AS4C32M16D1-5TIN Alliance Memory Integrated Circuit (Small Outline Packages) In Stock
AS4C32M16D1-5TIN is a memory IC from Alliance Memory for production electronic assemblies. Key specs include Small Outline Packages. From quote-based pricing, in stock worldwide shipping.
- Manufacturer
- Alliance Memory
- Package
- Small Outline Packages
- Pin Count
- 66
- Lifecycle
- OBSOLETE
- Datasheet
- AS4C32M16D1-5TIN Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Small Outline Packages package or series format for assembly and replacement matching
- Alliance Memory AS4C32M16D1-5TIN ordering identity for traceable procurement
- Suitable for production builds, service spares, and approved-vendor substitutions
Applications
AS4C32M16D1-5TIN is used in embedded electronics, industrial equipment, communications boards, instrumentation, and production repair workflows. The Small Outline Packages profile helps buyers match electrical, package, and lifecycle requirements across approved BOMs.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 0.7ns |
| Additional Feature | AUTO/SELF REFRESH |
| JESD-30 Code | R-PDSO-G66 |
| JESD-609 Code | e3/e6 |
| Memory Density | 536870912bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Words | 33554432words |
| Number of Words Code | 32000000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 32MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE |
| Self Refresh | YES |
| Supply Voltage-Max (Vsup) | 2.7V |
| Supply Voltage-Min (Vsup) | 2.3V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.28 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does AS4C32M16D1-5TIN support approved-BOM continuity?
AS4C32M16D1-5TIN preserves continuity when the design needs the same Alliance Memory part identity and Small Outline Packages. Maintaining the 3V match helps purchasing avoid unapproved alternates.
What should be checked when replacing a similar part with AS4C32M16D1-5TIN?
Review the datasheet, footprint, orientation, and Small Outline Packages before substituting. A small change in 3V can affect fit, electrical behavior, or final inspection acceptance.
Where is this memory IC commonly used in a production build?
This memory IC is commonly used on control boards, embedded modules, fixtures, and service assemblies that require Small Outline Packages. The 3V characteristic should stay aligned with the released BOM.
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Why Buy from FindMyChip
About Alliance Memory
Alliance Memory is a leading electronic component manufacturer. FindMyChip sources Alliance Memory ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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