ON Semiconductor

ON Semiconductor

ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.

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All ON Semiconductor Components

Showing 3,5013,550 of 4,313

MBRB30H30CT-1GTransistor Outline, Vertical
MBRB30H30CT-1GDiode

Obsolete - Schottky Barrier Rectifier, H-Series, 60 V, 30 A

MBRA160T3GDiodes Moulded
MBRA160T3GDiode

Small Compact Surface Mountable Package with J–Bent Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Very Low Forward Voltage Drop; Guardring for Stress Protection Mechanical Characteristics: ; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm tape, 5000 units per 13

MBRA210LT3GDiodes Moulded
MBRA210LT3GDiode

Ultra Low VF; 1st in the Market Place with a 10 VR Schottky Rectifier; Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Optimized for Low Forward Current; Mechanical Characteristics: Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8"; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes

MBR745GTransistor Outline, Vertical
MBR745GSchottky Diode

Case: Epoxy, Molded; 150 C Operating Junction Temperature; Low Forward Voltage; Weight: 1.9 grams (approximately); Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Packages are Available

MBRA140T3GDiodes Moulded
MBRA140T3GDiode

Very Low Forward Voltage Drop; Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or Polarity Band; Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bent Leads; Shipped in 12 mm tape, 5000 units per 13 inch reel; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (approxi

MBR41H100CTGTransistor Outline, Vertical
MBR41H100CTGDiode

Low Forward Voltage: 0.67 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 40 A Total (20 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; AEC-Q101 Qua

MBRA130LT3GDiodes Moulded
MBRA130LT3GDiode

Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Case: Molded Epoxy; Low Forward Voltage Drop Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch in Plastic Body Indicates Cathode Lead; Epoxy Meets UL94, VO at 1/8"; Compact Package with J-Bend Leads Ideal for Automated Handling; Marking: B1L3; High

MBRA120ET3GDiodes Moulded
MBRA120ET3GDiode

Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over-Voltage Protection; Optimized for Low Leakage Current Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8"; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Polarity: Polarity Band Indicates Cathode

MBR7030WTGTransistor Outline, Vertical
MBR7030WTGDiode

Schottky Power Rectifier, Switch-mode, 70 A, 30 V

MBR40250GTransistor Outline, Vertical
MBR40250GDiode

Use the download button to access the MBR40250G schematic symbol, PCB footprint, and 3D model.

MBR5H100MFST3GOther
MBR5H100MFST3GDiode

Use the download button to access the MBR5H100MFST3G schematic symbol, PCB footprint, and 3D model.

MBR2H200SFT1GSmall Outline Diode Flat Lead
MBR2H200SFT1GDiode

SOD-123FL, 2 PIN

MBR60H100CTGTransistor Outline, Vertical
MBR60H100CTGDiode

Low Forward Voltage: 0.72 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 60 A Total (30 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds; NRVB Prefix

MBR3100GDiodes, Axial Diameter Horizontal Mounting
MBR3100GDiode

Use the download button to access the MBR3100G schematic symbol, PCB footprint, and 3D model.

MBR40250TGTransistor Outline, Vertical
MBR40250TGDiode

Use the download button to access the MBR40250TG schematic symbol, PCB footprint, and 3D model.

MBR2545CTGTransistor Outline, Vertical
MBR2545CTGDiode

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Weight: 1.9 grams (approximately); 175°C Operating Junction Temperature Mechanical Characteristics:; Case: Epoxy, Molded; Low Forward Voltage; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR340GDiodes, Axial Diameter Horizontal Mounting
MBR340GDiode

Use the download button to access the MBR340G schematic symbol and PCB footprint.

MBR6045WTGTransistor Outline, Vertical
MBR6045WTGIntegrated Circuit

Low Forward Voltage Drop; Dual Diode Construction - Terminals 1 and 3 May Be Connected for Parallel Operation at Full Rating; Case: Epoxy, Molded; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 45 Volt Blocking Voltage; Guardring for Stress Protection and High dv/dt Capability (> 10 V/ns); 150 C Operating Junction Temperature Mechanical Characteristics:; Weight: 4.3 grams (approximately); Shipp

MBR30H100CTGTransistor Outline, Vertical
MBR30H100CTGIntegrated Circuit

Low Forward Voltage: 0.67 V @ 125C; Low Power Loss/High Efficiency; High Surge Capacity; 175C Operating Junction Temperature; 30 A Total (15 A Per Diode Leg); Guard-Ring for Stress Protection; Pb-Free Package is Available Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94, V-0 @ 0.125 in; Weight: Approximately 1.9 grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBR2535CTGTransistor Outline, Vertical
MBR2535CTGDiode

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Weight: 1.9 grams (approximately); 175°C Operating Junction Temperature Mechanical Characteristics:; Case: Epoxy, Molded; Low Forward Voltage; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR2030CTLGTransistor Outline, Vertical
MBR2030CTLGDiode

