66AK2H12AAAW2 Texas Instruments Microprocessors & SoCs (BGA-1517) In Stock
66AK2H12AAAW2 is a high-performance DSP and ARM multicore SoC by Texas Instruments in a 1517-ball BGA package. Key specs: up to 156.25 MHz clock, 24-bit address bus, 16-bit external data bus, integrated cache, floating-point support. From $50.00, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA-1517
- Pin Count
- 1517
- Lifecycle
- OBSOLETE
- Datasheet
- 66AK2H12AAAW2 Datasheet PDF
- Category
- Microprocessors & SoCs
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Multicore DSP and ARM SoC architecture delivers floating-point processing up to 156.25 MHz for demanding signal processing workloads
- 24-bit address bus and 16-bit external data bus support large memory maps and high-bandwidth data transfers
- Integrated cache and boundary scan (JTAG) simplify debugging and speed up software development cycles
Applications
66AK2H12AAAW2 is designed for high-throughput telecommunications infrastructure, including LTE base stations, wireless backhaul nodes, and software-defined radio platforms requiring concurrent DSP and ARM processing. Its floating-point DSP cores and 156.25 MHz maximum clock make it equally suited for industrial machine-vision systems and defense signal processing equipment that demand deterministic real-time performance.
Specifications
| Pbfree Code | No |
| YTEOL | 0 |
| Address Bus Width | 24 |
| Boundary Scan | YES |
| Clock Frequency-Max | 156.25MHz |
| External Data Bus Width | 16 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B1517 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Speed | 1200MHz |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA-1517 |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for 66AK2H12AAAW2:
Frequently Asked Questions
What maximum clock frequency does the 66AK2H12AAAW2 SoC support for DSP workloads?
The 66AK2H12AAAW2 supports a maximum clock frequency of 156.25 MHz on its DSP and ARM cores, providing ample throughput for real-time signal processing tasks. Combined with integrated floating-point arithmetic and on-chip cache, this clock rate enables single-chip LTE baseband processing without external co-processors.
How does the 1517-ball BGA package of 66AK2H12AAAW2 affect PCB design requirements?
The 1517-ball BGA (S-PBGA-B1517) package requires a high-density multilayer PCB with fine-pitch via-in-pad or dog-bone fan-out routing to access inner-array balls. Designers typically need 6 to 8 PCB layers to route the 24-bit address bus and 16-bit data bus signals while maintaining controlled impedance below 50 ohms for signal integrity.
For a software-defined radio design, why is 66AK2H12AAAW2 a strong candidate over a standalone ARM processor?
Unlike a standalone ARM processor, the 66AK2H12AAAW2 integrates dedicated DSP cores with hardware floating-point units alongside ARM application processors, providing over 10x the throughput for wideband FFT and filtering at 156.25 MHz compared to a software implementation on ARM alone. This reduces latency, power per MFLOP, and external component count in software-defined radio and 4G/5G modem platforms.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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