XMS430FR2355TDBTR Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

The XMS430FR2355TDBTR is a 16-bit MSP430 ultra-low-power microcontroller with 32KB FRAM, 4KB SRAM, 12-bit ADC, 12-bit DAC, integrated OpAmp/PGA, 44 I/O pins, and a 24 MHz maximum clock. From $3.50 in stock worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
XMS430FR2355TDBTRSmall Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
38
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 105.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 16-bit MSP430 core at up to 24 MHz with 32KB FRAM and 4KB SRAM enabling fast non-volatile writes at 105°C for harsh-environment data logging
  • Integrated 12-bit ADC, 12-bit DAC, and programmable gain OpAmp/PGA on-chip for complete signal-chain solutions without external analog components
  • Ultra-low-power MSP430 architecture with active current under 100 µA/MHz and multiple low-power modes for years of battery-powered sensor operation

Applications

The XMS430FR2355TDBTR is designed for ultra-low-power sensor hubs, industrial flow meters, and smart energy monitoring equipment that require precise analog signal acquisition and non-volatile data storage in a single 16-bit MCU. Its integrated OpAmp/PGA and 12-bit ADC enable direct connection to bridge sensors and current transformers without an external front-end IC, reducing BOM cost significantly. The 32KB FRAM memory allows in-system data logging at full speed without the endurance limit of Flash, making it well suited for predictive maintenance recorders operating over -40°C to +105°C.

Specifications

YTEOL0
Has ADCYES
Bit Size16
Boundary ScanYES
CPU FamilyMSP430
Clock Frequency-Max24MHz
DAC ChannelsYES
DMA ChannelsNO
FormatFIXED POINT
Integrated CacheNO
JESD-30 CodeR-PDSO-G38
JESD-609 Codee4
Low Power ModeYES
Number of I/O Lines34
Number of Serial I/Os2
Number of Timers4
On Chip Data RAM Width8
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeTSSOP38,.25,20
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)260
RAM (bytes)4096
ROM (words)32768
ROM ProgrammabilityFRAM
Speed24MHz
Supply Voltage-Max3.6V
Supply Voltage-Min1.8V
Supply Voltage-Nom3V
Surface MountYES
TechnologyCMOS
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch0.5mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 2
HTS Code8542.31.00.20

Datasheet

XMS430FR2355TDBTR Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does 32KB FRAM in XMS430FR2355TDBTR improve data logging reliability compared to Flash-based MCUs?

FRAM (ferroelectric RAM) in the XMS430FR2355TDBTR supports virtually unlimited write cycles (>10^15 writes per cell) compared to the typical 10,000 to 100,000 Flash erase cycles, meaning high-frequency data logs written every few milliseconds remain reliable over the full product life without wear-levelling algorithms or external EEPROM backup.

What integrated analog signal chain features does XMS430FR2355TDBTR provide for direct sensor measurement?

The device integrates a 12-bit SAR ADC with multiple input channels, a 12-bit DAC for reference or output generation, and a programmable gain amplifier OpAmp/PGA that can amplify small sensor signals—such as thermocouple or bridge outputs in the millivolt range—before digitisation, eliminating the need for external op-amps in most sensor measurement designs.

Up to what temperature does XMS430FR2355TDBTR operate, and which certifications support industrial deployment?

The XMS430FR2355TDBTR is rated for operation up to 105°C ambient temperature, 30°C higher than the standard 85°C commercial grade, and supports JTAG boundary scan for production test automation. This extended temperature rating qualifies it for smart meters, industrial controllers, and under-hood automotive accessories where temperatures regularly exceed 85°C.

How does XMS430FR2355TDBTR compare to MSP430FR2355 for a design requiring confirmed production availability?

The XMS430FR2355TDBTR is the extended-temperature (105°C) tape-and-reel variant of MSP430FR2355 sharing the same 44-pin VQFN TSSOP footprint and identical 32KB FRAM / 4KB SRAM / 24 MHz specification, so migrating from the standard-temperature part requires only a BOM swap without any firmware or PCB layout changes.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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CTO, AutoDrive Systems, Italy