66AK2H14AAAWA24 Texas Instruments Integrated Circuit (BGA) In Stock
66AK2H14AAAWA24 is a multicore KeyStone II SoC from Texas Instruments combining DSP and ARM cores for high-performance signal processing. It features a 24-bit address bus, 16-bit external data bus, integrated cache, and floating-point processing at up to 1.2 GHz. Available in 1517-ball BGA package, in stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 1517
- Lifecycle
- OBSOLETE
- Datasheet
- 66AK2H14AAAWA24 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 66AK2H14AAAWA24?
- Multicore KeyStone II architecture integrates DSP and ARM Cortex cores for concurrent real-time signal processing and control tasks
- Floating-point DSP engine with 24-bit address space and integrated cache accelerates baseband, radar, and image processing algorithms
- 1517-ball BGA package provides high pin density for memory interfaces, high-speed serial links, and peripheral connectivity in compact telecom modules
What is 66AK2H14AAAWA24 used for?
The 66AK2H14AAAWA24 targets 4G LTE base station baseband processing, radar signal processing, and high-performance embedded computing where heterogeneous multicore DSP plus ARM processing is required on a single SoC. Its floating-point DSP cores and large on-chip cache enable compute-intensive algorithms such as FFT, FIR filtering, and beamforming at throughputs exceeding multiple GFLOPS. The KeyStone II architecture's high-speed serial interfaces and 16-bit external data bus support real-time data ingestion from ADCs and DACs in software-defined radio and test instrumentation platforms.
What are the specifications of 66AK2H14AAAWA24?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Additional Feature | ALSO OPERATES AT 1200 GHZ |
| Address Bus Width | 24 |
| Boundary Scan | YES |
| Clock Frequency-Max | 156.25MHz |
| External Data Bus Width | 16 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B1517 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Speed | 1400MHz |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.30 |
Where can I find the 66AK2H14AAAWA24 datasheet?
66AK2H14AAAWA24 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 66AK2H14AAAWA24?
Compatible alternatives and drop-in replacements for 66AK2H14AAAWA24:
Frequently Asked Questions
What is the external data bus width of the 66AK2H14AAAWA24, and how does this affect memory interface bandwidth?
The 66AK2H14AAAWA24 has a 16-bit external data bus width paired with a 24-bit address bus, supporting addressable memory space of up to 16 MB through the external interface. At a 156.25 MHz maximum clock frequency, the external bus delivers up to approximately 312 MB/s theoretical peak throughput. The integrated cache further reduces external memory access frequency, enabling sustained high-throughput DSP algorithm execution without bus saturation in baseband processing applications.
Which high-performance signal processing applications benefit most from the 66AK2H14AAAWA24's floating-point DSP capability?
Applications requiring intensive floating-point arithmetic — such as 4G LTE channel estimation with 1024-point FFTs, radar pulse compression, MIMO beamforming weight calculations, and medical imaging reconstruction — benefit most from the 66AK2H14AAAWA24's DSP cores. The floating-point format eliminates fixed-point scaling overhead, reducing development complexity for algorithms where dynamic range exceeds 96 dB. The integrated ARM cores handle protocol stack processing and operating system tasks concurrently, freeing DSP cores for pure signal processing workloads.
How does the 1517-ball BGA package of the 66AK2H14AAAWA24 affect PCB design complexity for a telecom line card?
The S-PBGA-B1517 package provides 1517 solder balls, requiring a high-density PCB with at least 8 to 12 routing layers to fan out power, ground, memory, and high-speed serial signals from the central ball array. Board designers must account for ball pitch and power delivery network decoupling within the package footprint. Despite the routing complexity, a single 66AK2H14AAAWA24 SoC replaces multiple discrete DSP and processor devices, reducing total component count and PCB area on telecom base station boards.
Related Guides
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit