ON Semiconductor

5 X 3.30 MM, ROHS COMPLIANT, POWER, 12 PIN

Fan-out of 8 over -40°C to +85°C; Superior CMR . 50 kV/µs at 2,000V peak; Strobable output (single channel devices); Logic gate output; Wired OR-open collector; Safety and regulatory approvals - UL1577 - DIN/EN IEC60747-5-2 (pending approval); Very high speed . 10 MBit/s; Compact SO8 package (except FOD260L . 8-pin DIP)

Single-chip M-Bus transceiver; UART communication speeds up to 38400 baud; Integrated 3.3 V VDD LDO regulator with extended peak current capability of 15 mA; Supports powering slave device from the bus or from external power supply; Adjustable I/O levels; Adjustable constant current sink up to 2 or 6 unit loads depending on the package; Low bus voltage operation; Extended current budget for external circuits: at least 0.88 mA; Polarity independent; Power-fail function; Fast startup - no external transistor

Single-chip M-Bus transceiver; UART communication speeds up to 38400 baud; Integrated 3.3 V VDD LDO regulator with extended peak current capability of 15 mA; Supports powering slave device from the bus or from external power supply; Adjustable I/O levels; Adjustable constant current sink up to 2 or 6 unit loads depending on the package; Low bus voltage operation; Extended current budget for external circuits: at least 0.88 mA; Polarity independent; Power-fail function; Fast startup - no external transistor

1/1 Transceiver Half M-Bus 20-QFN (4x4)

Use the download button to access the MM3Z5V6T1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the MM3Z3V0T1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the MC14028BDG schematic symbol, PCB footprint, and 3D model.

Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

3.3 V and 5.0 V, 2.0% Output Options; Very Low Dropout Voltage; Protections: +60 V Peak Transient Voltage -42V Reverse Voltage Short Circuit Thermal Overload; AEC−Q100 Grade 1 Qualified and PPAP Capable

3.3 V and 5.0 V, 2.0% Output Options; Very Low Dropout Voltage; Protections: +60 V Peak Transient Voltage -42V Reverse Voltage Short Circuit Thermal Overload; AEC−Q100 Grade 1 Qualified and PPAP Capable

Use the download button to access the MM3Z4V7T1G schematic symbol, PCB footprint, and 3D model.

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; Small 6 pin package SOT-563; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

Use the download button to access the NVMFS5113PLT1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the NSVMMBT3906TT1G schematic symbol, PCB footprint, and 3D model.

Fully compatible with the ISO 11898-2 standard; Certified Authentication on CAN Transceiver Conformance (d1.1); High speed (up to 1Mbit/s); Ideally suited for 12V and 24V industrial and automotive applications; Low EME common-mode choke is no longer required; Differential receiver with wide common-mode range (+/- 35V) for high EMS; No disturbance of the bus lines with an un-powered node; Transmit data (TxD) dominant time-out function; Thermal protection; Bus pins protected against transients in an automotiv

SC-70, SOD-323, 3 PIN

Common Mode Range Extends to Negative Supply; ESD Clamps on the Inputs Increase Ruggedness without Affecting Device Operation; True Differential Input Stage; Single Supply Operation: 3.0 V to 32 V (LM224, LM324, LM324A); Low Input Bias Currents: 100 nA Maximum (LM324A); Short Circuited Protected Outputs; Four Amplifiers Per Package; Industry Standard Pinouts; Internally Compensated; Pb-Free Packages are Available*

FOD8342T - 8 mm Creepage and Clearance Distance, and 0.4 mm Insulation Distance to Achieve Reliable and High-Voltage Insulation; 3.0 A Peak Output Current Driving Capability for Medium-Power IGBT/MOSFET – Use of P-Channel MOSFETs at Output Stage Enables Output Voltage Swing Close to Supply Rail; 20 kV/µs Minimum Common Mode Rejection; Wide Supply Voltage Range: 10 V to 30 V; Fast Switching Speed Over Full Operating Temperature Range – 210 ns Maximum Propagation Delay – 65 ns Maximum Pulse Width Distortion;

SOP-8

Low Input Current: 1mA; High Noise Immunity Characteristic of CMOS Devices; In Compliance With the JEDEC Standard No. 7A Requirements; Chip Complexity: 36 FETs or 9 Equivalent Gates; Output Drive Capability: 10 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS and TTL; Operating Voltage Range: 2 to 6V; Pb-Free Packages are Available

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

SOT-23, 3 PIN

Use the download button to access the MM3Z5V1T1G schematic symbol, PCB footprint, and 3D model.

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available

Chip Complexity: FETs = ≤ 100; Designed for 2.0 V to 5.5 V Vcc Operation; High Speed: tPD = 3.7 ns (Typ) at VCC = 5 V; Low Power Dissipation: ICC = 1.0 µA (Max) at TA = 25°C; TTL-Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V; CMOS-Compatible Outputs: VOH > 0.8 VCC ; VOL < 0.1 VCC @Load; Power Down Protection Provided on Inputs and Outputs; Balanced Propagation Delays; Pin and Function Compatible with Other Standard Logic Families; Pb-Free Packages are Available

3 independent current sinks up to 175 mA rated 25 V; LED current set by external low power control resistors; Individual PWM control per channel; Low dropout current source (0.4 V at 175 mA) ; Output Enable input for dimming; 'Zero' current shutdown mode; 3 V to 5.5 V logic supply; Thermal shutdown protection

Integrated 1.5 A Switch; Input Voltage Range from 3 V to 40 V; Low Feedback Voltage of 235 mV ; Cycle-by-Cycle Current Limit; No Control Loop Compensation Required ; Frequency of Operation Adjustable up to 250 kHz; Operation With All Ceramic Output Capacitors or No Output Capacitance; Internal Thermal Shutdown with Hysteresis; ON/OFF pin for direct PWM dimming; ON/OFF pin disabling the regulator

7 MHz Unity Gain Bandwidth at 5 V; 5 MHz Unity Gain Bandwidth at 1.8 V; Rail-to-Rail Output; No Output Phase Reversal for Over-Driven Input Signals; Low Offset Voltage - 500 µV typical; Low Input Bias Current - 1 pA typical; SOT23-5 and SOT553-5 Packages; 8V/us Slew Rate at 5V; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

UL Flammability 94V-0 Classification; MSL 1 per J-STD-020; Low Forward Voltage: 1.15 V Maximum; High Surge Current Capacity; Glass Passivated Chip Junction; RoHS Compliant / Green Molding Compound; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

Peak Power − 225 Watt (8 X 20 ?s); ESD Rating of Class 3 (>16 KV) per Human Body Model; Pb-Free Packages are Available; AECQ101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements ; Small Package Size

SOP-16

Ultra Low Quiescent current 500nA; Very Low Dropout, 170mV at 150mA; Factory trimmed High output Voltage Accuracy +/- 1%; Wide Input Voltage Range 2.2V to 5.5V; Adaptive ground current proportional to load current; Small packages 1x1 mm XDFN4, SOT-563 and TSOP-5

Ultra Low Quiescent current 500nA; Very Low Dropout, 170mV at 150mA; Factory trimmed High output Voltage Accuracy +/- 1%; Wide Input Voltage Range 2.2V to 5.5V; Adaptive ground current proportional to load current; Small packages 1x1 mm XDFN4, SOT-563 and TSOP-5

D2PAK-5

POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available

Use the download button to access the NTE4151PT1G schematic symbol, PCB footprint, and 3D model.

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit