ON Semiconductor

Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Epoxy Meets UL94, VO @ 1/8"; 175 C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Low Forward Voltage; Ultrafast 25, 50 and 75 Nanosecond Recovery Time; Weight: 1.9 grams (approximately); Reverse Voltage to 600 Volts Mechanical Characteristics:; Low Leakage Current; AEC-Q101 Qualified and PPAP Capable; SUR8 Prefix for Automotive and Other Appl

Low Leakage Current; Marking: MUR405, MUR410, MUR415, MUR420, MUR440, MUR460; Case: Epoxy, Molded; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Cathode indicated by Polarity Band; High Temperature Glass Passivated Junction; Reverse Voltage to 600 Volts Mechanical Characteristics:; 175°C Operating Junction Temperature; Weight: 1.1 gra

LEAD FREE, PLASTIC, CASE 59-10, 2 PIN

LEAD FREE, PLASTIC, CASE 59-10, 2 PIN

Use the download button to access the MUR440G schematic symbol, PCB footprint, and 3D model.

20 mjoules Avalanche Energy Guaranteed; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Ultrafast 75 Nanosecond Recovery Time; 175°C Operating Junction Temperature; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction; Marking: MUR480E, MUR4100E; Polarity: Cathode Indicated by Polarity Band; Case: Epoxy, Molded; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Termin

Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 20 mjoules Avalanche Energy Guaranteed; High Temperature Glass Passivated Junction; Ultrafast 75 Nanosecond Recovery Time; Low Leakage Current; Marking: U880E, U8100E; Reverse Voltage to 1000 Volts Mechanical Characteristics:; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Low Forward Voltage; Lead Temperature for Soldering Purposes: 260°C Max

Low Leakage Specified @ 150 C Case Temperature; 175 C Operating Junction Temperature; High Voltage Capability to 600 Volts; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Current Derating Specified @ Both Case and Ambient Temperatures; Ultrafast 35 and 60 Nanosecond Recovery Time; Weight: 4.3 grams (approximately); Low Forward Drop; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction Mechanical Characteristics:; Lead Temp

Use the download button to access the MUR480EG schematic symbol, PCB footprint, and 3D model.

Low Leakage Current; Marking: MUR405, MUR410, MUR415, MUR420, MUR440, MUR460; Case: Epoxy, Molded; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Cathode indicated by Polarity Band; High Temperature Glass Passivated Junction; Reverse Voltage to 600 Volts Mechanical Characteristics:; 175°C Operating Junction Temperature; Weight: 1.1 gra

Low Leakage Current; Marking: MUR405, MUR410, MUR415, MUR420, MUR440, MUR460; Case: Epoxy, Molded; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Cathode indicated by Polarity Band; High Temperature Glass Passivated Junction; Reverse Voltage to 600 Volts Mechanical Characteristics:; 175°C Operating Junction Temperature; Weight: 1.1 gra

Low Leakage Current; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passivated Junction Mechanical Characteristics:; 175°C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage; Polarity: Cathode Indicated by Polarity Band; Ultrafast 25 Nanosecond Recovery Times; Marking: MUR220; Case: Epoxy, Molded; Weight: 0.4 gram (approximately)

Low Leakage Specified @ 150 C Case Temperature; 175 C Operating Junction Temperature; High Voltage Capability to 600 Volts; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Current Derating Specified @ Both Case and Ambient Temperatures; Ultrafast 35 and 60 Nanosecond Recovery Time; Weight: 4.3 grams (approximately); Low Forward Drop; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction Mechanical Characteristics:; Lead Temp

DIODE STANDARD 1000V 2A AXIAL Diode 1000 V 2A Through Hole Axial

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Common Anode Dual Rectifier (8.0 A per Leg or 16 A per Package); Ultrafast 35 Nanosecond Reverse Recovery Times; Epoxy Meets UL94, VO @ 1/8"; Low Leakage Specified @ 150 C Case Temperature; Current Derating @ Both Case and Ambient Temperatures; Marking: U1620R; High Temperature Glass Passivated Junction; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Complement to MUR1605CT Series of Common Cath

