XC2C32A-6CPG56C XILINX Integrated Circuit (BGA) In Stock
The XC2C32A-6CPG56C is a 32-macrocell CoolRunner-II CPLD from Xilinx featuring 33 I/O lines and a maximum clock frequency of 300 MHz. It supports JTAG in-system programming and operates in a 56-ball BGA package, delivering ultra-low power consumption with Xilinx Real Digital Design Technology for glitch-free outputs.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- XC2C32A-6CPG56C Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $6.3700(MOQ 720)
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XC2C32A-6CPG56C?
- 32 macrocells with 33 I/O lines enabling dense glue-logic integration in a 56-ball BGA
- 300 MHz maximum clock frequency supports high-speed bus and interface bridging tasks
- Ultra-low standby power via CoolRunner-II 1.8 V core architecture reduces system power budget
- JTAG boundary-scan (IEEE 1149.1) with in-system programmability simplifies field updates
- Xilinx Real Digital Design Technology guarantees glitch-free outputs and deterministic timing
What is XC2C32A-6CPG56C used for?
The XC2C32A-6CPG56C is well suited for glue-logic integration, bus arbitration, and level-translation tasks in embedded systems where a small footprint and low power consumption are priorities. Its 300 MHz clock capability and 33 I/O lines make it ideal for interfacing multiple peripherals in industrial control boards, communications equipment, and consumer electronics. The JTAG in-system programming support also enables rapid prototyping and field firmware updates in deployed hardware.
What are the specifications of XC2C32A-6CPG56C?
| YTEOL | 0 |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY |
| Clock Frequency-Max | 300MHz |
| In-System Programmable | YES |
| JESD-30 Code | S-PBGA-B56 |
| JESD-609 Code | e1 |
| JTAG BST | YES |
| Number of I/O Lines | 33 |
| Number of Macro Cells | 32 |
| Organization | 33I/O |
| Output Function | MACROCELL |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA56,10X10,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Programmable Logic Type | FLASH PLD |
| Propagation Delay | 6ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.9V |
| Supply Voltage-Min | 1.7V |
| Supply Voltage-Nom | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.55 |
| Country of Origin | Taiwan |
Where can I find the XC2C32A-6CPG56C datasheet?
XC2C32A-6CPG56C Datasheet DownloadOfficial datasheet from XILINX
What are equivalent replacements for XC2C32A-6CPG56C?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many macrocells and I/O pins does the XC2C32A-6CPG56C provide for glue-logic designs?
The XC2C32A-6CPG56C provides 32 macrocells and 33 I/O lines, making it compact yet capable of replacing multiple discrete logic gates. Its 300 MHz maximum clock frequency ensures timing margins are met in fast bus interfaces. The 56-ball BGA package keeps the PCB footprint small, typically around 5 mm × 5 mm.
What power supply voltage does the XC2C32A-6CPG56C core require, and how does that affect system power?
The CoolRunner-II XC2C32A-6CPG56C uses a 1.8 V core supply, which significantly reduces dynamic and standby power compared to older 3.3 V CPLD families. Standby current can be as low as 10 µA in ultra-low-power mode, making it suitable for battery-backed control logic in portable and IoT designs. I/O banks are independently configurable to 1.8 V, 2.5 V, or 3.3 V for flexible interfacing.
Which programming interface does XC2C32A-6CPG56C use, and can it be updated in the field?
The device supports JTAG boundary-scan programming per IEEE 1149.1, enabling full in-system programmability without removing the chip from the board. This allows firmware engineers to update the 32-macrocell logic configuration in the field using standard JTAG cables and Xilinx ISE or iMPACT software, reducing re-spin costs during product development and supporting field firmware updates over the product lifecycle.
For a compact motor-control interface board, how does the 56-ball BGA package of XC2C32A-6CPG56C affect layout?
The 56-ball BGA body is approximately 5 mm × 5 mm with a 0.5 mm ball pitch, requiring a 4-layer PCB with micro-vias or via-in-pad techniques to route inner ball signals. Compared to the alternative 44-pin VQFP package, the BGA offers a smaller footprint and shorter signal paths, which is advantageous for 300 MHz clock-sensitive traces. Designers should follow Xilinx BGA fanout guidelines and keep power-bypass capacitors within 2 mm of the VCC balls.
When is XC2C32A-6CPG56C a practical alternative to larger CPLDs or small FPGAs in cost-sensitive designs?
The XC2C32A-6CPG56C is a practical alternative when the design requires fewer than 33 I/O signals and 32 macrocells of combinatorial or registered logic, and where the overhead of an FPGA configuration memory would add cost and complexity. Its deterministic timing and instant-on operation at power-up — no bitstream load delay — make it preferable to FPGAs for boot-sequencing and power management tasks that must resolve within microseconds of supply ramp.
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About XILINX
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 720+ | $6.3700 | $4586.40 |
In Stock · 24h Response · Worldwide Shipping
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