25LC256-I/STGAlternatives & Equivalent Parts
About 25LC256-I/STG
25LC256-I/STG is a Integrated Circuit component manufactured by Microchip. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | 25LC256-I/STGSource | 25LC256-I/ST | 25LC256-I/SNG | 25LC256-I/SN |
|---|---|---|---|---|
| Manufacturer | Microchip | Microchip | Microchip | Microchip |
| Package Type | Small Outline Packages | Small Outline Packages | Other | Small Outline Packages |
| Pin Count | 8 | 8 | 8 | 8 |
| Temperature Range | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | — | $0.6700 | — | $1.2907 |
| Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | ||||
| Pbfree Code | Yes | Yes | Yes | Yes |
| YTEOL | 5 | 8 | 5 | 8 |
| Clock Frequency-Max (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| Data Retention Time-Min | 200 | 200 | 200 | 200 |
| Endurance | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 Code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 Code | e3 | e3 | e3 | e3 |
| Memory Density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| Memory Width | 8 | 8 | 8 | 8 |
| Number of Functions | 1 | 1 | 1 | 1 |
| Number of Words | 32768 words | 32768 words | 32768 words | 32768 words |
| Number of Words Code | 32000 | 32000 | 32000 | 32000 |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Organization | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.23 |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 | 260 |
| Qualification Status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Serial Bus Type | SPI | SPI | SPI | SPI |
| Standby Current-Max | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| Supply Current-Max | 0.005 mA | 0.006 mA | 0.005 mA | 0.006 mA |
| Supply Voltage-Max (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Supply Voltage-Min (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Supply Voltage-Nom (Vsup) | 4.5 V | 5 V | 4.5 V | 5 V |
| Surface Mount | YES | YES | YES | YES |
| Technology | CMOS | CMOS | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal Form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 | 40 | 40 | — |
| Write Cycle Time-Max (tWC) | 5 ms | 5 ms | 5 ms | 5 ms |
| Write Protection | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Manufacturer Package Code | — | TSSOP-8 | — | SOIC-8 |
| Factory Lead Time | — | 6 Weeks | — | 6 Weeks |
| Number of Ports | — | 1 | — | 1 |
| Output Characteristics | — | 3-STATE | — | 3-STATE |
| Programming Voltage | — | 2.5 V | — | 2.5 V |
| Reverse Pinout | — | NO | — | NO |
| Screening Level | — | AEC-Q100 | — | AEC-Q100 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 3 alternatives for 25LC256-I/STG — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for 25LC256-I/STG is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating 25LC256-I/STG replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to 25LC256-I/STG?
Known equivalents for 25LC256-I/STG include 25LC256-I/ST, 25LC256-I/SNG, 25LC256-I/SN. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of 25LC256-I/STG?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify 25LC256-I/STG alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.