ON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

Output Drive Capability: 15 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS, and TTL; Operating Voltage Range: 4.5 to 5.5 V; Low Input Current: 1.0 uA; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Chip Complexity: 328 FETs or 82 Equivalent Gates

Output Drive Capability: 15 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS, and TTL; Operating Voltage Range: 4.5 to 5.5 V; Low Input Current: 1.0 uA; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Chip Complexity: 328 FETs or 82 Equivalent Gates

Use of P-Channel MOSFETs at output stage enables output voltage swing close to the supply rail (rail-to-rail output); DIN EN/IEC 60747-5-5,1,414 V (peak) workinginsulation voltage, 8000 V (peak) transient isolationvoltage ratings; User configurable: inverting, non-inverting, auto-reset,auto-shutdown; 2.5 A peak output current driving capability for most 1200 V/150A IGBT; 35 kV / μs Minimum Common Mode Rejection (VCM = 1500 VPK); Wide supply voltage range from 15V to 30V; High Speed; Desaturation detection;

TSSOP-14

Use the download button to access the BC847BTT1G schematic symbol, PCB footprint, and 3D model.

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

Power down protection is provided on all inputs; Pin and function compatible with 74HC123A; High Speed: tPD = 8.1 ns (typ) at TA = 25°C; Low Power Dissipation:ICC = 4 µA (Max) at TA = 25°C; Active State: ICC = 600 µA (Max) at TA = 25°C; High Noise Immunity: VNIH = VNIL = 28% VCC (min)

3, 4 LED Current Sinks with Tight Matching; 32 Dimming Levels; Low Dropout Driver 75 mV at 20 mA; No Switching Noise; Shutdown Current less than 1 µA; 25 mA Max LED Current per Channel; Dimming via 1-wire EZDimTM Interface; Thermal Shutdown Protection

Low Thermal Resistance; Very Low Profile: Typical Height of 1.1 mm; Qualified with Reflow (J-STD-020) and Solder Temperature 260°C Classification; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; RoHS Compliant; Ultra Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard

Typical hysteresis voltage: 0.9V at VCC = 4.5V; Low quiescent current: 20 µA maximum (74HC Series); Wide power supply range: 2-6V; Low input current: 1 µA maximum; Fanout of 10 LS-TTL loads; Typical propagation delay: 13 ns

Operating Voltage Range: 2 to 6 V; Outputs Directly Interface to CMOS, NMOS, and TTL; Low Input Current: 1 mA; Output Drive Capability: 15 LSTTL Loads; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Chip Complexity: 308 FETs or 77 Equivalent Gates; Pb-Free Packages are Available

MC14553BCP is a ON Semiconductor integrated circuit for industrial and embedded electronics. It provides 16 pins, -55°C to 125°C, Dual-In-Line Packages. From RFQ pricing, in-stock sourcing supports worldwide shipping.

Supports Standard, Fast and Fast-Plus I2C Protocol; 1.8 V to 5.5 V Supply Voltage Range; 64-Byte Page Write Buffer; Hardware Write Protection for Entire Memory; Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA); Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; Industrial Temperature Range; 8-lead SOIC and TSSOP and 8-pad UDFN packages; This Device is Pb-Free, Halogen Free/BFR Free and RoHS Compliant

Low Crosstalk Between Switches; Analog Power Supply Range (VCC - VEE) = 2.0 to 12.0 V; Chip Complexity:VHC4051 - 184 FETs or 46 Equivalent Gates; VHC4052 - 168 FETs or 42 Equivalent Gates; VHC4053 - 156 FETs or 39 Equivalent Gates; Diode Protection on All Inputs/Outputs; Improved Linearity and Lower on Resistance Than Metal-Gate Counterparts; In Compliance With the Requirements of JEDEC Standard No. 7A; Fast Switching and Propagation Speeds; Digital (Control) Power Supply Range (VCC - GND) = 2.0 to 6.0 V; L

Use the download button to access the LV8712T-TLM-H schematic symbol, PCB footprint, and 3D model.

Low Crosstalk Between Switches; Fast Switching and Propagation Speeds; Chip Complexity: HC4051A - 184 FETs or 46 Equivalent Gates HC4052A - 168 FETs or 42 Equivalent Gates HC4053A - 156 FETs or 39 Equivalent Gates; Analog Power Supply Range (VCC - VEE ) = 2.0 to 12.0 V; In Compliance With the Requirements of JEDEC Standard No. 7A; Digital (Control) Power Supply Range (VCC - GND) = 2.0 to 6.0 V; Diode Protection on All Inputs/Outputs; Improved Linearity and Lower ON Resistance Than Metal-Gate Counterparts; L

SMA, 2 PIN

Internal Short Circuit Current Limiting; Internal Thermal Overload Protection; Output Current in Excess of 500 mA; Output Transistor Safe-Area Compensation; Output Adjustable between 1.2 V and 37 V; Floating Operation for High Voltage Applications; Eliminates Stocking Many Fixed Voltages; Pb-Free Packages are Available; NCV Prefix for Automotive and Other Applications Requiring Site Control Changes

4.40 MM, MO-153AB, TSSOP-14

Use the download button to access the FDBL0240N100 schematic symbol, PCB footprint, and 3D model.

