AS4C256M16D3LA-12BIN Alliance Memory Integrated Circuit (BGA) In Stock

AS4C256M16D3LA-12BIN is a DDR3L DRAM memory IC in a 96-ball FBGA package. It provides 4 Gbit density, x16 width, multi-bank burst access, and auto/self refresh. From $ pricing, in stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
AS4C256M16D3LA-12BINBGA
Quick Facts
Manufacturer
Alliance Memory
Package
BGA
Pin Count
96
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of AS4C256M16D3LA-12BIN?

  • 4 Gbit DDR3L DRAM density for high-capacity volatile memory designs
  • x16 memory width supporting efficient data transfer in embedded systems
  • Multi-bank page burst access for higher bandwidth memory transactions
  • Auto-refresh and self-refresh features help reduce controller overhead
  • 96-ball FBGA package suited for compact high-density PCB layouts

What is AS4C256M16D3LA-12BIN used for?

AS4C256M16D3LA-12BIN is used in embedded computing, networking, industrial control, video processing, and storage equipment that needs dense DDR3L working memory. It fits designs requiring a 4 Gbit x16 DRAM with compact FBGA mounting and refresh support for reliable high-throughput operation.

What are the specifications of AS4C256M16D3LA-12BIN?

Pbfree CodeYes
YTEOL0
Access ModeMULTI BANK PAGE BURST
Additional FeatureAUTO/SELF REFRESH
JESD-30 CodeR-PBGA-B96
Memory Density4294967296bit
Memory IC TypeDDR3L DRAM
Memory Width16
Number of Functions1
Number of Ports1
Number of Words268435456words
Number of Words Code256000000
Operating ModeSYNCHRONOUS
Organization256MX16
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Self RefreshYES
Supply Voltage-Max (Vsup)1.45V
Supply Voltage-Min (Vsup)1.283V
Supply Voltage-Nom (Vsup)1.35V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormBALL
Terminal Pitch0.8mm
Terminal PositionBOTTOM
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCNEAR99
HTS Code8542.32.00.36

Where can I find the AS4C256M16D3LA-12BIN datasheet?

AS4C256M16D3LA-12BIN Datasheet Download

Official datasheet from Alliance Memory

What are equivalent replacements for AS4C256M16D3LA-12BIN?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How should engineers evaluate the memory capacity and bus width for AS4C256M16D3LA-12BIN?

This device is a DDR3L DRAM with 4294967296 bit memory density and a 16-bit data width, making it suitable for embedded systems that need substantial working memory bandwidth.

Which assembly details matter when planning this Alliance Memory DDR3L footprint?

The part uses a 96 pins FBGA-style package identified by JESD-30 code R-PBGA-B96, so buyers should confirm PCB footprint, reflow profile, and placement capability before release.

For which product builds is this Alliance Memory device a practical sourcing choice?

It fits networking, video, industrial, and storage designs that need 4294967296 bit DDR3L memory, multi-bank burst operation, and auto-refresh or self-refresh support in production.

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Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About Alliance Memory

Alliance Memory is a leading electronic component manufacturer. FindMyChip sources Alliance Memory ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.

TM
Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany