ON Semiconductor

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Standard Zener Breakdown Voltage − 15 V to 150 V; Peak Power 600 Watts @ 100 ms; ESD Rating of Class 3 (> 16 KV) per Human Body Model; Response Time is Typically < 1.0 ns; Flat Handling Surface for Accurate Placement; Package Design for Top Slide or Bottom Circuit Board Mounting

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Use the download button to access the BCX19LT1G schematic symbol, PCB footprint, and 3D model.

Use the download button to access the BCW68GLT3G schematic symbol, PCB footprint, and 3D model.

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Standard Zener Breakdown Voltage − 15 V to 150 V; Peak Power 600 Watts @ 100 ms; ESD Rating of Class 3 (> 16 KV) per Human Body Model; Response Time is Typically < 1.0 ns; Flat Handling Surface for Accurate Placement; Package Design for Top Slide or Bottom Circuit Board Mounting

HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

High Current: IC = -1.0 Amp; The SOT-23 Package can be soldered using wave or reflow.; NPN Complement is BCP68; SOT-23 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.; Available in 12 mm Tape and Reel Use BCP69T1 to order the 7 inch/1000 unit reel. Use BCP69T3 to order the 13 inch/4000 unit reel.; Pb-Free Packages are Available

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

SC-70, SOT-323, 3 PIN

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Use the download button to access the BCW68GLT1G schematic symbol, PCB footprint, and 3D model.

Available in 12 mm Tape and Reel Use BCP69T1 to order the 7 inch/1000 unit reel. Use BCP69T3 to order the 13 inch/4000 unit reel.; NPN Complement is BCP68; High Current: IC = -1.0 Amp; SOT-23 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.; The SOT-23 Package can be soldered using wave or reflow.; Pb-Free Packages are Available;

CASE 318-08, 3 PIN

CASE 318-08, 3 PIN

LEAD FREE, CASE 463-01, SC-75, 3 PIN

CASE 318-08, 3 PIN

CASE 631AA-01, 3 PIN

Device Marking: BC856BDW1T1 = 3B BC857BDW1T1 = 3F BC857CDW1T1 = 3G BC858BDW1T1 = 3K BC858CDW1T1 = 3L; Pb-Free Packages are Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

SC-70, SC-88, 6 PIN

LEAD FREE, CASE 631AA-01, 3 PIN

HALOGEN FREE AND ROHS COMPLIANT, CASE 419-04, SC-70, 3 PIN

S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

Extremely Fast Switching Speed; Low Forward Voltage − 0.35 Volts (Typ) @ IF = 10 mAdc; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Medium Speed Switching Times; Low Leakage Current Applications; Available in 8 mm Tape and Reel - Use BAS116LT1 to order the 7 inch/3,000 unit reel; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

ON Semiconductor ATP212-TL-H N-channel MOSFET Transistor, 35 A, 60 V, 3-Pin ATPAK

ATPAK-3/2

SOIC-20

Compatible with the ISO 11898 standard (ISO 11898-2, ISO 11898-5 and SAE J2284); High speed (up to 1Mbaud); Ideally suited for 12V and 24V industrial and automotive applications; Extremely low current standby mode with wake-up via the bus; Low EME common-mode choke is no longer required; Differential receiver with wide common-mode range (+/- 35V) for high EMS; Voltage source via VSPLIT pin for stabilizing the recessive bus level (further EMC improvement); No disturbance of the bus lines with an un-powered n

0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8

Use the download button to access the AMIS30660CANH2G schematic symbol, PCB footprint, and 3D model.

Monitors up to 5 Voltages; Controls and Monitors up to 4 Fans; High and Low Frequency Fan Drive Signal; 1 On-chip and 2 Remote Temperature Sensors; Extended temp measurement range, up to 191°C; Automatic fan speed control mode controls system cooling based on measured temperature; Enhanced acoustic mode dramatically reduces user perception of changing fan speeds; Thermal protection feature via THERM output; Monitors performance impact of Intel® Pentium®4 processor; Thermal control circuit via THERM input; 3

Single-chip solution. Fully compatible with the Intel® IMVP-6.5 CPU and GMCH chipset voltage regulator specifications integrated MOSFET drivers.; Input voltage range of 3.3V to 22V.; ±7mV worst-case differentially sensed core voltage error overtemperature.; Automatic power-saving modes maximizes efficiency during light load operation.; Soft transient control reduces inrush current and audio noise.; Independent current limit and load line setting inputs for additional design flexibility.; Built-in power-good

SOIC-8

High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V; 3 ohms Switch Connection Between 2 Ports; Power Down Protection Provided on Inputs; Zero Bounce; TTLCompatible Control Inputs; UltraSmall PbFree Packages; These are PbFree Devices

Use the download button to access the 5LN01C-TB-E schematic symbol, PCB footprint, and 3D model.

50C02SS-TL-E from ON Semiconductor is a transistor for switching, amplification, and driver stages. Key specs include 3 pins, SO Transistor Flat Lead package, and Use the download button to access the 50C02SS-TL-E. From quote pricing.

High Collector Current Capability; Low Collector to Emitter Saturation Voltage (Resistance): RCE(sat) typ=210mΩ [IC=0.5A, IB=50mA]; Low ON-Resistance (Ron); Pb-Free, Halogen Free and RoHS compliance

Obsolete - N-Channnel Dual Gate MOSFET, 15V, 30mA, PG=21dB, NF=1.1dB, CP4

SC-59, 3 PIN