Diode

Diode components are essential building blocks in modern electronic systems. FindMyChip sources Diode ICs from authorized China distributors with competitive pricing and reliable stock.

2,158 components

How to Choose Diode Components

  • 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
  • 2Check package footprint and thermal characteristics against your PCB layout constraints.
  • 3Confirm lifecycle status and long-term availability for production designs.

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All Diode Components

Showing 1,2511,300 of 2,158

MBRS4201T3GON Semiconductor

Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.61 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Highly Stable Over Temperature; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBRS360T3GON Semiconductor

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

MBRS130T3GON Semiconductor

Rectangular Package for Automated Handling; Case: Epoxy, Molded; Guardring for Stress Protection Mechanical Characteristics:; Shipped in 12 mm Tape and Reel, 2500 units per reel; Highly Stable Oxide Passivated Junction; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, TJ = 25C); Weight: 95 mg (approximately); Marking: B13; Small Compact Surface Mou

MBRS2H100T3GON Semiconductor

Use the download button to access the MBRS2H100T3G schematic symbol, PCB footprint, and 3D model.

MBRS3201T3GON Semiconductor

Highly Stable Over Temperature; Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.59 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBRS3200T3GON Semiconductor

Small Compact Surface Mountable Package with J−Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Very High Blocking Voltage − 200 V; 175C Operating Junction Temperature; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable;

MBRS360BT3GON Semiconductor

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

MBRS130LT3GON Semiconductor

Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25 °C); Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per

MBRS320T3GON Semiconductor

Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Weight: 217 mg (approximately); Marking: B32, B33, B34; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Polarity: Notch

MBRS190T3GON Semiconductor

Weight: 95 mg (approximately); Rectangular Package for Automated Handling; Case: Epoxy, Molded; Markings: MBRS190T3: B19 MBRS1100T3: B1C; Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per reel; 150°C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide

MBRS3100T3GON Semiconductor

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ship

MBRS2040LT3GON Semiconductor

Compact Package with J-Bend Leads Ideal for Automated Handling; Epoxy Meets UL94, VO at 1/8"; Low Forward Voltage Drop Mechanical Characteristics:; Maximum Temperature of 260°C / 10 Seconds for Soldering; Highly Stable Oxide Passivated Junction; Cathode Polarity Band; Weight: 95 mg (approximately); Marking: BKJL; Case: Molded Epoxy; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Guardring for Over-Voltage Protection; Finish: All External Surfaces Corrosion Resistant an

MBRS260T3GON Semiconductor

Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over–Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8 inch; Weight: 95 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Finish: All External Surfaces C

MBRD835LGON Semiconductor

Weight: 0.4 gram (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads 3 are Readily Solderable; Lead Formed for Surface Mount Mechanical Characteristics:; Available in 16 mm Tape and Reel, 2500 units per 13" reel, by adding a "T4" suffix to the part number; Marking: B835L; Low Forward Voltage; Shipped 75 units per plastic tube; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Lead and Mounting Surface Temperature for Soldering Purposes

MBRS1540T3GON Semiconductor

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Compact Package with J-Bend Leads Ideal for Automated Handling; Case: Molded Epoxy; Available in 12 mm Tape, 2500 Units per 13" Reel, Add "T3" Suffix to Part Number; Cathode Polarity Band; Low Forward Voltage Drop Mechanical Characteristics:; Weight: 95 mg (approximately); Marking: BGJ; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Highly Stabl

MBRS240LT3GON Semiconductor

Guardring for Over-Voltage Protection; Low Forward Voltage Drop; Highly Stable Oxide Passivated Junction; Case: Molded Epoxy; Compact Package with J-Bend Leads Ideal for Automated Handling; Maximum Temperature of 260°C/10 Seconds for Soldering; Epoxy Meets UL94, VO at 1/8"; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Cathode Polarity Band; Marking: 2BL4; Weight: 95 mg (approximately); Available in 12 mm Tape, 2500 Units per 13" Reel, Add "T3" Suffix to Part N

MBRS230LT3GON Semiconductor

Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8''; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Maximum Temperature of 2600C/10 Seconds for Soldering; Available in 12 mm Tape, 2500 Units per 13'' Reel, Add ''T3'' Suffix to Part Number;

MBRF20200CTGON Semiconductor

Guardring for Stress Protection; Epoxy Meets UL94, VO at 1/8"; Very Low Forward Voltage Drop; Marking: B20200; Electrically Isolated. No Isolation Hardware Required.; Case: Epoxy, Molded; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; UL Recognized File #E69369 Mechanical Characteristics:; Highly Stable Oxide Passivated Junction; Matched Dual Die Construction;

MBRF20H150CTGON Semiconductor

Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 20 A Total (10 A Per Diode Leg); Guard-Ring for Stress Protection; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams (TO-220 & TO-220FP); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBRM120ET1GON Semiconductor

Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCV; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

MBRF10H150CTGON Semiconductor

Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 10 A Total (5 A Per Diode Leg); Guard-Ring for Stress Protection; This is a Pb-Free Device Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBRF20100CTGON Semiconductor

Case: Epoxy, Molded; Electrically Isolated. No Isolation Hardware Required.; High dv/dt Capability; Matched Dual Die Construction; Weight: 1.9 grams (approximately); High Junction Temperature Capability; Guardring for Stress Protection; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Marking: B20100; Lead Temperature for Solde

