25LC256-I/STG Microchip Integrated Circuit (Small Outline Packages) In Stock
The 25LC256-I/STG is a 256 Kbit SPI-compatible EEPROM from Microchip in an 8-pin SOIC package, supporting up to 10 MHz clock speed, 1,000,000 write/erase cycles, and 200-year data retention for reliable non-volatile storage.
- Manufacturer
- Microchip
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- 25LC256-I/STG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 256 Kbit (32K x 8) EEPROM with SPI interface up to 10 MHz
- 1,000,000 guaranteed write/erase endurance cycles
- Data retention exceeding 200 years
- 8-pin SOIC surface-mount package for compact PCB designs
- 2.5V to 5.5V wide supply voltage range
- Hardware write-protect pin and software byte/page write modes
Applications
The 25LC256-I/STG serves as non-volatile data storage in microcontroller-based systems requiring SPI bus connectivity, including data loggers, medical instruments, and smart home devices. Its 32K x 8-bit organization and 64-byte page write capability make it well suited for storing calibration data, event logs, and user configuration settings. The compact SOIC-8 footprint and wide 2.5 V to 5.5 V supply range enable seamless integration with 3.3 V and 5 V microcontroller platforms in space-constrained industrial and consumer applications.
Specifications
| Pbfree Code | Yes |
| YTEOL | 5 |
| Clock Frequency-Max (fCLK) | 10MHz |
| Data Retention Time-Min | 200 |
| Endurance | 1000000 Write/Erase Cycles |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Memory Density | 262144bit |
| Memory IC Type | EEPROM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Words | 32768words |
| Number of Words Code | 32000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 32KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Serial Bus Type | SPI |
| Standby Current-Max | 0.000001A |
| Supply Current-Max | 0.005mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Write Cycle Time-Max (tWC) | 5ms |
| Write Protection | HARDWARE/SOFTWARE |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for 25LC256-I/STG:
Frequently Asked Questions
How many write/erase cycles does the 25LC256-I/STG support, and what is its data retention specification?
The 25LC256-I/STG is rated for 1,000,000 write/erase cycles per memory location and guarantees data retention of at least 200 years under standard operating conditions. This makes it an excellent choice for frequently updated logs in data acquisition systems and industrial monitoring equipment.
At what maximum SPI clock speed can the 25LC256-I/STG operate?
The 25LC256-I/STG supports SPI clock speeds up to 10 MHz, which translates to a peak sequential read throughput of approximately 10 Mbps. Its 32K x 8-bit organization and 64-byte page write capability make bulk configuration uploads fast and efficient for embedded systems.
Which supply voltage range does the 25LC256-I/STG accept, and what package does it use?
The 25LC256-I/STG operates from 2.5 V to 5.5 V, making it compatible with both 3.3 V and 5 V microcontroller platforms. It comes in an 8-pin SOIC (PDSO-G8) surface-mount package, enabling high-density PCB designs in portable devices, IoT nodes, and compact sensor modules.
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