ON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

TO-220F, 4 PIN

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

Guardring for Stress Protection; Optimized for Very Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO; Package Designed for Optimal Automated Board Assembly; ESD Rated Machine Model C; ESD Rated Human Body Model 3B; Device Meets MSL 1 Requirements; Pb-Free Packages are Available

DSN-2

CASE 152AC-01, DSN2, 2 PIN

CASE 29-11, TO-226, 3 PIN

LSOP-8

CASE 29, 3 PIN

Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc; Extremely Fast Switching Speed; Pb-Free Package is Available; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Use the download button to access the BC81740MTF schematic symbol, PCB footprint, and 3D model.

POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available

SOD-323FL, SC-90, 2 PIN

CHIPFET-8

SC-88, SC-70, SOT-363, 6 PIN

High Slew Rate: 13 V/µs; Large Output Voltage Swing: -14.7 V to +14 V (with +/-15 V Supplies); Excellent Gain Margin: 12 dB; Wide Bandwidth: 4.5 MHz; Fast Settling Time: 1.1 µs to 0.1%; Low Input Offset Voltage: 3.0 mV Maximum (A Suffix); Output Short Circuit Protection; Large Capacitance Drive Capability: 0 pF to 10,000 pF; Low Total Harmonic Distortion: 0.02%; Excellent Phase Margin: 60° Wide Input Common Mode Voltage Range: Includes Ground (VEE); Wide Single Supply Operation: 3.0 V to 44 V; NCV33072 = Au

Very Low Forward Voltage Drop - 480 mV @ 100 mA; Low Reverse Current - 0.2 uA @ 25 V VR; 250 mA of Continuous Forward Current; Power Dissipation of 200 mW with Minimum Trace; Very High Switching Speed; Low Capacitance - CT = 4 pF; This is a Pb-Free Device; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

Bridge Rectifiers 4A Bridge Rectifier

Obsolete - NPN Bipolar Darlington Transistor

SUPERSOT-6

Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

CASE 29-11, TO-226, 3 PIN

KA319D is a ON Semiconductor integrated circuit for automotive, industrial, and embedded control designs. It uses a 14-pin SOIC-14 N package with protected driver functions. From RFQ pricing with stock checks and worldwide shipping.

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING:

Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

LVCMOS Compatible; ESD Performance: Human Body Model >1500V; Machine Model >200V; 5 V Tolerant Inputs/Outputs; LVTTL Compatible; 24mA Output Sink Capability; Designed for 2.3 to 5.5 V VCC Operation; Latchup Performance Exceeds 500mA; Near Zero Static Supply Current (10mA) Substantially Reduces System Power Requirements; Wired-OR, Wired-AND; Output Can Be Set Externally Without Affecting Speed or Device; Pb-Free Packages are Available*

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

Trench Schottky Technology; Ultra-Low Forward Voltage Drop; Very Low Profile: Typical Height of 1.1 mm; Green Molding Compound as per IEC61249 Standard; Low Thermal Resistance; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; RoHS Compliant

Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Replacement for NC7WZ86,TC7WZ86

ON Semiconductor PCA9306USG is a dual bidirectional I2C bus voltage level translator in an 8-pin small outline package. Key specs include 2-bit open-drain level shifting between 1.0V to 5.5V domains, 400kHz I2C Fast Mode, and 3.3ns propagation delay. Available in stock worldwide with fast shipping for mixed-voltage system designs.

UL1577, 4,170 VACRMS for 1 Minute; • Excellent IFT Stability - IR Emitting Diode Has Low Degradation• Peak Blocking Voltage; 400 V - MOC302XM• Safety and Regulatory Approvals; DIN EN/IEC60747-5-5); 250 V - MOC301XM

Sensor-less BLDC fan motor driver,SSOP30 LB11696V-TLM-E, Motor Driver, Brushless Motor Driver, 22kHz 4.5 → 5.5 V, 8 → 17 V, 30-Pin SSOP 30

SOIC-20

SO-8

Very Low Noise at 39 uVrms without a Bypass Capacitor; Fast enable response (20 usec); High Ripple Rejection of 70 dB at 1 kHz; Can use decoupling capacitors with ESR ranging from milliohms to 3 ohms.

PLASTIC PACKAGE-2

Package type: sidelooker ; Package material: clear epoxy; Matched photosensor: QSE113; Medium wide emission angle, 50<font face="Courier New" °; Chip material = GaAs; High output power; Gray stripe on the top side; l = 940 nm

Fully GSM Compliant; 100% compatible with ISO 7816-3, EMV and GIE-CB standards; Wide battery supply voltage range : 2.7 < Vcc < 5.5V; Programmable CRD_VCC supply handles 1.8V, 3V or 5V card operation.; Programmable rise and fall card clock slopes; Programmable card clock divider; Built-in Chip Select logic allows parallel coupling operation; ESD protection on card pins ( 8 kV, Human Body Model ); Supports up to 40 MHz input Clock ; Built-in programmable CRD_CLK stop function handles Run or Low state.; Progr

SOIC-14

RON < 4 Ω Typical; Less Than 0.25 ns-Max Delay Through Switch; Nearly Zero Standby Current; No Circuit Bounce; Control Inputs are TTL/CMOS Compatible; Pin-For-Pin Compatible With QS3257, FST3257, CBT3257; All Popular Packages: QSOP-16, TSSOP-16, SOIC-16; Pb-Free Packages are Available

In Compliance With the Requirements of JEDEC Standard No. 7A; Injection Current Cross-Coupling Less than 1mV/mA (See Figure 9); Pin Compatible to HC405X and MC1405XB Devices; Chip Complexity: 154 FETs or 36 Equivalent Gates; Power Supply Range (VCC - GND) = 2.0 to 6.0 V; Pb-Free Packages are Available*

Overvoltage Tolerant inputs facilitate 5V to 3V translation; Space saving US8 surface mount package; MicroPak™ Pb-Free leadless package; Broad VCC Operating Range; 1.65V to 5.5V; High Output Drive; ±24 mA at 3V VCC; Ultra High Speed; tPD 3.7 ns Typ into 50 pF at 5V VCC; Power down high impedance inputs/output; Patented noise/EMI reduction circuitry implemented

±24 mA output drive (VCC = 3.0V); Implements patented noise/EMI reduction circuitry; 2.3V-3.6V VCC specifications provided; 5V tolerant inputs and outputs; ESD performance: Human body model > 2000V Machine model > 200V; Latch-up performance exceeds JEDEC 78 conditions; Power down high impedance inputs and outputs; 6.0ns tPD max (VCC = 3.3V), 10 µA ICC max; Leadless DQFN Package

Transistor Output Optocouplers Optocoupler SM-DIP6 Phototrans No Base

Use the download button to access the KSA1015YTA schematic symbol, PCB footprint, and 3D model.