MSP430F5658IZQWT Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments MSP430F5658IZQWT is a SEARAY high-speed board-to-board array connector. It provides 113 positions on a .050 in pitch open-pin-field terminal. From inquiry pricing, request current stock for worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 113
- Lifecycle
- OBSOLETE
- Datasheet
- MSP430F5658IZQWT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of MSP430F5658IZQWT?
- 113-position SEARAY open-pin-field array terminal for dense board-to-board interconnects
- .050 in pitch contact layout supports compact high-speed mezzanine and stacking designs
- production ordering configuration supports production purchasing and automated assembly planning
- Texas Instruments connector family with datasheet-backed SEAM mechanical configuration
What is MSP430F5658IZQWT used for?
This connector is used in compact mezzanine, communications, test, and embedded control boards that need dense board-to-board signal routing. It fits production builds where 113 positions, a .050 in pitch, and production ordering configuration help simplify high-density PCB assembly.
What are the specifications of MSP430F5658IZQWT?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Additional Feature | OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE |
| Bit Size | 16 |
| Boundary Scan | YES |
| CPU Family | MSP430 |
| Clock Frequency-Max | 32MHz |
| DAC Channels | YES |
| DMA Channels | YES |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-PBGA-B113 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of DMA Channels | 6 |
| Number of External Interrupts | 8 |
| Number of I/O Lines | 74 |
| Number of Serial I/Os | 2 |
| Number of Timers | 4 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA113,12X12,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 32768 |
| RAM (words) | 32 |
| ROM (words) | 393216 |
| ROM Programmability | FLASH |
| Speed | 20MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3.3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Where can I find the MSP430F5658IZQWT datasheet?
MSP430F5658IZQWT Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for MSP430F5658IZQWT?
Compatible alternatives and drop-in replacements for MSP430F5658IZQWT:
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
Frequently Asked Questions
How much processing headroom does MSP430F5658IZQWT offer for low-power embedded control?
MSP430F5658IZQWT is based on the 16-bit MSP430 CPU family and lists a 32 MHz maximum clock frequency for control, sensing, and communication workloads.
Which supply condition should designers check when using USB-related SRAM options?
The fetched specs note operation at 1.8V minimum supply at 8 MHz, with an additional 2KB SRAM available when USB is not in use.
Does this MCU include mixed-signal resources for sensor interface boards?
Yes, the context lists ADC support, DAC channels, and DMA channels, giving designers multiple integrated resources around the 16-bit MSP430 core for data-acquisition products.
What packaging consideration affects assembly planning for MSP430F5658IZQWT?
The fetched package type is BGA, so buyers should confirm soldering capability, X-ray inspection access, and board layout rules before committing it to 32 MHz MCU production builds.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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