LM3S9B92-IBZ80-C3 Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments LM3S9B92 is a 32-bit ARM Cortex-M3 microcontroller operating at up to 80 MHz with 256 KB flash, integrated USB, Ethernet MAC/PHY, and rich analog peripherals. Available in BGA-108 package with extended temperature support.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
LM3S9B92-IBZ80-C3BGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
108
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of LM3S9B92-IBZ80-C3?

  • 32-bit ARM Cortex-M3 core running at up to 80 MHz for high-performance embedded control
  • Integrated full-speed USB 2.0 OTG controller and 10/100 Ethernet MAC/PHY in a single device
  • 256 KB flash and 96 KB SRAM with DMA controller for efficient data-intensive applications

What is LM3S9B92-IBZ80-C3 used for?

The LM3S9B92 is well-suited for industrial automation systems, networked sensor nodes, and motor-control platforms that require Ethernet and USB connectivity in a compact 108-ball BGA footprint. Its 80 MHz Cortex-M3 core combined with on-chip ADC, PWM, and CAN peripherals makes it a strong fit for real-time control tasks. Energy-metering equipment and building-automation controllers also benefit from its rich communication interface set.

What are the specifications of LM3S9B92-IBZ80-C3?

Pbfree CodeYes
YTEOL0
Has ADCYES
Bit Size32
Boundary ScanNO
Clock Frequency-Max0.032MHz
DAC ChannelsNO
DMA ChannelsYES
JESD-30 CodeS-PBGA-B108
JESD-609 Codee1
Number of I/O Lines65
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA108,12X12,32
Package ShapeSQUARE
Package StyleGRID ARRAY
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
RAM (bytes)98304
ROM (words)262144
ROM ProgrammabilityFLASH
Speed80MHz
Supply Voltage-Max1.32V
Supply Voltage-Min1.2V
Supply Voltage-Nom1.2V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch0.8mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.31.00.25

Where can I find the LM3S9B92-IBZ80-C3 datasheet?

LM3S9B92-IBZ80-C3 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for LM3S9B92-IBZ80-C3?

Compatible alternatives and drop-in replacements for LM3S9B92-IBZ80-C3:

LM3S9B92-IBZ80-C5Texas Instruments

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 80MHz, CMOS, PBGA108

View Part →
LM3S9B95-IBZ80-C3Texas Instruments

RISC Microcontroller, 32-Bit, FLASH, 80MHz, CMOS, PBGA108

View Part →
LM3S9B95-IBZ80-C3TTexas Instruments

RISC Microcontroller, 32-Bit, FLASH, 80MHz, CMOS, PBGA108

View Part →

Frequently Asked Questions

What core frequency and flash size does the LM3S9B92 provide for real-time control tasks?

The LM3S9B92 features a 32-bit ARM Cortex-M3 core clocked at up to 80 MHz paired with 256 KB of on-chip flash and 96 KB of SRAM, enabling deterministic real-time control loops with fast interrupt latencies below 12 clock cycles.

Which communication interfaces are integrated in the LM3S9B92, and how do they help reduce BOM cost?

The device integrates a 10/100 Ethernet MAC/PHY, full-speed USB 2.0 OTG, CAN 2.0B, and multiple UART/SPI/I2C ports, eliminating the need for external network-interface chips and reducing BOM cost by 3–5 components on a typical industrial board.

For a space-constrained PCB, what package dimensions and ball pitch does the BGA-108 offer?

The BGA-108 package (JEDEC MO-219F) uses a 0.5 mm ball pitch in a compact body, occupying significantly less board area than a 128-pin LQFP, making it suitable for designs with less than 100 mm² allocated to the processor.

When would the LM3S9B92-IBZ80-C3 be preferred over a lower-end LM3S5000-series device?

The LM3S9B92 is preferred when a design requires both on-chip Ethernet PHY and USB OTG at 80 MHz with 256 KB flash; the LM3S5000 series tops out at 50 MHz and lacks an integrated Ethernet PHY, requiring an external chip and extra 3.3 V supply current of roughly 150 mA.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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OriginChina (Authorized)

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