XA7Z030-1FBV484Q XILINX Integrated Circuit (BGA) In Stock
The Xilinx XA7Z030-1FBV484Q is an automotive-grade Zynq-7000 All Programmable SoC combining a dual-core ARM Cortex-A9 processor with Artix-7 FPGA fabric, qualified to AEC-Q100 Grade 1 in a 484-ball FBGA package. Available in stock with worldwide shipping.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 484
- Lifecycle
- ACTIVE
- Datasheet
- XA7Z030-1FBV484Q Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $425.2500(MOQ 1)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- AEC-Q100 Grade 1 automotive qualification ensures reliable operation across -40°C to +125°C junction temperature for in-vehicle applications
- Dual-core ARM Cortex-A9 processor integrated with Artix-7 FPGA fabric enables real-time control combined with hardware acceleration on a single chip
- 484-ball FBGA (FBV-484) package delivers high I/O density with surface-mount BGA assembly for compact automotive ECU boards
- CMOS 28nm technology node provides a balance of processing performance and power efficiency for automotive ADAS and gateway applications
- Xilinx Zynq-7000 platform supports Linux, FreeRTOS, and bare-metal execution on dual 667 MHz ARM cores with tight FPGA co-processing coupling
Applications
The XA7Z030-1FBV484Q is designed for automotive applications such as ADAS vision processing, in-vehicle infotainment gateways, and multi-camera surround-view systems where AEC-Q100 Grade 1 qualification and -40°C to +125°C operation are mandatory. Its combined ARM Cortex-A9 CPU and Artix-7 FPGA fabric support sensor fusion, real-time image processing, and CAN/Ethernet gateway functions in a single SoC, reducing system complexity in domain controllers and telematics units. The 484-ball FBGA package fits high-density PCB designs in advanced driver-assistance modules and automotive compute platforms requiring both software flexibility and hardware-accelerated deterministic processing.
Specifications
| Factory Lead Time | 16Weeks |
| JESD-30 Code | S-PBGA-B484 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Screening Level | AEC-Q100 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | BALL |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What automotive qualification level does the XA7Z030-1FBV484Q meet and what temperature range does this cover?
The XA7Z030-1FBV484Q is qualified to AEC-Q100 Grade 1, which requires reliable operation from -40°C to +125°C junction temperature; this grade is mandatory for under-hood automotive ECUs in powertrain, transmission, and ADAS applications where ambient temperatures routinely exceed 85°C during engine operation.
How does the XA7Z030-1FBV484Q's integrated ARM plus FPGA architecture benefit an automotive ADAS system compared to a standalone DSP?
Combining dual 667 MHz ARM Cortex-A9 cores with Artix-7 FPGA fabric on the same die allows the ADAS system to run a Linux-based perception software stack on the ARM side while offloading pixel-pipeline convolution, lane-marking detection, or sensor timestamping to dedicated FPGA logic operating at 200–400 MHz, achieving lower latency and lower board power than separate DSP and FPGA chips interconnected by high-speed serial interfaces.
How many I/O pins are accessible from the XA7Z030-1FBV484Q's 484-ball FBGA package for connecting automotive sensors and buses?
The FBV-484 package provides up to 200 or more user I/O balls depending on bank configuration, plus dedicated high-speed serial transceivers and DDR memory interface pins; the exact user-I/O count for XA7Z030 in FBV-484 is defined in the Xilinx 7-series package pinout tables, and available banks support 1.2V to 3.3V I/O standards for direct connection to CAN transceivers, LVDS camera interfaces, and 1.8V DDR3L memory.
Which Xilinx tools and IP cores support design development on the XA7Z030-1FBV484Q for an automotive gateway application?
Xilinx Vivado Design Suite with the Vitis embedded software platform fully supports the XA7Z030-1FBV484Q; automotive developers can use Vivado IPI to instantiate AXI4-based IP blocks, the Zynq Processing System IP for ARM Cortex-A9 configuration, and Xilinx-certified safety IP such as lockstep ARM execution monitors to satisfy ISO 26262 ASIL-B system requirements alongside the AEC-Q100 Grade 1 device qualification.
When should a designer choose the XA7Z030-1FBV484Q over the XA7Z020 in an automotive compute module?
The XA7Z030 provides significantly more Artix-7 FPGA fabric than the XA7Z020 — approximately 125K logic cells versus 85K — along with additional DSP48 slices and block RAM, making it the better choice when the application requires heavier image-processing pipelines, more parallel Ethernet MAC instances, or multiple hardware accelerators running simultaneously at 100–300 MHz on the programmable logic side of the automotive gateway or vision-processing module.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $425.2500 | $425.25 |
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