ON Semiconductor

ON Semiconductor

ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.

4,313

Total Products

33

Categories

All ON Semiconductor Components

Showing 3,4513,500 of 4,313

MBRS4201T3GDiodes Moulded
MBRS4201T3GDiode

Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.61 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Highly Stable Over Temperature; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBT3904DW1T1GSOT23 (6-Pin)
MBT3904DW1T1GIntegrated Circuit

Simplifies Circuit Design; Reduces Component Count; Available in 8 mm, 7-inch/3,000 Unit Tape and Reel; hFE, 100-300; Reduces Board Space; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS CompliantCapable

MBT3906DW1T1GSOT23 (6-Pin)
MBT3906DW1T1GMOSFET (N-Channel)

hFE, 100-300; Low VCE(sat), ≤ 400 mV; Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; Available in 8 mm, 7-inch/3,000 Unit Tape and Reel; Device Marking: MBT3906DW1T1 = A2; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBRS360T3GDiodes Moulded
MBRS360T3GDiode

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

MBT35200MT1GSOT23 (6-Pin)
MBT35200MT1GTransistor

S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

MBT2222ADW1T1GSOT23 (6-Pin)
MBT2222ADW1T1GIntegrated Circuit

Moisture Sensitivity Level: 1; ESD Rating: Human Body Model - 4 kV Machine Model - 400 V; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBRS130T3GDiodes Moulded
MBRS130T3GDiode

Rectangular Package for Automated Handling; Case: Epoxy, Molded; Guardring for Stress Protection Mechanical Characteristics:; Shipped in 12 mm Tape and Reel, 2500 units per reel; Highly Stable Oxide Passivated Junction; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, TJ = 25C); Weight: 95 mg (approximately); Marking: B13; Small Compact Surface Mou

MBRS410LT3GDiodes Moulded
MBRS410LT3GSchottky Diode

Ultra Low VF; 1st in the Market Place with a 10 VR Schottky Rectifier; Small Compact Surface Mountable Package with J–Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Very Low Forward Voltage Drop; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection; Mechanical Characteristics: Case: Epoxy, Molded; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Sol

MBRS2H100T3GDiodes Moulded
MBRS2H100T3GDiode

Use the download button to access the MBRS2H100T3G schematic symbol, PCB footprint, and 3D model.

MBRS3201T3GDiodes Moulded
MBRS3201T3GDiode

Highly Stable Over Temperature; Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.59 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBRS3200T3GDiodes Moulded
MBRS3200T3GDiode

Small Compact Surface Mountable Package with J−Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Very High Blocking Voltage − 200 V; 175C Operating Junction Temperature; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable;

MBRS360BT3GDiodes Moulded
MBRS360BT3GDiode

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

MBRS130LT3GDiodes Moulded
MBRS130LT3GDiode

Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25 °C); Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per

MBRS320T3GDiodes Moulded
MBRS320T3GDiode

Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Weight: 217 mg (approximately); Marking: B32, B33, B34; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Polarity: Notch

MBRS190T3GDiodes Moulded
MBRS190T3GDiode

Weight: 95 mg (approximately); Rectangular Package for Automated Handling; Case: Epoxy, Molded; Markings: MBRS190T3: B19 MBRS1100T3: B1C; Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per reel; 150°C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide

MBRS3100T3GDiodes Moulded
MBRS3100T3GDiode

Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Ship

MBRS2040LT3GDiodes Moulded
MBRS2040LT3GDiode

Compact Package with J-Bend Leads Ideal for Automated Handling; Epoxy Meets UL94, VO at 1/8"; Low Forward Voltage Drop Mechanical Characteristics:; Maximum Temperature of 260°C / 10 Seconds for Soldering; Highly Stable Oxide Passivated Junction; Cathode Polarity Band; Weight: 95 mg (approximately); Marking: BKJL; Case: Molded Epoxy; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Guardring for Over-Voltage Protection; Finish: All External Surfaces Corrosion Resistant an

MBRS140T3GDiodes Moulded
MBRS140T3GSchottky Diode

Marking: B14; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Small Compact Surface Mountable Package with J-Bend Leads; Highly Stable Oxide Passivated Junction; Shipped in 12 mm Tape and Reel, 2500 units per reel; Cathode Polarity Band; Guardring for Stress Protection Mechanical Characteristics:; Rectangular Package for Automated Handling; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Very Low Forward Voltage Drop 5 Vol

MBRM120ET3GOther
MBRM120ET3GSchottky Diode

Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCV; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