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

HVSON, SOLCC8,.08,20

Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other

Standard Zener Breakdown Voltage Range - 2.4 V to 18 V; Steady State Power Rating of 500 mW; Small Body Outline Dimensions: 0.047 x 0.032 (1.20 mm x 0.80 mm); Low Body Height: 0.028 (0.7 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; Tight Tolerance VZ; These are PbFree Devices; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

SMAF, 2 PIN

Use the download button to access the 74ACT04SC schematic symbol, PCB footprint, and 3D model.

SMAF, 2 PIN

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

Excellent Line and Load Regulation; Low Quiescent Current of 1.1 µA Typical; Maximum Operating Voltage of 12 V; Low Output Voltage Option; High Accuracy Output Voltage of 2.5%; Industrial Temperature Range of -40?C to 85?C; Two Surface Mount Packages (SOT-89, 3 Pin, or SOT-23, 5 Pin); Pb-Free Packages are Available

Minimal propagation delay through the switch; 4ohm switch connection between two ports; Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA); Zero bounce in flow-through mode; Voltage level shifting; Low lCC; Control inputs compatible with TTL level

SOIC-14

SOIC-14

CASE 29-11, TO-92, TO-226, 3 PIN

FPF2105 is a switch from ON Semiconductor for electronic assembly and maintenance. It provides 5 pins in SOT23 (5-Pin) format for repeatable production sourcing. From $0.00 in stock worldwide shipping.

LP2951 also has Output Programmable from 1.25 V to 29 V; Requires Only a 1.0 mF Output Capacitor for Stability; Low Input-to-Output Voltage Differential of 50 mV at 100 mA and 380 mV at 100 mA; Extremely Tight Line and Load Regulation; Low Quiescent Bias Current of 75 mA; 5.0 V, 3.3 V or 3.0 V +/- 0.5% Allows Use as a Regulator or Reference; LP2951 also has Error(bar) Output Signals an Out of Regulation Condition; Internal Current and Thermal Limiting; LP2951 also has Logic Level Shutdown Input; Pb-Free Pac

LP2951 also has Output Programmable from 1.25 V to 29 V; Requires Only a 1.0 mF Output Capacitor for Stability; Low Input-to-Output Voltage Differential of 50 mV at 100 mA and 380 mV at 100 mA; Extremely Tight Line and Load Regulation; Low Quiescent Bias Current of 75 mA; 5.0 V, 3.3 V or 3.0 V +/- 0.5% Allows Use as a Regulator or Reference; LP2951 also has Error(bar) Output Signals an Out of Regulation Condition; Internal Current and Thermal Limiting; LP2951 also has Logic Level Shutdown Input; Pb-Free Pac

Low Quiescent Current (125 mA); Internal Current and Thermal Limiting; Low Input-to-Output Voltage Differential of 25 mV at IO = 10mA, and 260 mV at IO = 300 mA; Extremely Tight Line and Load Regulation; Stable with Output Capacitance of only 0.33 mF for 2.5 V Output Voltage

Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible – Interface Capability with 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Current Drive Capability is 24 mA at the Outputs; Chip Complexity: FETs = 94; Pb-Free Package is Available

MBRB2060CTG is a ON Semiconductor diode component for diode designs. It supports 2 pins in a supplier-specified package. Request inquiry pricing with worldwide shipping support for production or replacement sourcing.

Low Forward Voltage: 0.64 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 20 A Total (10 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; AEC-Q101 Qua

Package Designed for Power Surface Mount Applications; Shipped 50 units per plastic tube; Epoxy Meets UL94, VO at 1/8"; Marking: B20100; Weight: 1.7 grams (approximately); Center-Tap Configuration; Similar in Size to Industry Standard TO-220 Package Mechanical Characteristics:; Guaranteed Reverse Avalanche; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Low Forward Voltage;

Epoxy Meets UL94, VO at 1/8"; 100 C Operating Junction Temperature; Case: Epoxy, Molded; Guardring for Stress Protection; Short Heat Sink Tab Manufactured Not Sheared!; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Shipped 50 units per plastic tube; Available in 24 mm Tape and Reel, 800 units per 13" reel by adding a "T4" suffix to the part number; Low Forward Voltage; Weight: 1.7 grams (approximately); Lead and Mounting Surface Temperature for Soldering Purpos

1N456ATR is a ON Semiconductor diode for electronic manufacturing and maintenance programs. Key specs include 30V, 500mA, and Diodes, Axial Diameter Horizontal Mounting. From inquiry pricing, it supports worldwide shipping for production builds.

1N456A is a ON Semiconductor diode for electronic manufacturing and maintenance programs. Key specs include 30 V, 500 mA, and standard package. From inquiry pricing, it supports worldwide shipping for production builds.

MOC3061MX is a ON Semiconductor integrated circuit component for integrated circuit designs. It supports 600V in a Dual-In-Line Packages package. Request inquiry pricing with worldwide shipping support for production or replacement sourcing.

MM74HCT08M is a ON Semiconductor integrated Circuit for embedded electronics and industrial control designs. Key specs include 751A, 50 pF, and IC package. From inquiry pricing, it supports worldwide shipping for production builds.

SOIC-8

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA