NCP303LSN22T1G ON Semiconductor Integrated Circuit (SOT23 (5-Pin)) In Stock
NCP303LSN22T1G from ON Semiconductor is a Integrated Circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 0A, 5 pins, -40°C to 125°C, SOT-23 package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The SOT-23 format supports standard assembly and sourcing workflows.
- Manufacturer
- ON Semiconductor
- Package
- SOT23 (5-Pin)
- Pin Count
- 5
- Lifecycle
- OBSOLETE
- Datasheet
- NCP303LSN22T1G Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0A rating/value supports defined circuit selection for this Integrated Circuit
- 5 pins specification provides an additional quantitative design check
- SOT-23 package or footprint supports standard PCB assembly and replacement planning
- 5-pin configuration helps confirm footprint, routing, and connector compatibility
- -40°C to 125°C operating range suits controlled industrial or commercial environments
- ON Semiconductor sourcing identity supports BOM traceability and authorized-equivalent review
Applications
NCP303LSN22T1G is commonly considered for industrial controls, embedded electronics, maintenance sourcing, and production assemblies where designers need a Integrated Circuit with 0A, 5 pins, -40°C to 125°C, SOT-23 package/footprint. It is suitable for OEM BOM refresh, maintenance sourcing, prototype builds, and production assemblies that require traceable component selection.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | 483 |
| YTEOL | 0 |
| Additional Feature | BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N |
| Adjustable Threshold | NO |
| Analog IC - Other Type | VOLTAGE DETECTOR |
| JESD-30 Code | R-PDSO-G5 |
| JESD-609 Code | e3 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSOP5/6,.11,37 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max (Isup) | 0.0013mA |
| Supply Voltage-Max (Vsup) | 10V |
| Supply Voltage-Min (Vsup) | 0.8V |
| Supply Voltage-Nom (Vsup) | 1.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.95mm |
| Terminal Position | DUAL |
| Threshold Voltage-Nom | +2.2V |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | SOT23 (5-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for NCP303LSN22T1G when 0A is required?
NCP303LSN22T1G is a Integrated Circuit from ON Semiconductor for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. The 0A specification helps engineers confirm electrical margin before adding it to a production BOM.
How should engineers check the footprint before placing NCP303LSN22T1G on a PCB?
Review the SOT-23 package information together with 5 pins before layout release. That check reduces substitution risk when matching land pattern, assembly process, and approved vendor data.
When would procurement choose NCP303LSN22T1G instead of a nearby alternate?
Buyers should keep NCP303LSN22T1G when the approved design depends on 5 pins and SOT-23 compatibility. Alternate reviews should verify at least 1 matching electrical rating and footprint constraint.
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About ON Semiconductor
ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.
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