175 C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 Volts; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; Ultrafast 35 and 60 Nanosecond Recovery Times; Marking: U1610, U1615, U1620, U1640, U1660; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Case: Epoxy, Molded; L

175 C Operating Junction Temperature; Low Forward Drop; Ultrafast 35 and 60 Nanosecond Recovery Time; High Voltage Capability to 600 Volts; Low Leakage Specified @ 150 C Case Temperature; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Case: Epoxy, Molded; Current Derating Specified @ Both Case and Ambient Temperatures Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); AEC-Q101 Quali

175 C Operating Junction Temperature; High Temperature Glass Passivated Junction; Shipped 50 units per plastic tube; High Voltage Capability to 600 Volts; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; Ultrafast 35 and 60 Nanosecond Recovery Times; Marking: U1610, U1615, U1620, U1640, U1660; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (app

Marking: MUR105, MUR110, MUR115, MUR120, MUR130, MUR140, MUR160; Low Leakage Current; Reverse Voltage to 600 Volts Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage; Weight: 0.4 gram (approximately); High Temperature Glass Passivated Junction; Case: Epoxy, Molded; Polarity: Cathode Indicated by Polar

Marking: MUR105, MUR110, MUR115, MUR120, MUR130, MUR140, MUR160; Low Leakage Current; Reverse Voltage to 600 Volts Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage; Weight: 0.4 gram (approximately); High Temperature Glass Passivated Junction; Case: Epoxy, Molded; Polarity: Cathode Indicated by Polar

LEAD FREE, CASE 221A-09, 3 PIN

Marking: MUR105, MUR110, MUR115, MUR120, MUR130, MUR140, MUR160; Low Leakage Current; Reverse Voltage to 600 Volts Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage; Weight: 0.4 gram (approximately); High Temperature Glass Passivated Junction; Case: Epoxy, Molded; Polarity: Cathode Indicated by Polar

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

10 mjoules Avalanche Energy Guaranteed; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Ultrafast 75 Nanosecond Recovery Time; 175°C Operating Junction Temperature; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction; Reverse Voltage to 1000 Volts Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature

MUR140G from ON Semiconductor is a diode for rectification, protection, clamping, and power-management circuits. Key specifications include 0A, 400V, 2 pins, -65°C to 175°C, Axial Lead 5.20x2.70mm, 25.4x0.71mm Pkg, Lead len/dia package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The Axial Lead 5.20x2.70mm, 25.4x0.71mm Pkg, Lead len/dia format supports standard assembly and sourcing workflows.

Marking: MUR105, MUR110, MUR115, MUR120, MUR130, MUR140, MUR160; Low Leakage Current; Reverse Voltage to 600 Volts Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ultrafast 25, 50 and 75 Nanosecond Recovery Times; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage; Weight: 0.4 gram (approximately); High Temperature Glass Passivated Junction; Case: Epoxy, Molded; Polarity: Cathode Indicated by Polar

10 mjoules Avalanche Energy Guaranteed; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Ultrafast 75 Nanosecond Recovery Time; 175°C Operating Junction Temperature; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction; Reverse Voltage to 1000 Volts Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; Simplifies Circuit Design; Reduces Board Space

LEAD FREE, CASE 221A-09, 3 PIN

Dual NPN Transistors; SC-88 (SOT-363) Package; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; Simplifies Circuit Design; Reduces Board Space; Reduces Component Count

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

CASE 318-08, 3 PIN

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Power MOSFET 200V 6A 700 mOhm Single N-Channel DPAK

Available in 8 mm, 7-inch/3000 Unit Tape and Reel; Low VCE(sat), < 0.5 V; High hFE, 210-460; Moisture Sensitivity Level 1; ESD Protection: Human Body Model > 4000 V ESD Protection: Machine Model > 400 V; Pb-Free Package is Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

LEAD FREE, PLASTIC, CASE 221B-04, 2 PIN

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (Approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (Approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

Weight: 70 mg (Approximately); Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (Approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

Use the download button to access the MR856G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the MR854G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the MR856RLG schematic symbol, PCB footprint, and 3D model.