ON Semiconductor

6 LVTTL/LVCMOS Output Clock copies; Supply Operation VDD VDDO: 1.8 V0.2 V, 2.5 V 5% or 3.3 V 5% Core VDD 1.8 V equal or greater than VDD0: 1.8 V, 2.5 V, 3.3 V Nom. ; Crystal Oscillator Interface; Crystal Input Frequency Range: 3 MHz to 40 MHz; Clock Input Frequency Range: 3 MHz to 100 MHz; LVCMOS compatible Enable Inputs; 5 V Tolerant Enable Inputs; Tight Output to Output Skew: 80 ps Max; Synchronous Output Enable; Phase Noise Floor 160 dBc (at 1 MHz); Industrial Temp. Rang; 16 Pin TSSOP or SOIC Package; Pb

TSSOP-16

NB3N108KMNR4G, Clock Multiplexer HCSL HCSL, 32-Pin QFN

ON Semiconductor NB3N1200KMNG Differential Buffer, 64-Pin QFN

Period Jitter RMS of 5.0 ps; 1 LV-PECL Differential Output and 1 LVMOS/LVTTL single ended output; Selectable Clock Multiplier; Operating Range - 3.3V +/- 10%; Industrial Temperature Range -40C to +85C

Uses 25 MHz Fundamental Mode Parallel Resonant Crystal; Power Down Mode; 4 Low Skew HCSL or LVDS Outputs; OE Tri-States Outputs; Spread of -0.5%, -1.0%, -1.5% and No Spread; PCIe Gen 1, Gen 2, Gen 3 and Gen 4 Jitter Compliant; Low Phase Noise; Operating Range 3.3 V ±5%; Industrial Temperature Rangeˆ-40°C to +85°C; Functionally Compatible with IDT557-05, IDT5V41066, IDT5V41236; These are Pb-Free Devices

0.150 INCH, LEAD FREE, SOIC-8

Zero Delay PLL Clock Driver Single 100MHz to 133MHz 64-Pin QFN EP T/R

Typical Input Clock Frequency 100, 133, 166, or 400 MHz; 220 ps Typical Rise and Fall Times; 800 ps Typical Propagation Delay; Delta tpd 100 ps Maximum Propagation Delay Variation per Diff Pair; 0.1 ps Typical RMS Phase Jitter; Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V; Differential HCSL Output Levels

TSSOP-16

SOIC-16

Typical Maximum Frequency >2 GHz; 430 ps Typical Propagation Delay; Operating Range: VCC = 2.375 V to 3.8 V; VEE = -2.375 V to -3.8 V; GNDI = 0 V; Q Output will default LOW with Inputs Open or at GND; Pb-Free Packages are Available

ON Semiconductor NB2305AI1HDTG PLL Clock Buffer 8-Pin TSSOP

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, TJ = 150°C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

Five LVCMOS / LVTTL Outputs up to 200 MHz; Differential Inputs Accept LVPECL, LVDS, HCSL, SSTL, or LVCMOS/LVTTL; Crystal Interface; Crystal Input Frequency Range: 10 MHz to 50 MHz; Output Skew: 10 ps Typical; Additive RMS Phase Jitter @ 156.25 MHz, (12 kHz – 20 MHz): 0.03 ps (Typical); Synchronous Output Enable; Output Defined Level When Input is Floating; Multiple Power Supply Modes Available (See Datasheet); Two Separate Output Bank Power Supplies; Industrial Temperature Range: −40°C to 85°C

20mJ Avalanche Energy Guaranteed; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Ultrafast 75 Nanosecond Recovery Time; 175C Operating Junction Temperature; Low Forward Voltage; Low Leakage Current; High Temperature Glass Passivated Junction; Reverse Voltage to 800V; This is a Pb-Free Device; Case: Epoxy, Molded; Weight: 217 mg (Approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Pu

Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable; Weight: 95 mg (approximately); High Temperature Glass Passivated Junction; Polarity: Polarity Band Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Case: Epoxy, Molded; Low Forward Voltage Drop (1.20 Volts Max @ 2.0 A, TJ = 150?C) Mechanical Characteristics:; Rectangular Package for Automated Handling; Lead and Mounting Surface Temperature for Soldering Purposes:260°C Max. for 10 Sec

TO-236, 3 PIN

Marking: U3D, U3G, U3J; Highly Stable Oxide Passivated Junction; Weight: 217 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Polarity: Notch in Plastic Body Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Case: Epoxy, Molded; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Rectangular Package for Automated Hand

Marking: U3D, U3G, U3J; Highly Stable Oxide Passivated Junction; Weight: 217 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Polarity: Notch in Plastic Body Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Case: Epoxy, Molded; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Rectangular Package for Automated Hand

2.7 to 3.6 V power supply range ; Very low standby current - typical Isb as low as 1 uA; Very low operating current - as low as 3 mA; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 32 K x 8 bit organization ; Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication

2.7 to 3.6 V power supply range ; Very low standby current - typical Isb as low as 1 uA; Very low operating current - as low as 3 mA; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 32 K x 8 bit organization ; Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication

2.7 to 3.6 V power supply range; Very low standby current - as low as 1 uA; Very low operating current - as low as 3 mA; Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 8 K x 8 bit organization ; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication; High reliability - unlimited write cycles; RoHS Compliant Packages - Green

Marking: B36B; Highly Stable Oxide Passivated Junction; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Case: Epoxy, Molded; Rectangular Package for Automated Handling; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Package; Device Meets MSL 1 Requirements; SURS8 and SURS Prefixes for Automotive and Other Applicat

Use the download button to access the MVGSF1N03LT1G schematic symbol, PCB footprint, and 3D model.

