XC6SLX25-2CSG324C XILINX Integrated Circuit (BGA) In Stock
The Xilinx XC6SLX25-2CSG324C is a Spartan-6 FPGA featuring 24051 logic cells and 226 I/O pins in a compact 324-ball CSBGA package. It supports a maximum clock frequency of 667 MHz with a CLB combinatorial delay as low as 0.26 ns. Available from stock with worldwide shipping.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 324
- Lifecycle
- ACTIVE
- Datasheet
- XC6SLX25-2CSG324C Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $73.5360(MOQ 1)
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24051 logic cells with 1879 CLBs and 667 MHz maximum clock frequency for high-performance digital design
- 226 user I/O pins in a 324-ball CSBGA package enabling dense interface connectivity in space-constrained PCB designs
- Spartan-6 architecture with 0.26 ns CLB combinatorial delay supports low-latency signal processing and control applications
Applications
The XC6SLX25-2CSG324C is used in embedded processing, digital signal processing, video and image processing pipelines, and high-speed interface bridging applications. Its 24051 logic cells and 226 I/O pins support medium-complexity FPGA designs including motor control, industrial automation, and protocol conversion between interfaces such as PCIe, Ethernet, or LVDS. The CSBGA-324 package enables compact board footprints suited for portable and space-constrained embedded systems.
Specifications
| Factory Lead Time | 12Weeks |
| YTEOL | 4 |
| Clock Frequency-Max | 667MHz |
| Combinatorial Delay of a CLB-Max | 0.26ns |
| JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 |
| Number of CLBs | 1879 |
| Number of Inputs | 226 |
| Number of Logic Cells | 24051 |
| Number of Outputs | 226 |
| Organization | 1879CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA324,18X18,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS, 40 nm |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.60 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the XC6SLX25-2CSG324C compare to the XC6SLX16 in logic resources for a mid-complexity DSP design?
The XC6SLX25-2CSG324C offers 24051 logic cells and 1879 CLBs, roughly 50% more than the XC6SLX16's 14579 logic cells and 1091 CLBs. This additional capacity allows the SLX25 to implement more complex digital filters, larger FIFOs, and additional pipeline stages in DSP applications operating at up to 667 MHz clock rates, making it preferable when the SLX16 falls short of resource headroom.
Which interface protocols can the 226 I/O pins of the XC6SLX25-2CSG324C support simultaneously on a carrier board?
With 226 user I/O pins distributed across the 324-ball CSBGA footprint, the XC6SLX25-2CSG324C can simultaneously support multiple high-speed interfaces including LVDS differential pairs at up to 667 MHz, parallel memory buses (DDR2/DDR3 up to 16-bit width), and standard serial interfaces such as SPI, I2C, or UART. This makes it suitable for designs requiring concurrent memory, sensor, and communication interface management.
What are the lead-free and JEDEC compliance characteristics of the XC6SLX25-2CSG324C for procurement in regulated markets?
The XC6SLX25-2CSG324C carries a JESD-609 code of e1, indicating a lead-free (Pb-free) RoHS-compliant package finish with a 324-ball PBGA body per JESD-30 code S-PBGA-B324. It is compliant with European RoHS directives, making it eligible for use in end products sold in the EU and other regions requiring elimination of hazardous substances from electronic assemblies.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $73.5360 | $73.54 |
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