66AK2H14AXAAW24 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments 66AK2H14AXAAW24 is a multicore ARM and DSP SoC integrating floating-point signal processing with 156.25 MHz interface clock in a 1517-ball BGA package. Features 24-bit address bus, 16-bit external data bus, and integrated cache for high-performance telecom applications. Available from stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 1517
- Lifecycle
- OBSOLETE
- Datasheet
- 66AK2H14AXAAW24 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 66AK2H14AXAAW24?
- Multicore ARM plus C66x DSP architecture with floating-point capability and integrated cache for high-throughput baseband and packet processing
- 156.25 MHz maximum external interface clock with 16-bit data bus and 24-bit address bus supporting DDR memory and peripheral interfaces
- 1517-ball BGA package with boundary scan enabling complex SoC integration in 4G LTE baseband, networking, and telecom infrastructure equipment
What is 66AK2H14AXAAW24 used for?
The 66AK2H14AXAAW24 targets 4G LTE radio access network equipment, baseband processing units, and high-capacity wireless infrastructure where ARM control processing and C66x DSP floating-point acceleration must coexist on a single SoC. Its 156.25 MHz interface clock and large 1517-ball BGA package suit packet forwarding engines and signal processing pipelines in telecom line cards requiring high memory bandwidth. The device also suits software-defined radio platforms, test and measurement equipment, and deep packet inspection appliances needing combined RISC control and DSP compute in a single integrated solution.
What are the specifications of 66AK2H14AXAAW24?
| Pbfree Code | No |
| YTEOL | 0 |
| Additional Feature | ALSO OPERATES AT 1200 GHZ |
| Address Bus Width | 24 |
| Boundary Scan | YES |
| Clock Frequency-Max | 156.25MHz |
| External Data Bus Width | 16 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B1517 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Speed | 1400MHz |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.30 |
Where can I find the 66AK2H14AXAAW24 datasheet?
66AK2H14AXAAW24 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 66AK2H14AXAAW24?
Compatible alternatives and drop-in replacements for 66AK2H14AXAAW24:
Frequently Asked Questions
What processor architecture combination does 66AK2H14AXAAW24 integrate and how does it benefit baseband processing?
The 66AK2H14AXAAW24 combines ARM Cortex control cores with multiple C66x floating-point DSP cores on a single SoC, enabling 4G LTE layer 1 physical channel processing on the DSP cores while the ARM cores handle protocol stack and OS management. The integrated cache hierarchy and 156.25 MHz external interface reduce memory access latency for real-time signal processing workloads in base station and radio unit designs.
What external memory interface does 66AK2H14AXAAW24 support and what bandwidth does it provide?
The 66AK2H14AXAAW24 features a 16-bit wide external data bus with a 24-bit address space and up to 156.25 MHz interface clock frequency. This configuration supports DDR3 memory controllers and high-speed SRAM interfaces delivering sustained memory bandwidth sufficient for multi-antenna MIMO signal processing in LTE base stations and multi-channel packet processing pipelines.
For a 4G LTE small cell design, when is 66AK2H14AXAAW24 preferred over a standalone ARM application processor?
66AK2H14AXAAW24 is preferred when the application requires dedicated floating-point DSP acceleration alongside ARM control processing in a single device, because standalone ARM processors lack the C66x vector DSP throughput needed for LTE OFDM modulation, turbo decoding, and beamforming at 156.25 MHz memory rates. The 1517-ball BGA package integrates the complete baseband SoC, reducing board-level component count compared to ARM plus discrete DSP two-chip solutions.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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