MBRS260T3GDiodes Moulded
MBRS260T3GDiode

Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over–Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8 inch; Weight: 95 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Finish: All External Surfaces C

MBRD835LGTO-XXX (Inc. DPAK)
MBRD835LGDiode

Weight: 0.4 gram (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads 3 are Readily Solderable; Lead Formed for Surface Mount Mechanical Characteristics:; Available in 16 mm Tape and Reel, 2500 units per 13" reel, by adding a "T4" suffix to the part number; Marking: B835L; Low Forward Voltage; Shipped 75 units per plastic tube; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Lead and Mounting Surface Temperature for Soldering Purposes

MBRS1540T3GDiodes Moulded
MBRS1540T3GDiode

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Compact Package with J-Bend Leads Ideal for Automated Handling; Case: Molded Epoxy; Available in 12 mm Tape, 2500 Units per 13" Reel, Add "T3" Suffix to Part Number; Cathode Polarity Band; Low Forward Voltage Drop Mechanical Characteristics:; Weight: 95 mg (approximately); Marking: BGJ; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Highly Stabl

MBRS240LT3GDiodes Moulded
MBRS240LT3GDiode

Guardring for Over-Voltage Protection; Low Forward Voltage Drop; Highly Stable Oxide Passivated Junction; Case: Molded Epoxy; Compact Package with J-Bend Leads Ideal for Automated Handling; Maximum Temperature of 260°C/10 Seconds for Soldering; Epoxy Meets UL94, VO at 1/8"; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Cathode Polarity Band; Marking: 2BL4; Weight: 95 mg (approximately); Available in 12 mm Tape, 2500 Units per 13" Reel, Add "T3" Suffix to Part N

MBRS230LT3GDiodes Moulded
MBRS230LT3GDiode

Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8''; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Maximum Temperature of 2600C/10 Seconds for Soldering; Available in 12 mm Tape, 2500 Units per 13'' Reel, Add ''T3'' Suffix to Part Number;

MBRF20200CTGTransistor Outline, Vertical
MBRF20200CTGDiode

Guardring for Stress Protection; Epoxy Meets UL94, VO at 1/8"; Very Low Forward Voltage Drop; Marking: B20200; Electrically Isolated. No Isolation Hardware Required.; Case: Epoxy, Molded; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; UL Recognized File #E69369 Mechanical Characteristics:; Highly Stable Oxide Passivated Junction; Matched Dual Die Construction;

MBRF20H150CTGTransistor Outline, Vertical
MBRF20H150CTGDiode

Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 20 A Total (10 A Per Diode Leg); Guard-Ring for Stress Protection; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams (TO-220 & TO-220FP); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBRM120ET1GOther
MBRM120ET1GDiode

Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCV; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

MBRF10H150CTGTransistor Outline, Vertical
MBRF10H150CTGDiode

Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 10 A Total (5 A Per Diode Leg); Guard-Ring for Stress Protection; This is a Pb-Free Device Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBRF20100CTGTransistor Outline, Vertical
MBRF20100CTGDiode

Case: Epoxy, Molded; Electrically Isolated. No Isolation Hardware Required.; High dv/dt Capability; Matched Dual Die Construction; Weight: 1.9 grams (approximately); High Junction Temperature Capability; Guardring for Stress Protection; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Marking: B20100; Lead Temperature for Solde

MBRS120T3GDiodes Moulded
MBRS120T3GDiode

Rectangular Package for Automated Handling; Cathode Polarity Band; Weight: 95 mg (approximately); Case: Epoxy, Molded; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Guardring for Stress Protection Mechanical Characteristics:; Small Compact Surface Mountable Package with J-Bend Leads; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Very Low Forward Voltage Drop (0.55 Volts Max @ 1.0 A, TJ = 25°C); Ship

MBRM120LT1GOther
MBRM120LT1GDiode

NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Powermite is JEDEC Registered as DO-216AA; Weight: 6

MBRM130LT1GOther
MBRM130LT1GDiode

Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCG; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

MBRD660CTGTO-XXX (Inc. DPAK)
MBRD660CTGIntegrated Circuit

Extremely Fast Switching; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: B620T, B630T, B640T, B650T, B660T; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Extremely Low Forward Drop; AEC-Q101 Qualified and PPAP Capable; NRVBD and SBR Prefixes for Automotive and Other Applications Requir

MBRF40250TGTransistor Outline, Vertical
MBRF40250TGDiode

Use the download button to access the MBRF40250TG schematic symbol, PCB footprint, and 3D model.

