LM3S9B95-IBZ80-C3T Texas Instruments Integrated Circuit (BGA) In Stock
The LM3S9B95-IBZ80-C3T is a 32-bit ARM Cortex-M3 Stellaris microcontroller from Texas Instruments with integrated ADC, DMA, USB, Ethernet, and CAN peripherals. It operates at up to 80 MHz core clock and is packaged in a 108-ball BGA. Suited for industrial networking, embedded control, and connected automation applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S9B95-IBZ80-C3T Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S9B95-IBZ80-C3T?
- 32-bit ARM Cortex-M3 core running at up to 80 MHz for real-time control tasks
- Integrated Ethernet MAC/PHY, USB OTG, and CAN for multi-protocol connectivity
- Multi-channel 12-bit ADC with hardware averaging for precision analog sensing
- DMA controller offloads data transfers to reduce CPU overhead
- 108-ball BGA package for compact high-density PCB designs
- RoHS compliant with JESD-609 e1 moisture classification
What is LM3S9B95-IBZ80-C3T used for?
The LM3S9B95-IBZ80-C3T targets industrial Ethernet-connected controllers, factory automation gateways, and embedded HMI systems that need simultaneous USB, CAN, and Ethernet communication from a single MCU. Its 32-bit Cortex-M3 core at 80 MHz provides ample throughput for real-time control loops running alongside network stacks. Building automation controllers, motor drive systems with fieldbus connectivity, and data-acquisition instruments commonly deploy this Stellaris device.
What are the specifications of LM3S9B95-IBZ80-C3T?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 65 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 98304 |
| ROM (words) | 262144 |
| ROM Programmability | FLASH |
| Speed | 80MHz |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.2V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S9B95-IBZ80-C3T datasheet?
LM3S9B95-IBZ80-C3T Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S9B95-IBZ80-C3T?
Compatible alternatives and drop-in replacements for LM3S9B95-IBZ80-C3T:
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 80MHz, CMOS, PBGA108
Frequently Asked Questions
What is the maximum core clock frequency of the LM3S9B95-IBZ80-C3T, and which communication peripherals does it integrate?
The LM3S9B95-IBZ80-C3T operates at up to 80 MHz and integrates Ethernet MAC/PHY, USB OTG, and CAN bus peripherals on a single 32-bit ARM Cortex-M3 die, eliminating the need for external network bridge chips in industrial automation designs.
How does the LM3S9B95-IBZ80-C3T DMA controller help high-throughput data-acquisition designs?
The built-in DMA controller moves data between the 12-bit ADC, memory, and communication peripherals without CPU intervention, freeing the 80 MHz Cortex-M3 core to execute control algorithms while continuous data transfers proceed in parallel.
What package does the LM3S9B95-IBZ80-C3T come in, and what board assembly process does it require?
The device is packaged in a 108-ball BGA with a 0.5 mm or 0.8 mm ball pitch, which requires reflow-oven surface-mount assembly and X-ray inspection for solder joint verification — a process standard for high-density industrial control PCBs.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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