AS4C256M16D3L-12BIN Alliance Memory Integrated Circuit (BGA) In Stock
Alliance Memory AS4C256M16D3L-12BIN is a 4 Gb DDR3L DRAM. It uses x16 width, auto/self refresh, and 96-ball 9 x 13 mm FBGA. From $ pricing, in-stock sourcing, worldwide shipping via FindMyChip.
- Manufacturer
- Alliance Memory
- Package
- BGA
- Pin Count
- 96
- Lifecycle
- OBSOLETE
- Datasheet
- AS4C256M16D3L-12BIN Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of AS4C256M16D3L-12BIN?
- 4 Gb DDR3L DRAM density for high-capacity embedded memory designs
- x16 data width with multi-bank page burst access mode
- Auto/self refresh support for standard DDR3L controller operation
- 96-ball FBGA package with 9 x 13 mm body and 1.20 mm height
- Halogen-free and RoHS-compliant construction for controlled BOM requirements
What is AS4C256M16D3L-12BIN used for?
AS4C256M16D3L-12BIN is suited to embedded computing, networking, industrial controls, video equipment, and storage products that need high-density DDR3L memory. It is commonly designed beside processors, FPGAs, or memory controllers requiring a 16-bit external DRAM interface.
What are the specifications of AS4C256M16D3L-12BIN?
| YTEOL | 0 |
| Access Mode | MULTI BANK PAGE BURST |
| Additional Feature | AUTO/SELF REFRESH |
| JESD-30 Code | R-PBGA-B96 |
| Memory Density | 4294967296bit |
| Memory IC Type | DDR3L DRAM |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Words | 268435456words |
| Number of Words Code | 256000000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 256MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Self Refresh | YES |
| Supply Voltage-Max (Vsup) | 1.45V |
| Supply Voltage-Min (Vsup) | 1.283V |
| Supply Voltage-Nom (Vsup) | 1.35V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.36 |
Where can I find the AS4C256M16D3L-12BIN datasheet?
AS4C256M16D3L-12BIN Datasheet DownloadOfficial datasheet from Alliance Memory
What are equivalent replacements for AS4C256M16D3L-12BIN?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How should AS4C256M16D3L-12BIN be evaluated for capacity-sensitive DDR3L designs?
It provides 4 Gb density with a 16-bit data interface, so buyers should confirm controller timing, refresh requirements, and memory-map needs before approval.
Which board layout checks matter before approving the FBGA footprint?
The device uses a 96-pin FBGA package with a 9 x 13 body, so pad geometry, escape routing, and assembly rules should match the PCB design.
How does this part support controlled-material procurement requirements?
The fetched context identifies the device as halogen free and RoHS compliant, giving procurement teams a 4 Gb DDR3L option for restricted-material BOM controls.
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Why Buy from FindMyChip
About Alliance Memory
Alliance Memory is a leading electronic component manufacturer. FindMyChip sources Alliance Memory ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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