25LC256-I/SNG Microchip Integrated Circuit (Other) In Stock
Microchip 25LC256-I/SNG is a 256 Kbit SPI serial EEPROM in an 8-pin SOIC package operating up to 10 MHz. It offers 1,000,000 write/erase cycle endurance, 200-year data retention, and byte or page write modes, ideal for non-volatile data storage in embedded systems.
- Manufacturer
- Microchip
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- 25LC256-I/SNG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 25LC256-I/SNG?
- 256 Kbit (32 KB) SPI serial EEPROM with up to 10 MHz clock frequency
- 1,000,000 write/erase cycle endurance for high-reliability data logging
- 200-year minimum data retention time
- 8-bit wide memory interface with byte and page write capabilities
- SPI bus interface compatible with most microcontroller platforms
- Compact 8-pin SOIC package for space-constrained PCB designs
What is 25LC256-I/SNG used for?
The 25LC256-I/SNG is ideal for storing non-volatile configuration data, calibration parameters, and event logs in embedded microcontroller systems communicating over SPI. Its 256 Kbit capacity and 10 MHz SPI speed make it a practical choice for data logging applications in industrial sensors, medical devices, and consumer electronics. The 1,000,000 write/erase endurance supports frequent updates in automotive and industrial environments where reliable parameter storage is critical.
What are the specifications of 25LC256-I/SNG?
| Pbfree Code | Yes |
| YTEOL | 5 |
| Clock Frequency-Max (fCLK) | 10MHz |
| Data Retention Time-Min | 200 |
| Endurance | 1000000 Write/Erase Cycles |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Memory Density | 262144bit |
| Memory IC Type | EEPROM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Words | 32768words |
| Number of Words Code | 32000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 32KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Serial Bus Type | SPI |
| Standby Current-Max | 0.000001A |
| Supply Current-Max | 0.005mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Write Cycle Time-Max (tWC) | 5ms |
| Write Protection | HARDWARE/SOFTWARE |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
| Country of Origin | Thailand |
Where can I find the 25LC256-I/SNG datasheet?
25LC256-I/SNG Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for 25LC256-I/SNG?
Compatible alternatives and drop-in replacements for 25LC256-I/SNG:
Frequently Asked Questions
Which designs can use 25LC256-I/SNG when 8 pins is a required parameter?
25LC256-I/SNG is a practical fit when the design needs 8 pins in a integrated circuit from Microchip. Buyers should confirm the package, lifecycle state, and original datasheet before approving it for production builds.
How should buyers compare 25LC256-I/SNG with alternate integrated circuit options?
Use -40°C to 85°C as one verified requirement, then match the electrical ratings, footprint, and manufacturer series against the target BOM. This reduces substitution risk when similar parts differ in assembly or operating limits.
Which assembly detail should be checked before sourcing 25LC256-I/SNG for production?
Confirm that the selected lot matches SOIC and the known 256 Kb requirement before RFQ approval. This gives incoming inspection and engineering teams a clearer basis for footprint, mating, or thermal review.
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