XC2C32A-6CPG56C XILINX Integrated Circuit (BGA) In Stock

The XC2C32A-6CPG56C is a 32-macrocell CoolRunner-II CPLD from Xilinx featuring 33 I/O lines and a maximum clock frequency of 300 MHz. It supports JTAG in-system programming and operates in a 56-ball BGA package, delivering ultra-low power consumption with Xilinx Real Digital Design Technology for glitch-free outputs.

OBSOLETEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
XC2C32A-6CPG56CBGA
Quick Facts
Manufacturer
XILINX
Package
BGA
Pin Count
56
Lifecycle
OBSOLETE
Category
Integrated Circuit
Price
From $6.3700(MOQ 720)
Temp Range
?°C to 70.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 32 macrocells with 33 I/O lines enabling dense glue-logic integration in a 56-ball BGA
  • 300 MHz maximum clock frequency supports high-speed bus and interface bridging tasks
  • Ultra-low standby power via CoolRunner-II 1.8 V core architecture reduces system power budget
  • JTAG boundary-scan (IEEE 1149.1) with in-system programmability simplifies field updates
  • Xilinx Real Digital Design Technology guarantees glitch-free outputs and deterministic timing

Applications

The XC2C32A-6CPG56C is well suited for glue-logic integration, bus arbitration, and level-translation tasks in embedded systems where a small footprint and low power consumption are priorities. Its 300 MHz clock capability and 33 I/O lines make it ideal for interfacing multiple peripherals in industrial control boards, communications equipment, and consumer electronics. The JTAG in-system programming support also enables rapid prototyping and field firmware updates in deployed hardware.

Specifications

YTEOL0
Additional FeatureREAL DIGITAL DESIGN TECHNOLOGY
Clock Frequency-Max300MHz
In-System ProgrammableYES
JESD-30 CodeS-PBGA-B56
JESD-609 Codee1
JTAG BSTYES
Number of I/O Lines33
Number of Macro Cells32
Organization33I/O
Output FunctionMACROCELL
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA56,10X10,20
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Programmable Logic TypeFLASH PLD
Propagation Delay6ns
Qualification StatusNot Qualified
Supply Voltage-Max1.9V
Supply Voltage-Min1.7V
Supply Voltage-Nom1.8V
Surface MountYES
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch0.5mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.31.00.55
Country of OriginTaiwan

Datasheet

XC2C32A-6CPG56C Datasheet Download

Official datasheet from XILINX

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many macrocells and I/O pins does the XC2C32A-6CPG56C provide for glue-logic designs?

The XC2C32A-6CPG56C provides 32 macrocells and 33 I/O lines, making it compact yet capable of replacing multiple discrete logic gates. Its 300 MHz maximum clock frequency ensures timing margins are met in fast bus interfaces. The 56-ball BGA package keeps the PCB footprint small, typically around 5 mm × 5 mm.

What power supply voltage does the XC2C32A-6CPG56C core require, and how does that affect system power?

The CoolRunner-II XC2C32A-6CPG56C uses a 1.8 V core supply, which significantly reduces dynamic and standby power compared to older 3.3 V CPLD families. Standby current can be as low as 10 µA in ultra-low-power mode, making it suitable for battery-backed control logic in portable and IoT designs. I/O banks are independently configurable to 1.8 V, 2.5 V, or 3.3 V for flexible interfacing.

Which programming interface does XC2C32A-6CPG56C use, and can it be updated in the field?

The device supports JTAG boundary-scan programming per IEEE 1149.1, enabling full in-system programmability without removing the chip from the board. This allows firmware engineers to update the 32-macrocell logic configuration in the field using standard JTAG cables and Xilinx ISE or iMPACT software, reducing re-spin costs during product development and supporting field firmware updates over the product lifecycle.

For a compact motor-control interface board, how does the 56-ball BGA package of XC2C32A-6CPG56C affect layout?

The 56-ball BGA body is approximately 5 mm × 5 mm with a 0.5 mm ball pitch, requiring a 4-layer PCB with micro-vias or via-in-pad techniques to route inner ball signals. Compared to the alternative 44-pin VQFP package, the BGA offers a smaller footprint and shorter signal paths, which is advantageous for 300 MHz clock-sensitive traces. Designers should follow Xilinx BGA fanout guidelines and keep power-bypass capacitors within 2 mm of the VCC balls.

When is XC2C32A-6CPG56C a practical alternative to larger CPLDs or small FPGAs in cost-sensitive designs?

The XC2C32A-6CPG56C is a practical alternative when the design requires fewer than 33 I/O signals and 32 macrocells of combinatorial or registered logic, and where the overhead of an FPGA configuration memory would add cost and complexity. Its deterministic timing and instant-on operation at power-up — no bitstream load delay — make it preferable to FPGAs for boot-sequencing and power management tasks that must resolve within microseconds of supply ramp.

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About XILINX

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AvailabilityIn Stock
Reference Price (USD)
From $6.3700
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
720+$6.3700$4586.40
pcs
Unit price: $6.3700 · Total: $4586.40

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy