ON Semiconductor
ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.
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All ON Semiconductor Components
Showing 1,201–1,250 of 4,313
SMB, 2 PIN
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
SMB, 2 PIN
Complementary Pairs Simplifies Designs; Low Collector Emitter Saturation Voltage VCE(sat) = 1.0 Volt Max @ 8.0 Amperes; Lead Formed for Surface Mount Application in Plastic Sleeves (No Suffix); Straight Lead Version in Plastic Sleeves ("-1" Suffix); Lead Formed Version in 16 mm Tape and Reel for Surface Mount ("T4" Suffix); Electrically Similar to Popular D44H/D45H Series; Fast Switching Speeds; NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101
A = 1.0% tolerance Vref; B = 0.5% tolerance Vref; C = 0.2% tolerance Vref; Programmable Output Voltage Range of 1.24 V to 16 V; Voltage Reference Tolerance +/-1.0%; Sharp Low Current Turn-On Characteristic; Low Dynamic Output Impedance of 0.20 W from 100 mA to 20 mA; Micro Miniature TSOP-5 and TO-92 Packages; Pb-Free Package is Available
Use the download button to access the NTMFS5C673NLT1G schematic symbol, PCB footprint, and 3D model.
SO-8FL, DFN5, 6 PIN
NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
NCP1602AEASNT1G is a Obsolete - Power Factor Controller, Enhanced Light Load Efficiency for electronic system designs. Key details include 6 pins in Small Outline Packages from ON Semiconductor. It supports industrial electronics, embedded systems, instrumentation, maintenance repair, and production sourcing programs with worldwide sourcing support.
Operating Input Voltage Range: 2.5 V to 24 V; 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 v, 5 V Fixed output Voltagege Options; Low 4.7 uA typ Quiescent Current; PSRR 54 dB at 1 kHz; Thermal Shutdown and Current Limit Protections; Available in XDFN6 1.5 x 1.5 mm, TSOP-5 and SC-70 packages
Operating Input Voltage Range: 2.5 V to 24 V; 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 v, 5 V Fixed output Voltagege Options; Low 4.7 uA typ Quiescent Current; PSRR 54 dB at 1 kHz; Thermal Shutdown and Current Limit Protections; Available in XDFN6 1.5 x 1.5 mm, TSOP-5 and SC-70 packages
HALOGEN AND LEAD FREE, CASE 631AA-01, 3 PIN
Use the download button to access the NSVRB751V40T1G schematic symbol, PCB footprint, and 3D model.
No Phase Reversal on the Output for Over-driven Input Signals; High Output Current (ISC = 80 mA, Typ); Typical Gain Bandwidth Product = 2.2 MHz; 600 Ω Output Drive Capability; Low Supply Current (ID = 0.9 mA, Typ); Extended Operating Temperature Ranges (-40° to +105°C and -55° to +125°C); Output Voltage Swings within 50 mV of both Rails; Input Voltage Range Includes both Supply Rails; Low Voltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground)
Standard Zener Breakdown Voltage Range - 2.4 V to 18 V; Steady State Power Rating of 500 mW; Small Body Outline Dimensions: 0.047 x 0.032 (1.20 mm x 0.80 mm); Low Body Height: 0.028 (0.7 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; Tight Tolerance VZ; These are PbFree Devices; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
No Phase Reversal on the Output for Over-driven Input Signals; High Output Current (ISC = 80 mA, Typ); Typical Gain Bandwidth Product = 2.2 MHz; 600 Ω Output Drive Capability; Low Supply Current (ID = 0.9 mA, Typ); Extended Operating Temperature Ranges (-40° to +105°C and -55° to +125°C); Output Voltage Swings within 50 mV of both Rails; Input Voltage Range Includes both Supply Rails; Low Voltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground)
ON Semiconductor MC33204DG is a integrated circuit for industrial, embedded, repair, and production electronic designs. Key specs include 14 pins, -40 to 105 °C, 751 A, 0 A, with SOIC-14 NB packaging. Use it for industrial control, embedded systems, repair sourcing, prototyping, and production builds with RFQ pricing, inquiry stock support, and worldwide shipping.
