Diode

Diode components are essential building blocks in modern electronic systems. FindMyChip sources Diode ICs from authorized China distributors with competitive pricing and reliable stock.

2,158 components

How to Choose Diode Components

  • 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
  • 2Check package footprint and thermal characteristics against your PCB layout constraints.
  • 3Confirm lifecycle status and long-term availability for production designs.

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All Diode Components

Showing 1,3011,350 of 2,158

MBR2535CTGON Semiconductor

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Weight: 1.9 grams (approximately); 175°C Operating Junction Temperature Mechanical Characteristics:; Case: Epoxy, Molded; Low Forward Voltage; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR2030CTLGON Semiconductor

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; High Junction Temperature Capability; Guardring for Stress Protection; Very Low Forward Voltage Drop (0.4 Max @ 10 A, TC = 150°C); 150°C Operating Junction Temperature; High dv/dt Capability; Highly Stable Oxide Passivated Junction; Case: Epoxy, Molded; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Matched Dual Die Construction (10 A per Leg or 20 A per Package); Lead Temperature for Soldering

MBR2H100SFT3GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 175°C Operating Junction Temperature; Epoxy Meets UL94 V-0; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; This is a Pb-Free Device Mechanical Characteristics:; Reel Options: MBR2H100SFT3G = 10,000 per 13 in reel/8 mm tape; Device Marking: L2H; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Lead Finish: 100% Matte Sn (Tin); Lead and Mounting Surface T

MBR1645GON Semiconductor

Case: Epoxy, Molded; Weight: 1.9 grams (approximately); Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped 50 units per plastic tube; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 150 C Operating Junction Temperature Mechanical Characteristics:; Marking: B1635, B1645; Guardring for Stress Protection; Low Forward Voltage

MBR2060CTGON Semiconductor

Similar in Size to Industry Standard TO-220 Package Mechanical Characteristics:; Guardring for Stress Protection; Short Heat Sink Tab Manufactured - Not Sheared (D2PAK)!; Center-Tap Configuration; Low Forward Voltage; Package Designed for Power Surface Mount Applications (D2PAK); 175°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Case: Epoxy, Molded; Weight: 1.7 grams (approximately) - D2PAK 1.9 grams (approximately) - TO-220; Finish: All External Surfaces Corrosion Resistant and Terminal L

MBR230LSFT1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage Drop; 125 C Operating Junction Temperature; Epoxy Meets UL94, V-0; Package Designed for Optimal Automated Board Assembly; Cathode Lead Indicated by polarity Band; ESD Ratings, Machine Model = C, Human Body Model = 3B; Device Meets MSL 1 Requirements; Lead Finish: 100% Matte Sn (Tin); This is a Pb-Free Device

MBR20200CTGON Semiconductor

Dual Diode Construction - Terminals 1 and 3 Must be Connected for Parallel Operation at Full Rating Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Case: Epoxy, Molded; Shipped 50 units per plastic tube; Guardring for Stress Protection and High dv/dt Capability (10,000 V/µs); 200 Volt Blocking Voltage; Marking: B20200; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Forward V

MBR20L45CTGON Semiconductor

Use the download button to access the MBR20L45CTG schematic symbol, PCB footprint, and 3D model.

MBR1H100SFT3GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 175°C Operating Junction Temperature; Epoxy Meets UL94 V-0; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; This is a Pb-Free Device Mechanical Characteristics:; Reel Options: MBR1H100SFT3G = 10,000 per 13 in reel/8 mm tape; Device Marking: L1H; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Lead Finish: 100% Matte Sn (Tin); Lead and Mounting Surface T

MBR160RLGON Semiconductor

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Shipped in plastic bags, 1000 per bag; Polarity: Cathode Indicated by Polarity Band; Low Stored Charge, Majority Carrier Conduction; Highly Stable Oxide Passivated Junction Mechanical Characteristics:; Marking: B150, B160; Weight: 0.4 gram (approximately); Low Power Loss/High Efficiency; Available Tape and Reeled, 5000 per reel, by adding a "RL'' suffix to the part number; Low Reverse Current; L

MBR120LSFT1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Tamperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR1545CTGON Semiconductor

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Center-Tap Configuration; Guardring for Stress Protection; Guaranteed Reverse Avalanche; Shipped 50 units per plastic tube; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Weight: 1.9 grams (approximately); 150 C Operating Junction Temperature; Low Forward Voltage; Marking: B1535, B1545; Pb-Free Packages are Available

MBR120LSFT3GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Tamperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR140SFT1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR150GON Semiconductor

Use the download button to access the MBR150G schematic symbol, PCB footprint, and 3D model.

