ON Semiconductor

Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA); Low Power CMOS Technology; More than 1,000,000 Program/Erase Cycles; 100 Year Data Retention; Industrial Temperature Range; 8-lead SOIC and TSSOP, WLCSP 4 and 5-ball, 8-pad UDFN and 5-lead TSOT-23 packages; Supports Standard and Fast I2C Protocol; 1.7 V to 5.5 V Supply Voltage Range; 16-Byte Page Write Buffer; Hardware Write Protection for Entire Memory; These Devices are Pb-Free, Halogen Free/BFR Free, and RoHS Compliant

EEPROM Memory IC 256Kbit I2C 1 MHz 500 ns 8-UDFN-EP (2x3)

DIP-4

LV8727-E is a ON Semiconductor integrated circuit for industrial electronics and embedded systems. It combines 36 pins, ZIP, -30°C to 85°C for reliable board-level integration. Quote-based sourcing supports stock checks and worldwide shipping.

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Use the download button to access the BC81725MTF schematic symbol, PCB footprint, and 3D model.

Low Forward Voltage - 0.35 Volts (Typ) @ IF = 10 mAdc; Extremely Fast Switching Speed; Device Marking: JV; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Q2: N-Channel Max rDS(on) = 1.8 mΩ at VGS = 10 V, ID = 30 A Max rDS(on) = 2.2 mΩ at VGS = 4.5 V, ID = 27 A ; Low inductance packaging shortens rise/fall times, resulting in lower switching losses ; Q1: N-Channel Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 13 A Max rDS(on) = 11 mΩ at VGS = 4.5 V, ID = 11 A; MOSFET integration enables optimum layout for lower circuit inductance and reduced switch node ringing ; RoHS Compliant

TSSOP-14

Operating Voltage Range: 2.0 to 6.0 V; Output Drive Capability: 10 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS, and TTL; Low Input Current: 1.0 mA; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Chip Complexity: 40 FETs or 10 Equivalent Gates; Pb-Free Packages are Available

Use the download button to access the LM311DG schematic symbol, PCB footprint, and 3D model.

Peak Blocking Voltage – 250 V, MOC303XM – 400 V, MOC304XM ; Simplifies Logic Control of 115 VAC power ; Zero Voltage Crossing ; dv/dt of 2000 V/µs Typical, 1000 V/µs Guaranteed ; Safety and Regulatory Approvals – UL1577, 4,170 VACRMS for 1 Minute – DIN EN/IEC60747-5-5

VQFN-32

NCP305LSQ25T1G, UNDERVOLT DETECT 2.5V NCP305LSQ25T1G, Reset Monitor 2.45V Ultra Low Supply Current 4-Pin SC-82AB

Use the download button to access the MMBT5087LT1G schematic symbol, PCB footprint, and 3D model.

NVMFS5C423NLT1G is a ON Semiconductor MOSFET (N-Channel) for load switching, power conversion, and signal-control stages. It combines -55°C to 175°C, 8 pins, and DFN-5 package, 8-pin layout, -55°C to 175°C operation for practical design qualification. From request-a-quote sourcing, FindMyChip supports stock checks and worldwide shipping.

VDROP=0.2V @ VIN=12V, IL=1A, VON/OFF=1.5 to 8V VDROP=0.3V @ VIN=5V, IL=1A, VON/OFF=1.5 to 8V ; VON/OFF Zener protection for ESD ruggedness >6KV Human Body Model ; High density cell design for extremely low on-resistance ; SuperSOT™-6 package design using copper lead frame for superior thermal and electrical capabilities

Zero Current Detector; Overvoltage Comparator Eliminates Runaway Output Voltage; Totem Pole Output with High State Clamp; Internal Startup Timer; Undervoltage Lockout with 6.0 V of Hysteresis; Low Startup and Operating Current; Trimmed 2% Internal Bandgap Reference; Supersedes Functionality of SG3561 and TDA4817 Simplified Block Diagram; One Quadrant Multiplier

SOIC-20

ON Semiconductor LB11600JV-TLM-E, BLDC Motor Controller, 14 V 30-Pin, SSOP

Superior CMR of 15,000 V/µs Minimum (HCPL4503M); Safety and Regulatory Approvals - UL1577, 5,000 VACRMS for 1 Minute - DIN EN/IEC60747-5-5; Dual-Channel: HCPL2530M, HCPL2531M; High speed –1 MBit/s; CTR Guaranteed 0°C to 70°C; No Base Connection for Improved Noise Immunity (HCPL4503M)

1N4148XTR from ON Semiconductor is a diode. Key specs include 2 pins. From inquiry pricing, buyers can request stock with worldwide shipping. Suitable for production sourcing and approved vendor list reviews.

