ON Semiconductor

Zener Voltage Range - 3.3 V to 91 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; DO-41 (DO-204AL) Package; Double Slug Type Construction; Metallurgical Bonded Construction; Oxide Passivated Die Mechanical Characteristics:; CASE: Double slug type, hermetically sealed glass; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 230°C, 1/16" from the case for 10 seconds; POLARITY: Cathode indicated by polarity band; MOU

Zener Voltage Range - 3.3 V to 91 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; DO-41 (DO-204AL) Package; Double Slug Type Construction; Metallurgical Bonded Construction; Oxide Passivated Die Mechanical Characteristics:; CASE: Double slug type, hermetically sealed glass; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 230°C, 1/16" from the case for 10 seconds; POLARITY: Cathode indicated by polarity band; MOU

Zener Voltage Range - 3.3 V to 91 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; DO-41 (DO-204AL) Package; Double Slug Type Construction; Metallurgical Bonded Construction; Oxide Passivated Die Mechanical Characteristics:; CASE: Double slug type, hermetically sealed glass; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 230°C, 1/16" from the case for 10 seconds; POLARITY: Cathode indicated by polarity band; MOU

SUPERSOT-3

Latching PWM for Cycle-By-Cycle Current Limiting; Oscillator Frequency Guaranteed at 250 kHz; Low Startup and Operating Current; Trimmed Oscillator for Precise Frequency Control; Internally Trimmed Reference with Undervoltage Lockout; Undervoltage Lockout with Hysteresis; Automatic Feed Forward Compensation; High Current Totem Pole Output; Current Mode Operation to 500 kHz; Pb-Free Packages are Available

Low Output Noise Voltage; Programmable Output Voltage to 36 V; Voltage Reference Tolerance: +/- 0.4%, Typ @ 25°C (TL431B); Equivalent Full-Range Temperature Coefficient of 50 ppm/ °C Typical; Low Dynamic Output Impedance, 0.22 W Typical; Temperature Compensated for Operation over Full Rated Operating Temperature Range; Sink Current Capability of 1.0 mA to 100 mA; Pb-Free Packages are Available

Integrated Power Device • Power Device Thermally Protected • No External Current Shunt Required • 9 V to 18 V Input Range • 44 m Typical • Internal Charge Pump • Internal Undervoltage Lockout Circuit • Internal Overvoltage Clamp (MN1 and MN2 versions) • ESD Ratings: Human Body Model (HBM); 2000 V Machine Model (MM); 200 V • These Devices are Pb−Free and are RoHS Compliant

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Use the download button to access the TL431BVDG schematic symbol, PCB footprint, and 3D model.

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

Low Clamping Voltage; Small Body Outline Dimensions on SC88 Package:0.082 x 0.078 (2.10 mm x 1.25 mm); Low Body Height: 0.043 (1.10 mm); Standoff Voltage: 5.5 V; Low Leakage; Response Time is Typically < 1.0 ns; IEC6100042 Level 4 ESD Protection; These Devices are PbFree and are RoHS Compliant; AECQ101 Qualified and PPAP Capable for SZNUP4114; Meets UL 94 V-0; SZ prefix for automotive and other applications requiring unique site and control change requirements

Low Capacitance; Single Package Integration Design; Provides ESD Protection for JEDEC Standards JESD22; Protection for IEC61000-4-2 (Level 4); Ensures Data Line Speed and Integrity; Fewer Components and Less Board Space; Direct the Transient to Either Positive Side or to the Ground; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

SO-8FL, DFN5, 5 PIN

SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage Range - 3 V to 26 V; Standard Zener Breakdown Voltage Range - 5.6 V to 33 V; Peak Power - 24 or 40 Watts @ 1.0 ms (Unidirectional); ESD Rating of Class N (exceeding 16 kV) per the Human Body Model; Maximum Clamping Voltage @ Peak Pulse Current; Low Leakage < 5.0 µ A; Flammability Rating UL 94V-O Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosett

Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Peak Power Dissipation 225 Watt (8 X 20 µs); ESD Rating of Class 3 (>16 KV) per Human Body Model; Pb-Free Packages are Available; AECQ101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

Peak Power Dissipation 225 Watt (8 X 20 µs); ESD Rating of Class 3 (>16 KV) per Human Body Model; Pb-Free Packages are Available; AECQ101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

ON Semiconductor SVC236-TB-E Dual Common Cathode Varactor Diode, 14.44pF min, 5:1 Tuning Ratio, 16V, 3-Pin CP

Pb-Free Packages are Available; SC-74 Package Allows Four Separate Unidirectional Configurations; Peak Power – 350 Watts, 8 x 20 µS; ESD Rating of Class N (Exceeding 25 kV) per the Human Body Model; ESD Rating: IEC 61000–4–2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000–4–4 (EFT) 40 Amps (5/50 ns) IEC 61000–4–5 (lighting) 23 Amps (8/20 µ s); UL Flammability Rating of 94V–0

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Packages are Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

Miniature SOT-23 Surface Mount Package Saves Board Space; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN

Use the download button to access the SMA3107-TL-E schematic symbol, PCB footprint, and 3D model.

TVS Diode in Series with a Compensating Diode Offers < 5 pF Capacitance; ESD Protection Meeting IEC 61000–4–2, 4–4, 4–5; Peak Power Rating of 300 Watts, 8 x 20 µ s; Bi–Direction Protection Can Be Achieved By Using Two Devices; Flammability Rating UL 94V–0; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; Package designed for optimal automated

Small Body Outline Dimensions: 0.047” x 0.047” (1.20 mm x 1.20 mm); IEC61000−4−2 Level 4 ESD Protection; Low Clamping Voltage; Low Capacitance 0.5 pF Typical; Response Time is Typically < 1.0 ns; Low Leakage; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low Body Height: 0.020″ (0.5 mm); This is a Pb−Free Device

SE5532AD8G is a ON Semiconductor integrated circuit for PCB-level interconnects, replacement sourcing, or production BOMs. Key specs include 8 pins, -55°C to 125°C operating range, Small Outline Packages. From inquiry pricing, in stock sourcing, and.

Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25 °C); Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per

318-08, 3 PIN

318-08, 3 PIN

Use the download button to access the SBAS20LT1G schematic symbol, PCB footprint, and 3D model.

Low forward voltage (VF max=0.55V); Short Reverse Recovery Time (trr max=10ns); Low Switching Noise; Low Leakage Current and High Reliability Due to Reliable Planar Structure; Pb-Free and RoHS Compliance

Operating Voltage Range from 3.0 V to 7.0 V; Reference Voltage of 100 mVRMS = 0 dB; One Dedicated Summing Op Amp Per Channel and Two Extra Uncommitted Op Amps; 600 Ω Drive Capability; Single or Split Supply Operation; Wide Input/Output Swing Capability; 3000 V ESD Protection

HALOGEN FREE AND ROHS COMPLIANT, CASE 318E-04, TO-261, 4 PIN

Low Capacitance; Low Leakage Current < 1µA @ 4.3V; ESD Ratings: IEC61000-4-2, 8kV (Contact) Machine Model = Class C, 400V Human Body Model = Class 3B, 8kV; UDFN Package, 1.2 x 1.8 mm; Moisture Sensitivity Level 1; This is a PB-Free Device; This is a PB-Free Device