Standard Zener Breakdown Voltage Range - 2.4 V to 18 V; Steady State Power Rating of 500 mW; Small Body Outline Dimensions: 0.047 x 0.032 (1.20 mm x 0.80 mm); Low Body Height: 0.028 (0.7 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; Tight Tolerance VZ; These are PbFree Devices; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
ON Semiconductor MMBD1201 is a diode for rectification, clamping, reverse-polarity protection, and switching circuits. Key specs include 3 pins, 150 °C, 3 PIN, 6.1 A, with SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P packaging. Use it for power rectifiers, clamp circuits, reverse-polarity protection, flyback paths, and compact switching boards with RFQ pricing, inquiry stock support, and worldwide shipping.
5V tolerant inputs and outputs; 4.5 ns tPD max (VCC = 3.3V), 20 µA ICC max; ESD performance: Human body model > 2000V Machine model > 200V; Uses patented noise/EMI reduction circuitry; ±24 mA output drive (VCC = 3.0V); 2.3V-3.6V VCC specifications provided; Supports live insertion/withdrawal (Note 1); Power down high impedance inputs and outputs; Latch-up performance exceeds 500 mA; Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA)
MJL21193 is a ON Semiconductor Transistor for switching and amplification stages. Key specs include 3 PIN, 4 W, and Transistor Outline, Vertical integration. From RFQ pricing in stock for worldwide shipping.
Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
FDMD8260LET60 is a ON Semiconductor mOSFET (N-Channel). It offers 100V, 21A, 20mΩ, PQFN-12 packaging for 14-pin PQFN-12 designs. From $0.00 in stock worldwide shipping.
Max rDS(on) =11.5 mΩ at VGS = -1.8 V, ID = -11 A ; High power and current handling capability in a widely used surface mount package ; Lead-free and RoHS Compliant ; High performance trench technology for extremely low rDS(on) ; Max rDS(on) = 5.7 mΩ at VGS = -2.5 V, ID = -16 A ; Max rDS(on) = 4 mΩ at VGS = -4.5 V, ID = -18 A
S Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
MUN5113T1G is a ON Semiconductor transistor. It offers 3 pins, -55°C to 150°C, SOT23 (3-Pin) packaging for 3-pin SOT23 (3-Pin) designs. From $0.00 in stock worldwide shipping.
S Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
MUN5232T1G is a ON Semiconductor transistor BJT NPN. It offers 3 pins, SOT23 (3-Pin) packaging for 3-pin SOT23 (3-Pin) designs. From $0.00 in stock worldwide shipping.
S210 is an ON Semiconductor silicon rectifier diode featuring a maximum forward voltage of 0.85 V and free-wheeling diode functionality in a single-element moulded package. Designed for general-purpose rectification. Available from stock worldwide with fast shipping.
Polarity: Polarity Band Indicates Cathode Lead; High Temperature Glass Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Marking: U2A, U2B; Weight: 95 mg (approximately); Shipped in 12 mm Tape and Reel, 2500 units per reel; Low Forward Voltage Drop (0.74 Volts Max @ 2.0 A, TJ = 150°C) Mechanical Characteristics:; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Small Compact Surface M
NCS210SQT2G is an onsemi precision current-sense amplifier in a 6-pin SOT23 package. It provides a fixed 200 V/V gain with low input offset for high-side or low-side current monitoring. From $0.35, in stock with worldwide shipping.
ON Semiconductor MM74HC74AM is a dual D-type flip-flop in 14-pin SOIC package, operating up to 24 MHz with 50 pF load capacitance and 2 V to 6 V supply voltage for CMOS logic circuits. From $0.20 in stock worldwide shipping.
POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available
Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
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