MBRM120LT3GOther
MBRM120LT3GSchottky Diode

NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Powermite is JEDEC Registered as DO-216AA; Weight: 6

MBRD640CTT4GOther
MBRD640CTT4GSchottky Diode with Dual Anode

Extremely Fast Switching; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: B620T, B630T, B640T, B650T, B660T; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Extremely Low Forward Drop; Shipped 75 units per plastic tube; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T

MBRD360T4GTO-XXX (Inc. DPAK)
MBRD360T4GDiode

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T4'' suffix to the part number; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Weight: 0.4 gram (approximately); Marking: B320, B330, B340, B350, B360; Extremely Fast Switching; Shipped 7

MBRD660CTRLGTO-XXX (Inc. DPAK)
MBRD660CTRLGIntegrated Circuit

Extremely Fast Switching; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: B620T, B630T, B640T, B650T, B660T; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Extremely Low Forward Drop; AEC-Q101 Qualified and PPAP Capable; NRVBD and SBR Prefixes for Automotive and Other Applications Requir

MBRD835LT4GTO-XXX (Inc. DPAK)
MBRD835LT4GDiode

Weight: 0.4 gram (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads 3 are Readily Solderable; Lead Formed for Surface Mount Mechanical Characteristics:; Available in 16 mm Tape and Reel, 2500 units per 13" reel, by adding a "T4" suffix to the part number; Marking: B835L; Low Forward Voltage; Shipped 75 units per plastic tube; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Lead and Mounting Surface Temperature for Soldering Purposes

MBRD5H100T4GTO-XXX (Inc. DPAK)
MBRD5H100T4GDiode

Low Forward Voltage; Guardring for Stress Protection; 175°C Operating Junction Temperature; Epoxy Meets UL 94 V-0 @ 0.125 in; Short Heat Sink Tab Manufactured - Not Sheared!; NBRD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBRD340GOther
MBRD340GSchottky Diode

Use the download button to access the MBRD340G schematic symbol, PCB footprint, and 3D model.

MBRD1035CTLGTO-XXX (Inc. DPAK)
MBRD1035CTLGDiode

Schottky Power Rectifier, Switch-mode, 10 A, 35 V

MBRB8H100T4GOther
MBRB8H100T4GSchottky Diode

Guarding for Stress Protection; Low Forward Voltage; 175C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Short Heat Sink Tab Manufactured - Not Sheared!; Case: Molded Expoxy; Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds; Epoxy Meets UL94, VO at 1/8; These are Pb-Free Packages; NBRB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101

MBRB60H100CTT4GOther
MBRB60H100CTT4GSchottky Diode

Low Forward Voltage: 0.72 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 60 A Total (30 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; NRVB Prefix

MBRD360GTO-XXX (Inc. DPAK)
MBRD360GDiode

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T4'' suffix to the part number; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Weight: 0.4 gram (approximately); Marking: B320, B330, B340, B350, B360; Extremely Fast Switching; Shipped 7

MBRD1045T4GTO-XXX (Inc. DPAK)
MBRD1045T4GDiode

Guarding for Stress Protection; Low Forward Voltage; 150°C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Short Heat Sink Tab Manufactured - Not Sheared!; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Epoxy Meets UL94, VO at 1/8"; Similar in Size to the Industry Standard TO-220 Package Mechanical Characteristics:; AEC-Q101 Qualified and PPAP Capable; SBRB and SBRD Pre

MBRD1035CTLT4GOther
MBRD1035CTLT4GSchottky Diode with Dual Anode

Short Heat Sink Tap Manufactured - Not Sheared; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Very Low Forward Voltage Drop; Weight: 0.4 gram (approximately); Available in 16 mm Tape and Reel, 2500 units per Reel, Add "T4'' to Suffix part #; Marking: B1035CL; Guardring for Stress Protection; Matched dual die construc

MBRB41H100CT-1GTransistor Outline, Vertical
MBRB41H100CT-1GIntegrated Circuit

I2PAK-3

MBRB2515LGOther
MBRB2515LGDiode

Use the download button to access the MBRB2515LG schematic symbol and PCB footprint.

MBRB40250TGOther
MBRB40250TGDiode

Use the download button to access the MBRB40250TG schematic symbol, PCB footprint, and 3D model.

Need ON Semiconductor Components?

Get competitive quotes from authorized China distributors

Request a Quote