MSP430F6659IZQWT Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments MSP430F6659IZQWT is a 16-bit ultra-low-power RISC microcontroller with 512 KB Flash, 32 MHz clock, integrated USB, and ADC in a 113-pin BGA package for demanding portable applications. Available from stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
MSP430F6659IZQWTBGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
113
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of MSP430F6659IZQWT?

  • 512 KB Flash and 32 MHz MSP430 RISC core with DMA and boundary scan deliver ample processing performance for data-intensive IoT firmware
  • Integrated USB controller eliminates external USB bridge chips, reducing BOM cost and board space in USB-connected instruments
  • 1.8 V minimum supply at 8 MHz with ultra-low active and standby currents enables multi-year coin-cell battery life in metering applications

What is MSP430F6659IZQWT used for?

The MSP430F6659IZQWT targets energy-harvesting and battery-powered embedded systems such as smart meters, medical monitors, and industrial data loggers that demand high integration with minimum power consumption. Its 512 KB Flash supports complex firmware stacks including USB HID or CDC class drivers while the on-chip ADC handles precision sensor acquisition without external converters. The 113-pin BGA package accommodates the rich peripheral set needed for portable medical devices, handheld test equipment, and wireless sensor nodes.

What are the specifications of MSP430F6659IZQWT?

Pbfree CodeYes
YTEOL0
Has ADCYES
Additional FeatureOPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE
Bit Size16
Boundary ScanYES
CPU FamilyMSP430
Clock Frequency-Max32MHz
DAC ChannelsYES
DMA ChannelsYES
FormatFIXED POINT
Integrated CacheNO
JESD-30 CodeS-PBGA-B113
JESD-609 Codee1
Low Power ModeYES
Number of DMA Channels6
Number of External Interrupts8
Number of I/O Lines74
Number of Serial I/Os2
Number of Timers4
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA113,12X12,20
Package ShapeSQUARE
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
RAM (bytes)65536
RAM (words)64
ROM (words)524288
ROM ProgrammabilityFLASH
Speed20MHz
Supply Voltage-Max3.6V
Supply Voltage-Min3.3V
Supply Voltage-Nom3.3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch0.5mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCNEAR99
HTS Code8542.31.00.01

Where can I find the MSP430F6659IZQWT datasheet?

MSP430F6659IZQWT Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for MSP430F6659IZQWT?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which processing and memory resources distinguish MSP430F6659IZQWT?

The microcontroller combines a 16-bit MSP430 core, up to 32 MHz clocking, and 512 KB Flash for feature-rich low-power embedded firmware.

Can this device support USB-connected portable instrumentation?

Yes, its integrated USB capability, ADC resources, and 16-bit architecture suit portable instruments when the design meets the 1.8 V supply conditions.

What package check is essential before approving it as a board replacement?

Confirm the 113-pin BGA footprint, ball map, memory configuration, and complete MSP430F6659IZQWT suffix before accepting it into an existing PCB design.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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