LM3S9B95-IBZ80-C3T Texas Instruments Integrated Circuit (BGA) In Stock

The LM3S9B95-IBZ80-C3T is a 32-bit ARM Cortex-M3 Stellaris microcontroller from Texas Instruments with integrated ADC, DMA, USB, Ethernet, and CAN peripherals. It operates at up to 80 MHz core clock and is packaged in a 108-ball BGA. Suited for industrial networking, embedded control, and connected automation applications.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
LM3S9B95-IBZ80-C3TBGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
108
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LM3S9B95-IBZ80-C3T?

  • 32-bit ARM Cortex-M3 core running at up to 80 MHz for real-time control tasks
  • Integrated Ethernet MAC/PHY, USB OTG, and CAN for multi-protocol connectivity
  • Multi-channel 12-bit ADC with hardware averaging for precision analog sensing
  • DMA controller offloads data transfers to reduce CPU overhead
  • 108-ball BGA package for compact high-density PCB designs
  • RoHS compliant with JESD-609 e1 moisture classification

What is LM3S9B95-IBZ80-C3T used for?

The LM3S9B95-IBZ80-C3T targets industrial Ethernet-connected controllers, factory automation gateways, and embedded HMI systems that need simultaneous USB, CAN, and Ethernet communication from a single MCU. Its 32-bit Cortex-M3 core at 80 MHz provides ample throughput for real-time control loops running alongside network stacks. Building automation controllers, motor drive systems with fieldbus connectivity, and data-acquisition instruments commonly deploy this Stellaris device.

What are the specifications of LM3S9B95-IBZ80-C3T?

Pbfree CodeYes
YTEOL0
Has ADCYES
Bit Size32
Boundary ScanNO
Clock Frequency-Max0.032MHz
DAC ChannelsNO
DMA ChannelsYES
JESD-30 CodeS-PBGA-B108
JESD-609 Codee1
Number of I/O Lines65
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA108,12X12,32
Package ShapeSQUARE
Package StyleGRID ARRAY
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
RAM (bytes)98304
ROM (words)262144
ROM ProgrammabilityFLASH
Speed80MHz
Supply Voltage-Max1.32V
Supply Voltage-Min1.2V
Supply Voltage-Nom1.2V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch0.8mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.31.00.25

Where can I find the LM3S9B95-IBZ80-C3T datasheet?

LM3S9B95-IBZ80-C3T Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for LM3S9B95-IBZ80-C3T?

Compatible alternatives and drop-in replacements for LM3S9B95-IBZ80-C3T:

LM3S9B95-IBZ80-C5TTexas Instruments

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 80MHz, CMOS, PBGA108

View Part →
LM3S9B95-IBZ80-C1Texas Instruments Microcontroller,

32-Bit, FLASH, 80MHz, CMOS, PBGA108

View Part →
LM3S9B95-IBZ80-C3Texas Instruments

RISC Microcontroller, 32-Bit, FLASH, 80MHz, CMOS, PBGA108

View Part →
LM3S9B92-IBZ80-C3Texas Instruments

RISC Microcontroller, 32-Bit, FLASH, 80MHz, CMOS, PBGA108

View Part →

Frequently Asked Questions

What is the maximum core clock frequency of the LM3S9B95-IBZ80-C3T, and which communication peripherals does it integrate?

The LM3S9B95-IBZ80-C3T operates at up to 80 MHz and integrates Ethernet MAC/PHY, USB OTG, and CAN bus peripherals on a single 32-bit ARM Cortex-M3 die, eliminating the need for external network bridge chips in industrial automation designs.

How does the LM3S9B95-IBZ80-C3T DMA controller help high-throughput data-acquisition designs?

The built-in DMA controller moves data between the 12-bit ADC, memory, and communication peripherals without CPU intervention, freeing the 80 MHz Cortex-M3 core to execute control algorithms while continuous data transfers proceed in parallel.

What package does the LM3S9B95-IBZ80-C3T come in, and what board assembly process does it require?

The device is packaged in a 108-ball BGA with a 0.5 mm or 0.8 mm ball pitch, which requires reflow-oven surface-mount assembly and X-ray inspection for solder joint verification — a process standard for high-density industrial control PCBs.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
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OriginChina (Authorized)

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