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.74 Volts Max @ 2.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

Marking: U3D, U3G, U3J; Highly Stable Oxide Passivated Junction; Weight: 217 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Polarity: Notch in Plastic Body Indicates Cathode Lead; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Case: Epoxy, Molded; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Rectangular Package for Automated Hand

Small Compact Surface Mountable Package with J-Bend Leads; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Rectangular Package for Automated Handling; Case: Epoxy, Molded; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passi

Small Compact Surface Mountable Package with J-Bend Leads; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Rectangular Package for Automated Handling; Case: Epoxy, Molded; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passi

Small Compact Surface Mountable Package with J-Bend Leads; Marking: U2D; Polarity: Polarity Band Indicates Cathode Lead; Shipped in 12 mm Tape and Reel, 2500 units per reel; Weight: 95 mg (approximately); High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.77 Volts Max @ 2.0 A, TJ = 150?C) Mechanical Characteristics:; Rectangular Package for Automated Handling; Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounti

Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, T J = 150°C) Mechanical Characteristics:; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 un

Small Compact Surface Mountable Package with J-Bend Leads; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Rectangular Package for Automated Handling; Case: Epoxy, Molded; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passi

Ultrafast 30 ns Recovery Times; 175°C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 V; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight: 0.4 g (Approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; ESD Ratings: Machine Model = C (>400V), Human Body Model = 3B

Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Rectangular Package for Automated Handling; Case: Epoxy, Molded; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passivated Junction; These are PB-Free Packages; AEC-Q101 Qualif

Small Compact Surface Mountable Package with J-Bend Leads; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Rectangular Package for Automated Handling; Case: Epoxy, Molded; Weight: 95 mg (approximately); Polarity: Polarity Band Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; High Temperature Glass Passi

High Temperature Glass Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Electrically Isolated. No Isolation Hardware Required.; Case: Epoxy, Molded; Low Leakage Specified @ 150° C Case Temperature Mechanical Characteristics:; 150° C Operating Junction Temperature; Epoxy Meets UL94, VO @ 1/8"; Ultrafast 35 Nanosecond Recovery Times; Weight: 1.9 grams (approximately); Marking:

Weight: 0.4 gram (approximately); Marking: U320; Low Forward Voltage Drop; Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Leakage Mechanical Characteristics:; Ultrafast 35 Nanosecond Recovery Time; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; AEC-Q101 Qualified and PPAP Capable; SURD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

Popular TO-220 Package; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; High Voltage Capability to 400 Volts; Ultrafast 28 Nanosecond Recovery Time; Marking: UH840; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction; 175 C Operating Junction Temperature; Low Leakage Specified @ 150 C Case Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Lead

Low Leakage Mechanical Characteristics:; Low Forward Voltage Drop; Ultrafast 35 Nanosecond Recovery Time; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: U620T; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; AEC-Q101 Qualified and PPAP Capable; NRVU Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.77 Volts Max @ 2.0 A, TJ = 150°C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

Ultrafast 30 ns Recovery Times; 175°C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 V; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight: 0.4 g (Approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; ESD Ratings: Machine Model = C (>400V), Human Body Model = 3B

Low Leakage Mechanical Characteristics:; Low Forward Voltage Drop; Ultrafast 35 Nanosecond Recovery Time; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: U620T; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; AEC-Q101 Qualified and PPAP Capable; NRVU Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (1.05 Volts Max @ 1.0 A, TJ = 150°C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.66 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathod

Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Epoxy Meets UL94, VO @ 1/8"; 175 C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Low Forward Voltage; Ultrafast 25, 50 and 75 Nanosecond Recovery Time; Weight: 1.9 grams (approximately); Reverse Voltage to 600 Volts Mechanical Characteristics:; Low Leakage Current; AEC-Q101 Qualified and PPAP Capable; SUR8 Prefix for Automotive and Other Appl

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; High Temperature Glass Passivated Junction; Low Forward Voltage Drop (0.71 Volts Max @ 1.0 A, TJ = 150?C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 5000 uni

Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 20 mjoules Avalanche Energy Guaranteed; High Temperature Glass Passivated Junction; Ultrafast 75 Nanosecond Recovery Time; Low Leakage Current; Marking: U880E, U8100E; Popular TO-220 Package; Reverse Voltage to 1000 Volts Mechanical Characteristics:; Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits; Low Forward Voltage; Lead Temperature for Solde

175 C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 Volts; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; Ultrafast 35 and 60 Nanosecond Recovery Times; Marking: U1610, U1615, U1620, U1640, U1660; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Case: Epoxy, Molded; L