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; High Junction Temperature Capability; Guardring for Stress Protection; Very Low Forward Voltage Drop (0.4 Max @ 10 A, TC = 150°C); 150°C Operating Junction Temperature; High dv/dt Capability; Highly Stable Oxide Passivated Junction; Case: Epoxy, Molded; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Matched Dual Die Construction (10 A per Leg or 20 A per Package); Lead Temperature for Soldering

MAX809MTRGSOT23 (3-Pin)
MAX809MTRGIntegrated Circuit

ON SEMICONDUCTOR - MAX809MTRG - MPU Reset Monitor, 1V-5.5V supply, 4.38V Threshold, 460 ms Delay, Active-Low Reset, SOT-23-3

MBR2H100SFT3GSmall Outline Diode Flat Lead
MBR2H100SFT3GDiode

Guardring for Stress Protection; Low Forward Voltage; 175°C Operating Junction Temperature; Epoxy Meets UL94 V-0; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; This is a Pb-Free Device Mechanical Characteristics:; Reel Options: MBR2H100SFT3G = 10,000 per 13 in reel/8 mm tape; Device Marking: L2H; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Lead Finish: 100% Matte Sn (Tin); Lead and Mounting Surface T

MBR1645GTransistor Outline, Vertical
MBR1645GDiode

Case: Epoxy, Molded; Weight: 1.9 grams (approximately); Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Shipped 50 units per plastic tube; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 150 C Operating Junction Temperature Mechanical Characteristics:; Marking: B1635, B1645; Guardring for Stress Protection; Low Forward Voltage

MBR2060CTGTransistor Outline, Vertical
MBR2060CTGDiode

Similar in Size to Industry Standard TO-220 Package Mechanical Characteristics:; Guardring for Stress Protection; Short Heat Sink Tab Manufactured - Not Sheared (D2PAK)!; Center-Tap Configuration; Low Forward Voltage; Package Designed for Power Surface Mount Applications (D2PAK); 175°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Case: Epoxy, Molded; Weight: 1.7 grams (approximately) - D2PAK 1.9 grams (approximately) - TO-220; Finish: All External Surfaces Corrosion Resistant and Terminal L

MBR230LSFT1GSmall Outline Diode Flat Lead
MBR230LSFT1GDiode

Guardring for Stress Protection; Low Forward Voltage Drop; 125 C Operating Junction Temperature; Epoxy Meets UL94, V-0; Package Designed for Optimal Automated Board Assembly; Cathode Lead Indicated by polarity Band; ESD Ratings, Machine Model = C, Human Body Model = 3B; Device Meets MSL 1 Requirements; Lead Finish: 100% Matte Sn (Tin); This is a Pb-Free Device

MBR20200CTGTransistor Outline, Vertical
MBR20200CTGDiode

Dual Diode Construction - Terminals 1 and 3 Must be Connected for Parallel Operation at Full Rating Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 1.9 grams (approximately); Case: Epoxy, Molded; Shipped 50 units per plastic tube; Guardring for Stress Protection and High dv/dt Capability (10,000 V/µs); 200 Volt Blocking Voltage; Marking: B20200; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Forward V

MBR20H150CTGTransistor Outline, Vertical
MBR20H150CTGIntegrated Circuit

Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 20 A Total (10 A Per Diode Leg); Guard-Ring for Stress Protection; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams (TO-220 & TO-220FP); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

MBR20L45CTGTransistor Outline, Vertical
MBR20L45CTGDiode

Use the download button to access the MBR20L45CTG schematic symbol, PCB footprint, and 3D model.

MBR1H100SFT3GSmall Outline Diode Flat Lead
MBR1H100SFT3GDiode

Guardring for Stress Protection; Low Forward Voltage; 175°C Operating Junction Temperature; Epoxy Meets UL94 V-0; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; This is a Pb-Free Device Mechanical Characteristics:; Reel Options: MBR1H100SFT3G = 10,000 per 13 in reel/8 mm tape; Device Marking: L1H; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Lead Finish: 100% Matte Sn (Tin); Lead and Mounting Surface T

MBR160RLGDiodes, Axial Diameter Horizontal Mounting
MBR160RLGDiode

Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Shipped in plastic bags, 1000 per bag; Polarity: Cathode Indicated by Polarity Band; Low Stored Charge, Majority Carrier Conduction; Highly Stable Oxide Passivated Junction Mechanical Characteristics:; Marking: B150, B160; Weight: 0.4 gram (approximately); Low Power Loss/High Efficiency; Available Tape and Reeled, 5000 per reel, by adding a "RL'' suffix to the part number; Low Reverse Current; L

MBR120LSFT1GSmall Outline Diode Flat Lead
MBR120LSFT1GDiode

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Tamperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR1545CTGTransistor Outline, Vertical
MBR1545CTGDiode

Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Center-Tap Configuration; Guardring for Stress Protection; Guaranteed Reverse Avalanche; Shipped 50 units per plastic tube; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Weight: 1.9 grams (approximately); 150 C Operating Junction Temperature; Low Forward Voltage; Marking: B1535, B1545; Pb-Free Packages are Available

MBR120LSFT3GSmall Outline Diode Flat Lead
MBR120LSFT3GDiode

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Tamperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR140SFT1GSmall Outline Diode Flat Lead
MBR140SFT1GDiode

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

MBR150GDiodes, Axial Diameter Horizontal Mounting
MBR150GDiode

Use the download button to access the MBR150G schematic symbol, PCB footprint, and 3D model.

