XC7Z045-1FFG900C XILINX Integrated Circuit (BGA) In Stock
XC7Z045-1FFG900C is a XILINX Integrated Circuit for embedded systems, signal routing, communication interfaces, and control electronics. It combines 0°C to 85°C with BGA with 900 pins. FindMyChip supports technical sourcing, stock checks, and worldwide shipping for this part.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 900
- Lifecycle
- ACTIVE
- Datasheet
- XC7Z045-1FFG900C Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0°C to 85°C key electrical or mechanical rating from supplier data
- BGA with 900 pins package information for PCB and assembly planning
- Integrated Circuit classification for BOM search, sourcing, and alternates review
- Manufacturer-listed XILINX part number for traceable procurement workflows
Applications
XC7Z045-1FFG900C is suited to embedded systems, signal routing, communication interfaces, and control electronics, especially when engineers need 0°C to 85°C and a traceable XILINX sourcing path. It supports repair, prototype, and production purchasing workflows where package, lifecycle, and parameter checks must be reviewed before release.
Specifications
| Factory Lead Time | 16Weeks |
| YTEOL | 14 |
| Combinatorial Delay of a CLB-Max | 1.27ns |
| JESD-30 Code | S-PBGA-B900 |
| Number of CLBs | 27325 |
| Number of Inputs | 490 |
| Number of Logic Cells | 350000 |
| Number of Outputs | 490 |
| Organization | 27325CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA900,30X30,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Programmable Logic Type | FPGA SOC |
| Supply Voltage-Max | 1.05V |
| Supply Voltage-Min | 0.95V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | 28nm |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirements make XC7Z045-1FFG900C a good fit for integrated circuit applications?
XC7Z045-1FFG900C is a XILINX Integrated Circuit that suits embedded systems, signal routing, communication interfaces, and control electronics when the design needs 0°C to 85°C. Engineers should compare the captured supplier parameters with the final datasheet before release.
How should engineers account for package or assembly constraints on XC7Z045-1FFG900C?
The available package data lists BGA with 900 pins, and the relevant rating includes 0°C to 85°C. Check footprint, thermal margin, and assembly notes against the approved datasheet before committing the PCB.
What should procurement teams confirm before quoting XC7Z045-1FFG900C for production builds?
Procurement should confirm quantity, date code, lifecycle status, and acceptable alternates for XC7Z045-1FFG900C. The sourcing review should include 0°C to 85°C so engineering and purchasing evaluate the same requirement.
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