SOIC-14

NECL Mode Operating Range: VCC= 0 V with VEE= -3.0 V to -5.5 V; PECL Mode Operating Range: VCC= 3.0 V to 5.5 V with VEE= 0 V ; Maximum Frequency > 3 GHz Typical; 220 ps Typical Propagation Delay; Open Input Default State; Safety Clamp on Inputs; Q Outputs Will Default LOW with Inputs Open or at VEE

225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING:

Ultra small MicroPak™ leadless package; Break before make enable circuitry; Power down high impedance control input; Minimal propagation delay through the switch; Overvoltage tolerance of control input to 7.0V; Space saving SC70 6-lead surface mount package; Zero bounce in flow through mode; TTL compatible control input; Typical 3ohm switch resistance @ 5.0V VCC

SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage Range - 3 V to 26 V; Standard Zener Breakdown Voltage Range - 5.6 V to 33 V; Peak Power - 24 or 40 Watts @ 1.0 ms (Unidirectional); ESD Rating of Class N (exceeding 16 kV) per the Human Body Model; Maximum Clamping Voltage @ Peak Pulse Current; Low Leakage < 5.0 µ A; Flammability Rating UL 94V-O Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosett

JEDEC JC42.4 Compliant Temperature Sensor; Temperature Range: -20°C to 125°C; DDR3 DIMM compliant SPD EEPROM; Supply Range: 3.3 V 10%; I2C /SMBus Interface; Schmitt triggers and noise suppression filters on SCL and SDA inputs; Low power CMOS technology; 2 x 3 x 0.75 mm TDFN Package; These Devices are Pb-Free and are RoHS Compliant

Use the download button to access the NTZD3152PT1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the NTZD5110NT1G schematic symbol, PCB footprint, and 3D model.

Obsolete - General Purpose Transistor

Extremely Low Minority Carrier Lifetime; Low Reverse Leakage; Very Low Capacitance; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Use the download button to access the NCV571SN10T1G schematic symbol, PCB footprint, and 3D model.

NCP303LSN22T1G from ON Semiconductor is a Integrated Circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 0A, 5 pins, -40°C to 125°C, SOT-23 package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The SOT-23 format supports standard assembly and sourcing workflows.

Guaranteed 2.7 V and 5.0 V Performance; Input common-mode voltage range extends to ground; Open drain output for Wired-OR applications; Low Quiescent Current: 60 A/channel TYP @ 5.0 V; Low Saturation Voltage 200 mV TYP @ 5.0 V; Propagation Delay 200 ns TYP @ 5.0 V

Guaranteed 300 mA Continuous Output Current; Low Dropout Voltage of 250 mV Typical at 300 mA; Input Voltage Range: 3.3 V to 13.5 V; User Adjustable Output Voltage; User Programmable Current Limit; Fault Output to Indicate Under-voltage, Current Limiting or Thermal Shutdown has Occurred; Fault Blanking: 3 ms; VOUT Withstands Battery Fault Voltages of up to 14 V; Soft-Start Prevents Current Surges; Stable with Ceramic Output Capacitor; ±1.5% Output Voltage Initial Accuracy; ±2.5% Accuracy Over Temperature; Th

Supervisory Circuits SUP WITH 8K I2C EEPROM

Leading Planar Technolgy for Low Gate Charge/Fast Switching; $.5 V Rated for Low Voltage Gate Drive; SOT-23 Surface Mount for Small Footprint (3x3mm); RoHS Compliant; AEC-Q101 Qualified and PPAP capable

MC14077B - Replacement for CD4077B Type; Double Diode Protection on All Inputs; Supply Voltage Range = 3.0 Vdc to 18 Vdc; MC14070B - Replacement for CD4030B and CD4070B Types; Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range; All Outputs Buffered; Pb-Free Packages are Available*

Use the download button to access the FSV2060L schematic symbol, PCB footprint, and 3D model.

Guardring for Stress Protection; Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25 C); 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics; Reel Options: MBR0520LT1 = 3,000 per 7" reel/8 mm tape. MBR0520LT3 = 10,000 per 13" reel/8 mm tape.; Device Marking: B2; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Lea

Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

Use the download button to access the NCP380LMUAJAATBG schematic symbol, PCB footprint, and 3D model.

P3, 2 PIN

Optimized PWM Output Stage: Filterless Capability; Efficiency up to 90% and Low 2.5mA Typical Quiescent Current; Large Output Power Capability: 1.4W with 8Ω Load and THD+N<1%; Wide Supply Voltage Range: 2.5-5.5V Operating Voltage; High Performance, THD+N of 0.03%@Vp=5V, RL=8Ω, Pout=100mW; Excellent PSRR (-65dB): No Need for Voltage Regulation; Surface Mounted Package 9-Pin Flip-Chip CSP (SnPb and Pb-Free); Fully Differential Design. Eliminates Two Input Coupling Capacitors; Very Fast Turn On/Off Times with

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit