ON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

Diode, Fairchild, SMBJ5V0CA Fairchild SMBJ5V0CA, Bi-Directional TVS Diode, 9.2V, 600W, 2-Pin DO-214AA

LEAD FREE, PLASTIC, CASE 502-01, 2 PIN

SOP-14

Buffer

Matches Performance of LCX Operated at 3.3V VCC ; Broad VCC Operating Range: 1.65V to 5.5V ; Unbuffered for Crystal Oscillator and Analog Applications ; Balanced Output Drive: ±16mA at 4.5V VCC ; Low Quiescent Power: ICC<2µA, VCC=5.5V, TA=25°C ; Ultra-Small MicroPak™ Packages ; Space-Saving SOT23 and SC70 Packages

Low gate charge ; RoHS compliant ; Fast Switching ; Max rDS(on) = 24mΩ at VGS = 10V, ID = 9A ; Max rDS(on) = 30mΩat VGS = 4.5V, ID = 7A ; High performance trench technology for extremely low rDS(on)

100% avalanche tested; RDS(on) = 430mΩ (Typ.)@ VGS = 10V, ID = 3.1A; RoHS compliant; Low gate charge (Typ. 12nC); Low Crss (Typ. 8pF); Improved dv/dt capability; ESD improved capability

DPAK-3/2

CASE 59-10, 2 PIN

SOT-28FL, 8 PIN

• Replaced by NCN5121 • 9600 baud KNX Communication Speed • Supervision of KNX Bus Voltage • Supports Bus Current Consumption up to 13 and 26 mA • Selectable KNX Bus Current (0.5 mA/ms and 1.0 mA/ms) • High Efficient DC−DC Converters ♦ 3.3 V Fixed ♦ 3.3 V to 21 V Selectable • Control and Monitoring of Power Regulators • Linear 20 V Regulator • Prepared for Sleep Mode • Buffering of Sent Data Frames (Extended Frames Supported) • Selectable UART or SPI Interface to Host Controller • Selectable UA

Chip Complexity: 56 FETs or 14 Equivalent Gates; Outputs Directly Interface to CMOS, NMOS, and TTL; Low Input Current: 1 mA; Operating Voltage Range: 2 to 6 V; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Output Drive Capability: 10 LSTTL Loads; Pb-Free Packages are Available

Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

Low quiescent current: 20 µA maximum (74 Series); Output drive capability: 10 LS-TTL loads; Typical propagation delay: 9 ns; Wide operating voltage range: 2-6V; Low input current: 1 µA maximum

These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; Small Footprint package

These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

SC70 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Standard Zener Breakdown Voltage Range 27 V; Peak Power 40 W @ 1.0 ms (Unidirectional); ESD Rating Class 3B (>16 kV) per the Human Body Model; ESD Rating Class C (>400 V) per the Machine Model; Low Leakage < 5.0 uA; Flammability Rating UL 94 V0; This is a PbFree Device; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requ

Supports live insertion/withdrawal (Note 1); Latch-up performance exceeds 500 mA; Power down high impedance inputs and outputs; 6.5 ns tPD max (VCC = 3.3V), 10 µA ICC max; 5V tolerant inputs and outputs; ESD performance: Human body model > 2000V Machine model > 200V; 2.3V to 3.6V VCC specifications provided; ±24 mA output drive (VCC = 3.0V); Implements patented noise/EMI reduction circuitry; Leadless DQFN Pb-Free package

Use the download button to access the MMBT2222AM3T5G schematic symbol, PCB footprint, and 3D model.

SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage Range - 3 V to 26 V; Standard Zener Breakdown Voltage Range - 5.6 V to 33 V; Peak Power - 24 or 40 Watts @ 1.0 ms (Unidirectional); ESD Rating of Class N (exceeding 16 kV) per the Human Body Model; Maximum Clamping Voltage @ Peak Pulse Current; Low Leakage < 5.0 µ A; Flammability Rating UL 94V-O Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosett

SC70 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Standard Zener Breakdown Voltage Range 27 V; Peak Power 40 W @ 1.0 ms (Unidirectional); ESD Rating Class 3B (>16 kV) per the Human Body Model; ESD Rating Class C (>400 V) per the Machine Model; Low Leakage < 5.0 uA; Flammability Rating UL 94 V0; This is a PbFree Device; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requ

ON Semiconductor SZMMBZ27VCLT1G is a tvs diode (bi-directional) for rectification, clamping, reverse-polarity protection, and switching circuits. Key specs include 3 pins, -55 to 150 °C, 3 PIN, 9 W, with SOT-23 (TO-236) 3 LEAD packaging. Use it for power rectifiers, clamp circuits, reverse-polarity protection, flyback paths, and compact switching boards with RFQ pricing, inquiry stock support, and worldwide shipping.