MBRS120T3GON Semiconductor

Rectangular Package for Automated Handling; Cathode Polarity Band; Weight: 95 mg (approximately); Case: Epoxy, Molded; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Guardring for Stress Protection Mechanical Characteristics:; Small Compact Surface Mountable Package with J-Bend Leads; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Very Low Forward Voltage Drop (0.55 Volts Max @ 1.0 A, TJ = 25°C); Ship

MBRM120LT1GON Semiconductor

NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Powermite is JEDEC Registered as DO-216AA; Weight: 6

MBRM130LT1GON Semiconductor

Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCG; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

MBRF40250TGON Semiconductor

Use the download button to access the MBRF40250TG schematic symbol, PCB footprint, and 3D model.

MBRD360T4GON Semiconductor

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T4'' suffix to the part number; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Weight: 0.4 gram (approximately); Marking: B320, B330, B340, B350, B360; Extremely Fast Switching; Shipped 7

MBRD835LT4GON Semiconductor

Weight: 0.4 gram (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads 3 are Readily Solderable; Lead Formed for Surface Mount Mechanical Characteristics:; Available in 16 mm Tape and Reel, 2500 units per 13" reel, by adding a "T4" suffix to the part number; Marking: B835L; Low Forward Voltage; Shipped 75 units per plastic tube; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Lead and Mounting Surface Temperature for Soldering Purposes

MBRD5H100T4GON Semiconductor

Low Forward Voltage; Guardring for Stress Protection; 175°C Operating Junction Temperature; Epoxy Meets UL 94 V-0 @ 0.125 in; Short Heat Sink Tab Manufactured - Not Sheared!; NBRD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBRD1035CTLGON Semiconductor

Schottky Power Rectifier, Switch-mode, 10 A, 35 V

MBRD360GON Semiconductor

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T4'' suffix to the part number; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Weight: 0.4 gram (approximately); Marking: B320, B330, B340, B350, B360; Extremely Fast Switching; Shipped 7

MBRD1045T4GON Semiconductor

Guarding for Stress Protection; Low Forward Voltage; 150°C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Short Heat Sink Tab Manufactured - Not Sheared!; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Epoxy Meets UL94, VO at 1/8"; Similar in Size to the Industry Standard TO-220 Package Mechanical Characteristics:; AEC-Q101 Qualified and PPAP Capable; SBRB and SBRD Pre

MBRB2515LGON Semiconductor

Use the download button to access the MBRB2515LG schematic symbol and PCB footprint.

MBRB40250TGON Semiconductor

Use the download button to access the MBRB40250TG schematic symbol, PCB footprint, and 3D model.

MBRB30H30CT-1GON Semiconductor

Obsolete - Schottky Barrier Rectifier, H-Series, 60 V, 30 A

MBRA160T3GON Semiconductor

Small Compact Surface Mountable Package with J–Bent Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Very Low Forward Voltage Drop; Guardring for Stress Protection Mechanical Characteristics: ; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm tape, 5000 units per 13

MBRA210LT3GON Semiconductor

Ultra Low VF; 1st in the Market Place with a 10 VR Schottky Rectifier; Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Optimized for Low Forward Current; Mechanical Characteristics: Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8"; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes

MBRA140T3GON Semiconductor

Very Low Forward Voltage Drop; Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or Polarity Band; Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bent Leads; Shipped in 12 mm tape, 5000 units per 13 inch reel; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (approxi

MBR41H100CTGON Semiconductor

Low Forward Voltage: 0.67 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 40 A Total (20 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; AEC-Q101 Qua

MBRA130LT3GON Semiconductor

Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Case: Molded Epoxy; Low Forward Voltage Drop Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch in Plastic Body Indicates Cathode Lead; Epoxy Meets UL94, VO at 1/8"; Compact Package with J-Bend Leads Ideal for Automated Handling; Marking: B1L3; High

MBRA120ET3GON Semiconductor

Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Optimized for Low Leakage Current Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8"; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathode

MBR7030WTGON Semiconductor

Schottky Power Rectifier, Switch-mode, 70 A, 30 V

MBR40250GON Semiconductor

Use the download button to access the MBR40250G schematic symbol, PCB footprint, and 3D model.

MBR5H100MFST3GON Semiconductor

Use the download button to access the MBR5H100MFST3G schematic symbol, PCB footprint, and 3D model.

MBR2H200SFT1GON Semiconductor

SOD-123FL, 2 PIN

MBR60H100CTGON Semiconductor

Low Forward Voltage: 0.72 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 60 A Total (30 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; NRVB Prefix

MBR3100GON Semiconductor

Use the download button to access the MBR3100G schematic symbol, PCB footprint, and 3D model.

MBR40250TGON Semiconductor

Use the download button to access the MBR40250TG schematic symbol, PCB footprint, and 3D model.

MBR2545CTGON Semiconductor

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Weight: 1.9 grams (approximately); 175°C Operating Junction Temperature Mechanical Characteristics:; Case: Epoxy, Molded; Low Forward Voltage; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR340GON Semiconductor

Use the download button to access the MBR340G schematic symbol and PCB footprint.

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