 used for?
The 66AK2H12DAAWA24 targets LTE and 4G wireless base station remote radio heads and baseband units, where parallel ARM and DSP cores handle both real-time signal processing and high-level protocol stack execution on a single device. It is also deployed in software-defined networking equipment, military communications platforms, and test and measurement instruments that require concurrent high-throughput DSP workloads alongside operating system-based control software. The device suits any application combining intensive floating-point digital signal processing with Linux-based management and connectivity.
What are the specifications of 66AK2H12DAAWA24?
| Pbfree Code | Yes |
| Date Of Intro | 2017-07-27 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B1517 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| ECCN | 5A991.B |
| HTS Code | 8542.31.00.75 |
| Country of Origin | Philippines |
Where can I find the 66AK2H12DAAWA24 datasheet?
66AK2H12DAAWA24 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 66AK2H12DAAWA24?
Compatible alternatives and drop-in replacements for 66AK2H12DAAWA24:
Frequently Asked Questions
What processor cores are integrated in the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 integrates Texas Instruments' KeyStone II heterogeneous multi-core architecture, combining ARM Cortex-A15 application processor cores with TI C66x fixed and floating-point DSP cores on a single chip. This combination allows simultaneous execution of operating system workloads and high-throughput real-time signal processing tasks.
What is the maximum supply voltage for the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 has a maximum supply voltage of 1.05 V for its core supply rail. This low core voltage is characteristic of advanced CMOS process nodes, enabling high compute density while managing thermal dissipation in the dense multi-core architecture used in wireless infrastructure equipment.
What package does the 66AK2H12DAAWA24 use and what is the pin count?
The 66AK2H12DAAWA24 is housed in a 1517-ball plastic ball grid array (PBGA) package identified by JESD-30 code S-PBGA-B1517. The high ball count accommodates the extensive memory bus, high-speed serial interfaces, peripheral I/O, and power/ground connections required by this complex multi-core SoC.
What are typical applications for the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 is primarily used in LTE and 4G wireless base station baseband processing units, remote radio heads, and small cell platforms. Additional applications include software-defined radio, military tactical communications, high-performance networking equipment, and test instruments requiring combined ARM OS execution and C66x DSP acceleration in a single-chip solution.
What is the expected product lifetime of the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 has a YTEOL (Years to End of Life) value of 15, indicating Texas Instruments plans to support production for approximately 15 years from its 2017 introduction date. This long lifecycle commitment is important for wireless infrastructure and defense programs that require multi-year component availability for production and spares.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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