IOFF Specification Guarantees High Impedance When VCC = 0V; 5V Tolerant - Interface Capability With 5V TTL Logic; Near Zero Static Supply Current in All Three Logic States (10µA) Substantially Reduces System Power Requirements; Designed for 2.3 to 3.6V VCC Operation; ESD Performance: Human Body Model >2000V; Machine Model >200V; Latchup Performance Exceeds 500mA; Supports Live Insertion and Withdrawal; 24mA Balanced Output Sink and Source Capability; LVTTL Compatible; LVCMOS Compatible; Pb-Free Packages are

Supports live insertion/withdrawal (Note 1); Latch-up performance exceeds 500 mA; Power down high impedance inputs and outputs; 6.5 ns tPD max (VCC = 3.3V), 10 µA ICC max; 5V tolerant inputs and outputs; ESD performance: Human body model > 2000V Machine model > 200V; 2.3V to 3.6V VCC specifications provided; ±24 mA output drive (VCC = 3.0V); Implements patented noise/EMI reduction circuitry; Leadless DQFN Pb-Free package

12ns / 9ns Typical Rise/Fall Times with 1nF Load ; Dual Inverting + Enable (FAN3226) ; Four Versions of Dual Independent Drivers: ; Typical Propagation Delay Under 20ns Matched within 1ns to the Other Channel ; 2.4A Sink / 1.6A Source at VOUT = 6V ; 3A Peak Sink/Source at VDD = 12V ; Industry-Standard Pinouts ; MillerDrive™ Technology ; Dual-Inputs in Two Pin-Out Configurations: ￭ Compatible with FAN3225x (FAN3228) ￭ Compatible with TPS2814D (FAN3229) ; 4.5 to 18V Operating Range ; Dual Non-Inverting +

Use the download button to access the BCW66GLT1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the BCW66GLT3G schematic symbol, PCB footprint, and 3D model.

0.9V to 3.6V VCC Supply Ooperation ; ±18mA at 2.30V VCC ; 6.0ns Typical for 1.1V to 1.3V VCC ; Uses Proprietary Quiet Series™ Noise/EMI Reduction Circuitry ; 1.8ns Typical for 2.3V to 2.7V VCC ; ±24mA at 3.00V VCC ; ±4mA at 1.4V VCC ; ±6mA at 1.65V VCC ; 3.6V Over-Voltage Tolerant I/O's at VCC from 0.9V to 3.6V ; High Static Drive (IOH/IOL) ; 2.0ns Typical for 1.65V to 1.95V VCC ; 1.5ns Typical for 2.7V to 3.6V VCC ; Ultra small MicroPak™ leadfree package ; ±0.1mA at 0.9V VCC ; Power-Off High-Impedance Inpu

Adaptive Synchronous Rectification Control with Dual Edge Tracking ; Closed Loop Soft-Start for Monotonic Rising Output; VDD Under-Voltage Lockout (UVLO); Secondary Side PFM Controller for LLC Resonant Converter with Synchronous Rectifier Control; Charge Current Control for Better Transient Response and Easy Feedback Loop Design; Protection Functions with Auto-Restart - Over-Current Protection (OCP) - Output Short Protection (OSP) - NON Zero-Voltage Switching Prevention (NZS) by Compensation Cutback (Freque

POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available

Fast switching for increased circuit efficiency; SC-88 Small Outline (2x2 mm) for Maximum Circuit Board Utilization, Same as SC-70-6; Leading Trench Technology for Low RDS(on) Extending Battery Life

ON Semiconductor NCP5501DT50RKG is a integrated circuit for industrial, embedded, repair, and production electronic designs. Key specs include 3 pins, -40 to 85 °C, 6.2 A, 0.7 V, with DPAK (SINGLE GAUGE) TO-252 packaging. Use it for industrial control, embedded systems, repair sourcing, prototyping, and production builds with RFQ pricing, inquiry stock support, and worldwide shipping.

ON Semiconductor NCP5501DT33G is a integrated circuit for industrial, embedded, repair, and production electronic designs. Key specs include 3 pins, -40 to 85 °C, 500 mA, 1.25 to 5 V, with DPAK (SINGLE GAUGE) TO-252 packaging. Use it for industrial control, embedded systems, repair sourcing, prototyping, and production builds with RFQ pricing, inquiry stock support, and worldwide shipping.

350 W Peak Power Dissipation per Line (8/20 µs Waveform); Low Reverse Leakage Current (< 100 nA); 30 pF Overall Capacitance with Diode Capacitance Matching; Flammability Rating UL 94 V−0; IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4 − IEC 61000−4−4 (EFT): 50 A – 5/50 ns − IEC 61000−4−5 (Lightning) 8.0 A (8/20 µs); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free an

FDLL4148X is a ON Semiconductor Diode for protection, switching, and rectification circuits. Key specs include 100V, 0.3A, and Other integration. From RFQ pricing in stock for worldwide shipping.

Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

CASE 29-11, TO-226, 3 PIN

Internal Short Circuit Current Limiting; Internal Thermal Overload Protection; Output Current in Excess of 500 mA; Output Transistor Safe-Area Compensation; Output Adjustable between 1.2 V and 37 V; Floating Operation for High Voltage Applications; Eliminates Stocking Many Fixed Voltages; Pb-Free Packages are Available; NCV Prefix for Automotive and Other Applications Requiring Site Control Changes

MMBT4126LT3G is a PNP general-purpose transistor by ON Semiconductor in a compact SOT-23 (3-pin) package. Key specs: VCE 25 V, IC 200 mA, hFE min 60. Available from stock worldwide with competitive pricing.

Greater than 400Mbs data rate; 3.3V power supply operation; Meets or exceeds the TIA/EIA-644 LVDS standard; 0.4ns maximum pulse skew; Power-Off over voltage tolerant input and output; Fail safe protection for open-circuit and non-driven, shorted or terminated conditions; Bus pin ESD (HBM) protection exceeds 10kV; High impedance output at VCC < 1.5V; 2.5ns maximum propagation delay; 5-Lead SOT23 package saves space

Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs; LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Replacement for NC7WZ08; Chip Complexity: FET = 124

High Voltage: BC556 VCEO= -65V; Low Noise: BC559,BC560; Complement to BC546...BC550Switching and Amplifier