MBR120ESFT1GON Semiconductor

Guardring for Stress Protection; Low Leakage; 150 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR1100RLGON Semiconductor

Low Power Loss/High Efficiency; Shipped in plastic bags, 1000 per bag; Guard-Ring for Stress Protection; Weight: 0.4 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; High Surge Capacity Mechanical Characteristics:; Available Tape and Reeled, 5000 per reel, by adding a "RL'' suffix to the part number; Case: Epoxy, Molded; Low Stored Charge, Majority Carrier Conduction; Low Forward Voltage; Polarity: Cathode Indicated by Polarity Band; Marking:

MBR130T3GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

MBR120VLSFT1GON Semiconductor

Guardring for Stress Protection; Optimized for Very Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO; Package Designed for Optimal Automated Board Assembly; ESD Rated Machine Model C; ESD Rated Human Body Model 3B; Device Meets MSL 1 Requirements; Pb-Free Packages are Available

MBR130LSFT1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage Drop; 125°C Operating Junction Temperature; Epoxy Meets UL94, V-0; Package Designed for Optimal Automated Board Assembly; Cathode Lead Indicated by polarity Band; ESD Ratings: Machine Model = C, Human Body Model = 3B; Device Meets MSL 1 Requirements; Lead Finish: 100% Matte Sn (Tin); Pb-Free Package is Available

MBR0530T3GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: MBR0530T1 = 3,000 per 7" reel/8 mm tape MBR0530T3 = 10,000 per 13" reel/8 mm tape; Device Marking: B3; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and

MBR130T1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

MBR1060GON Semiconductor

Low Forward Voltage; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Power Loss/High Efficiency; Epoxy Meets UL94, VO at 1/8"; 150 °C Operating Junction Temperature; Case: Epoxy, Molded; Low Stored Charge Majority Carrier Conduction Mechanical Characteristics:; Weight: 1.9 grams (approximately); High Surge Capacity; Guard-Ring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Packages are Available

MBR0540T3GON Semiconductor

Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

MBR1045GON Semiconductor

Weight: 1.9 grams (approximately); Marking: B1035, B1045; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 150 C Operating Junction Temperature; Low Forward Voltage; Guardring for Stress Protection; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Case: Epoxy, Molded; Pb-Free Packages are Available

MBR10100GON Semiconductor

Low Forward Voltage; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Power Loss/High Efficiency; Epoxy Meets UL94, VO at 1/8; 150 °C Operating Junction Temperature; Case: Epoxy, Molded; Low Stored Charge Majority Carrier Conduction Mechanical Characteristics:; Weight: 1.9 grams (approximately); High Surge Capacity; Guard-Ring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; AEC-Q101 Qualified and PPAP Capable; NRVB P

MBR0540T1GON Semiconductor

Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

MBR0520LT3GON Semiconductor

Guardring for Stress Protection; Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25 C); 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics; Reel Options: MBR0520LT1 = 3,000 per 7" reel/8 mm tape. MBR0520LT3 = 10,000 per 13" reel/8 mm tape.; Device Marking: B2; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Lea

MBR0530T1GON Semiconductor

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: MBR0530T1 = 3,000 per 7" reel/8 mm tape MBR0530T3 = 10,000 per 13" reel/8 mm tape; Device Marking: B3; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and

MBD770DWT1GON Semiconductor

HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 419B-02, SC-70, SC-88, 6 PIN

M1MA152WAT1GON Semiconductor

Fast trr, < 10 ns; Available in 8 mm Tape and Reel Use M1MA151/2WAT1 to order the 7 inch/3000 unit reel. Use M1MA151/2WAT3 to order the 13 inch/10,000 unit reel.; Low CD, < 15 pF; Pb-Free Packages are Available

M1MA141WAT1GON Semiconductor

Low CD, < 15 pF; Available in 8 mm Tape and Reel Use M1MA141/2WAT1 to order the 7 inch/3000 unit reel. Use M1MA141/2WAT3 to order the 13 inch/10,000 unit reel.; Fast trr, < 10 ns; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

M1MA152WKT1GON Semiconductor

Fast trr, < 3.0 ns; Available in 8 mm Tape and Reel Use M1MA151/2WKT1 to order the 7 inch/3000 unit reel. Use M1MA151/2WKT3 to order the 13 inch/10,000 unit reel.; Low CD, < 2.0 pF; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

M1MA142WKT1GON Semiconductor

Fast trr, < 3.0 ns; Available in 8 mm Tape and Reel; Low CD, < 2.0 pF; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

M1MA141KT1GON Semiconductor

Low CD, < 2.0 pF; Fast trr, < 3.0 ns; Available in 8 mm Tape and Reel Use M1MA141/2KT1 to order the 7 inch/3000 unit reel. Use M1MA141/2KT3 to order the 13 inch/10,000 unit reel.; Pb-Free Packages are Available

