66AK2H14AXAAW24 Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments 66AK2H14AXAAW24 is a multicore ARM and DSP SoC integrating floating-point signal processing with 156.25 MHz interface clock in a 1517-ball BGA package. Features 24-bit address bus, 16-bit external data bus, and integrated cache for high-performance telecom applications. Available from stock worldwide.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
66AK2H14AXAAW24BGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
1517
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
?°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of 66AK2H14AXAAW24?

  • Multicore ARM plus C66x DSP architecture with floating-point capability and integrated cache for high-throughput baseband and packet processing
  • 156.25 MHz maximum external interface clock with 16-bit data bus and 24-bit address bus supporting DDR memory and peripheral interfaces
  • 1517-ball BGA package with boundary scan enabling complex SoC integration in 4G LTE baseband, networking, and telecom infrastructure equipment

What is 66AK2H14AXAAW24 used for?

The 66AK2H14AXAAW24 targets 4G LTE radio access network equipment, baseband processing units, and high-capacity wireless infrastructure where ARM control processing and C66x DSP floating-point acceleration must coexist on a single SoC. Its 156.25 MHz interface clock and large 1517-ball BGA package suit packet forwarding engines and signal processing pipelines in telecom line cards requiring high memory bandwidth. The device also suits software-defined radio platforms, test and measurement equipment, and deep packet inspection appliances needing combined RISC control and DSP compute in a single integrated solution.

What are the specifications of 66AK2H14AXAAW24?

Pbfree CodeNo
YTEOL0
Additional FeatureALSO OPERATES AT 1200 GHZ
Address Bus Width24
Boundary ScanYES
Clock Frequency-Max156.25MHz
External Data Bus Width16
FormatFLOATING POINT
Integrated CacheYES
JESD-30 CodeS-PBGA-B1517
Low Power ModeYES
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY
Speed1400MHz
Supply Voltage-Max1.05V
Supply Voltage-Min0.95V
Supply Voltage-Nom1V
Surface MountYES
TechnologyCMOS
Temperature GradeOTHER
Terminal FormBALL
Terminal Pitch1mm
Terminal PositionBOTTOM
uPs/uCs/Peripheral ICs TypeSoC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
HTS Code8542.31.00.30

Where can I find the 66AK2H14AXAAW24 datasheet?

66AK2H14AXAAW24 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for 66AK2H14AXAAW24?

Compatible alternatives and drop-in replacements for 66AK2H14AXAAW24:

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Frequently Asked Questions

What processor architecture combination does 66AK2H14AXAAW24 integrate and how does it benefit baseband processing?

The 66AK2H14AXAAW24 combines ARM Cortex control cores with multiple C66x floating-point DSP cores on a single SoC, enabling 4G LTE layer 1 physical channel processing on the DSP cores while the ARM cores handle protocol stack and OS management. The integrated cache hierarchy and 156.25 MHz external interface reduce memory access latency for real-time signal processing workloads in base station and radio unit designs.

What external memory interface does 66AK2H14AXAAW24 support and what bandwidth does it provide?

The 66AK2H14AXAAW24 features a 16-bit wide external data bus with a 24-bit address space and up to 156.25 MHz interface clock frequency. This configuration supports DDR3 memory controllers and high-speed SRAM interfaces delivering sustained memory bandwidth sufficient for multi-antenna MIMO signal processing in LTE base stations and multi-channel packet processing pipelines.

For a 4G LTE small cell design, when is 66AK2H14AXAAW24 preferred over a standalone ARM application processor?

66AK2H14AXAAW24 is preferred when the application requires dedicated floating-point DSP acceleration alongside ARM control processing in a single device, because standalone ARM processors lack the C66x vector DSP throughput needed for LTE OFDM modulation, turbo decoding, and beamforming at 156.25 MHz memory rates. The 1517-ball BGA package integrates the complete baseband SoC, reducing board-level component count compared to ARM plus discrete DSP two-chip solutions.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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