MBR120ESFT1GSmall Outline Diode Flat Lead
MBR120ESFT1GDiode

Guardring for Stress Protection; Low Leakage; 150 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

MBR1100RLGDiodes, Axial Diameter Horizontal Mounting
MBR1100RLGDiode

Low Power Loss/High Efficiency; Shipped in plastic bags, 1000 per bag; Guard-Ring for Stress Protection; Weight: 0.4 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; High Surge Capacity Mechanical Characteristics:; Available Tape and Reeled, 5000 per reel, by adding a "RL'' suffix to the part number; Case: Epoxy, Molded; Low Stored Charge, Majority Carrier Conduction; Low Forward Voltage; Polarity: Cathode Indicated by Polarity Band; Marking:

MBD301GOther
MBD301GSchottky Diode

MBD301G is a 4W 1.5pF capacitor by ON Semiconductor. Key specs: 4W, 1.5pF, -226A. From quote-based pricing, in stock with worldwide shipping for production sourcing.

MBR130T3GSmall Outline Diode
MBR130T3GDiode

Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

MBR120VLSFT1GSmall Outline Diode Flat Lead
MBR120VLSFT1GDiode

Guardring for Stress Protection; Optimized for Very Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO; Package Designed for Optimal Automated Board Assembly; ESD Rated Machine Model C; ESD Rated Human Body Model 3B; Device Meets MSL 1 Requirements; Pb-Free Packages are Available

MBR130LSFT1GSmall Outline Diode Flat Lead
MBR130LSFT1GDiode

Guardring for Stress Protection; Low Forward Voltage Drop; 125°C Operating Junction Temperature; Epoxy Meets UL94, V-0; Package Designed for Optimal Automated Board Assembly; Cathode Lead Indicated by polarity Band; ESD Ratings: Machine Model = C, Human Body Model = 3B; Device Meets MSL 1 Requirements; Lead Finish: 100% Matte Sn (Tin); Pb-Free Package is Available

MBR0530T3GSmall Outline Diode
MBR0530T3GDiode

Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: MBR0530T1 = 3,000 per 7" reel/8 mm tape MBR0530T3 = 10,000 per 13" reel/8 mm tape; Device Marking: B3; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and

MBR130T1GSmall Outline Diode
MBR130T1GDiode

Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

MBR1060GTransistor Outline, Vertical
MBR1060GDiode

Low Forward Voltage; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Power Loss/High Efficiency; Epoxy Meets UL94, VO at 1/8"; 150 °C Operating Junction Temperature; Case: Epoxy, Molded; Low Stored Charge Majority Carrier Conduction Mechanical Characteristics:; Weight: 1.9 grams (approximately); High Surge Capacity; Guard-Ring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Packages are Available

MBR0540T3GSmall Outline Diode
MBR0540T3GDiode

Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

MBR1045GTransistor Outline, Vertical
MBR1045GDiode

Weight: 1.9 grams (approximately); Marking: B1035, B1045; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; 150 C Operating Junction Temperature; Low Forward Voltage; Guardring for Stress Protection; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Case: Epoxy, Molded; Pb-Free Packages are Available

MBR10100GTransistor Outline, Vertical
MBR10100GDiode

Low Forward Voltage; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Power Loss/High Efficiency; Epoxy Meets UL94, VO at 1/8; 150 °C Operating Junction Temperature; Case: Epoxy, Molded; Low Stored Charge Majority Carrier Conduction Mechanical Characteristics:; Weight: 1.9 grams (approximately); High Surge Capacity; Guard-Ring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; AEC-Q101 Qualified and PPAP Capable; NRVB P

MBR0540T1GSmall Outline Diode
MBR0540T1GDiode

Guardring for Stress Protection; Very Low Forward Voltage; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics:; Reel Options: 3,000 per 7 inch reel / 8 mm tape; Reel Options: 10,000 per 13 inch reel / 8 mm tape; Device Marking: B4; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature f

MBR0520LT3GSmall Outline Diode
MBR0520LT3GDiode

Guardring for Stress Protection; Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25 C); 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly Mechanical Characteristics; Reel Options: MBR0520LT1 = 3,000 per 7" reel/8 mm tape. MBR0520LT3 = 10,000 per 13" reel/8 mm tape.; Device Marking: B2; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant and Terminal Lea

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