M1MA142WAT1GON Semiconductor

Low CD, < 15 pF; Fast trr, < 10 ns; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

M1MA152KT1GON Semiconductor

Available in 8 mm Tape and Reel Use M1MA151/2KT1 to order the 7 inch/3000 unit reel. Use M1MA151/2KT3 to order the 13 inch/10,000 unit reel.; Fast trr, < 3.0 ns; Low CD, < 2.0 pF; Pb-Free Packages are Available

M1MA151WKT1GON Semiconductor

Fast trr, < 3.0 ns; Available in 8 mm Tape and Reel Use M1MA151/2WKT1 to order the 7 inch/3000 unit reel. Use M1MA151/2WKT3 to order the 13 inch/10,000 unit reel.; Low CD, < 2.0 pF; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

LM385D-1.2R2GON Semiconductor

Operating Current from 10 µA to 20 mA; Surface Mount Package Available; 1.0 W Dynamic Impedance; 1.0%, 1.5%, 2.0% and 3.0% Initial Tolerance Grades; Low Temperature Coefficient; Pb-Free Packages are Available

LM385Z-2.5GON Semiconductor

Use the download button to access the LM385Z-2.5G schematic symbol, PCB footprint, and 3D model.

LM385BZ-2.5GON Semiconductor

Lifetime - MicroPower Voltage Reference Diodes

ESD9X3.3ST5GON Semiconductor

Low Leakage; Response Time is Typically < 1 ns; ESD Rating of Class 3 (> 16 kV) per Human Body Model; IEC6100042 Level 4 ESD Protection; These are PbFree Devices; Small Body Outline Dimensions: 0.039 x 0.024 (1.0 mm x 0.60 mm); Low Body Height: 0.017 (0.43 mm) Max; Standoff Voltage: 3.3 V 12 V

ESD9L5.0ST5GON Semiconductor

SOD-923, 2 PIN

ESD9R3.3ST5GON Semiconductor

Low Body Height: 0.016 (0.4 mm); Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm); UltraLow Leakage < 1 nA; UltraLow Capacitance 0.5 pF; Low Clamping Voltage; Standoff Voltage: 3.3 V; Response Time < 1.0 ns; IEC6100042 Level 4 ESD Protection; This is a PbFree and HalogenFree Device

ESD9B3.3ST5GON Semiconductor

SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements ; AECQ101 Qualified and PPAP Capable ; This is a PbFree Device; Low Capacitance 15 pF; Low Clamping Voltage; Small Body Outline Dimensions: 0.039 x 0.024 (1.0mm x 0.60mm); Low Body Height: 0.016 (0.4 mm); Response Time is < 1 ns; IEC6100042 Level 4 ESD Protection; Low Leakage

ESD5Z6.0T1GON Semiconductor

Low Clamping Voltage; Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm); Low Leakage; Response Time is Typically < 1 ns; IEC61000−4−2 Level 4 ESD Protection and IEC61000−4−4 Level 4 EFT Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Peak Power up to 240 Watts @ 8 x 20 s Pulse; Low Body Height: 0.028″ (0.7 mm); ESD Rating of Class 3 (> 16 kV) per Human Body Model; These Devices are Pb−Fre

ESD9B5.0ST5GON Semiconductor

SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements ; AECQ101 Qualified and PPAP Capable ; This is a PbFree Device; Low Capacitance 15 pF; Low Clamping Voltage; Small Body Outline Dimensions: 0.039 x 0.024 (1.0mm x 0.60mm); Low Body Height: 0.016 (0.4 mm); Response Time is < 1 ns; IEC6100042 Level 4 ESD Protection; Low Leakage

ESD9L3.3ST5GON Semiconductor

SOD-923, 2 PIN

ESD5Z5.0T1GON Semiconductor

Low Clamping Voltage; Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm); Low Leakage; Response Time is Typically < 1 ns; IEC61000−4−2 Level 4 ESD Protection and IEC61000−4−4 Level 4 EFT Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Peak Power up to 240 Watts @ 8 x 20 s Pulse; Low Body Height: 0.028″ (0.7 mm); ESD Rating of Class 3 (> 16 kV) per Human Body Model; These Devices are Pb−Fre

ESD5Z2.5T1GON Semiconductor

Low Clamping Voltage; Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm); Low Leakage; Response Time is Typically < 1 ns; IEC61000−4−2 Level 4 ESD Protection and IEC61000−4−4 Level 4 EFT Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Peak Power up to 240 Watts @ 8 x 20 s Pulse; Low Body Height: 0.028″ (0.7 mm); ESD Rating of Class 3 (> 16 kV) per Human Body Model; These Devices are Pb−Fre

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