LM3S9B95-IBZ80-C3 Texas Instruments Integrated Circuit (BGA) In Stock
The LM3S9B95-IBZ80-C3 is a 32-bit ARM Cortex-M3 microcontroller from Texas Instruments featuring an 80 MHz CPU, integrated ADC, and DMA channels in a 108-ball BGA package. It offers rich on-chip peripherals including CAN, Ethernet, and USB for connected industrial applications. Operating across industrial temperature ranges with a compact BGA-108 footprint.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 108
- Lifecycle
- OBSOLETE
- Datasheet
- LM3S9B95-IBZ80-C3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of LM3S9B95-IBZ80-C3?
- 32-bit ARM Cortex-M3 core running at up to 80 MHz delivering high processing throughput for real-time control and industrial applications
- Integrated 12-bit ADC and multiple DMA channels enabling efficient sensor data acquisition without burdening the CPU
- On-chip CAN, Ethernet MAC, and USB interfaces in a 108-ball BGA package supporting diverse connectivity requirements in embedded systems
What is LM3S9B95-IBZ80-C3 used for?
The LM3S9B95-IBZ80-C3 is designed for industrial control applications such as motor drives, PLC I/O modules, and building automation controllers that require deterministic 32-bit processing at 80 MHz with integrated connectivity. Its on-chip Ethernet MAC and CAN controller make it well suited for networked factory-floor nodes and automotive body electronics where multiple fieldbus protocols must coexist. The device also fits data-acquisition systems that leverage the built-in 12-bit ADC and DMA to continuously stream multi-channel analog measurements to memory without software overhead.
What are the specifications of LM3S9B95-IBZ80-C3?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 32 |
| Boundary Scan | NO |
| Clock Frequency-Max | 0.032MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PBGA-B108 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 65 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA108,12X12,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 98304 |
| ROM (words) | 262144 |
| ROM Programmability | FLASH |
| Speed | 80MHz |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.2V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the LM3S9B95-IBZ80-C3 datasheet?
LM3S9B95-IBZ80-C3 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for LM3S9B95-IBZ80-C3?
Compatible alternatives and drop-in replacements for LM3S9B95-IBZ80-C3:
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 80MHz, CMOS, PBGA108
Frequently Asked Questions
What is the maximum CPU clock speed of the LM3S9B95-IBZ80-C3, and which ARM core does it use?
The LM3S9B95-IBZ80-C3 uses a 32-bit ARM Cortex-M3 core clocked at up to 80 MHz, providing deterministic real-time performance suitable for motor control, industrial automation, and networked embedded systems. At 80 MHz the device executes most instructions in a single cycle, delivering approximately 100 DMIPS of throughput.
Which communication interfaces are integrated in the LM3S9B95-IBZ80-C3 for industrial networking?
The LM3S9B95-IBZ80-C3 integrates an Ethernet 10/100 MAC, a CAN 2.0 B controller, USB OTG, and standard UARTs and SPI buses on a single chip. This combination allows a single device to bridge industrial fieldbus (CAN) and Ethernet networks simultaneously, which is common in industrial gateways and building-management controllers. The 108-ball BGA-108 package routes all these interfaces with manageable PCB complexity.
How does the BGA-108 package of LM3S9B95-IBZ80-C3 affect PCB design compared to a QFP alternative?
The BGA-108 package uses a roughly 10 mm × 10 mm land array with 0.8 mm ball pitch, which is smaller than a comparable 108-pin QFP and reduces signal path lengths for high-speed interfaces. However it requires at least 4-layer PCB with controlled-impedance inner layers and via-in-pad or dog-bone fanout. For volume industrial designs the BGA-108 offers a size and EMI advantage over large-body QFPs while keeping assembly costs manageable with standard reflow processes.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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