XI6843AQGABL Texas Instruments Integrated Circuit (BGA) In Stock
XI6843AQGABL is a Texas Instruments integrated circuit introduced in August 2019, housed in a compact 161-ball CSP BGA package for high-density PCB designs. It is designed for advanced signal processing and system-on-chip applications requiring miniaturized form factors. Available from Texas Instruments with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 161
- Lifecycle
- OBSOLETE
- Datasheet
- XI6843AQGABL Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-compact 161-ball CSP BGA package enabling extremely high-density PCB integration for miniaturized electronic systems
- Advanced integrated circuit architecture introduced in 2019 incorporating modern process technology for improved performance and power efficiency
- Ball grid array packaging providing superior electrical performance with short signal paths and reduced parasitic inductance for high-frequency operation
- Designed for system-on-chip level integration supporting complex multi-function applications in a single compact device
Applications
The XI6843AQGABL is suited for advanced embedded computing and signal processing applications where miniaturization and high pin density are critical design requirements. Its CSP BGA packaging makes it particularly valuable in compact consumer electronics, communications hardware, and high-density industrial control modules. The device is also used in portable systems and IoT devices where space-efficient integration of complex IC functionality is essential.
Specifications
| Date Of Intro | 2019-08-24 |
| YTEOL | 0 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What package does the XI6843AQGABL use and how many balls does it have?
The XI6843AQGABL is housed in a 161-ball CSP (Chip Scale Package) BGA (Ball Grid Array) package. This ultra-compact package style enables very high-density PCB layouts, making it ideal for miniaturized electronics where space is at a premium, such as portable devices and compact embedded systems.
When was the XI6843AQGABL introduced and who manufactures it?
The XI6843AQGABL was introduced by Texas Instruments on August 24, 2019. As a Texas Instruments product, it benefits from TI's extensive design support resources, application notes, and global distribution network, ensuring long-term availability and technical support for design engineers.
What are typical applications for the XI6843AQGABL?
The XI6843AQGABL is suited for advanced signal processing, embedded computing, and communications applications requiring high pin-count integration in a miniaturized package. Its CSP BGA form factor is particularly valuable in IoT devices, portable instrumentation, compact consumer electronics, and any design where board space is tightly constrained.
What are the advantages of the CSP BGA package used in the XI6843AQGABL?
The CSP BGA package offers several advantages including a very small PCB footprint close to die size, excellent electrical performance due to short signal paths, lower parasitic inductance compared to leaded packages, and superior thermal dissipation through the ball array. These characteristics make it well-suited for high-frequency, high-density modern electronic designs.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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