XC7K325T-2FFG900CAlternatives & Equivalent Parts
About XC7K325T-2FFG900C
XC7K325T-2FFG900C is a Integrated Circuit component manufactured by XILINX. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | XC7K325T-2FFG900CSource | ASP-134488-01 | TLP2200 | MMIX1F230N20T |
|---|---|---|---|---|
| Manufacturer | XILINX | SAMTEC | Toshiba | IXYS SEMICONDUCTOR |
| Package Type | BGA | Other | Dual-In-Line Packages | Small Outline Packages |
| Pin Count | 900 | 400 | 8 | 24 |
| Temperature Range | ~ 85.0°C | -55.0°C ~ 125.0°C | ~ 85.0°C | -55.0°C ~ 175.0°C |
| Price | — | $14.3269 | — | $34.1000 |
| Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | END OF LIFE | ACTIVE |
| Electrical Parameters | ||||
| Factory Lead Time | 24 Weeks | 2 Weeks, 4 Days | — | — |
| YTEOL | 14 | 9.4 | 0.4 | 6 |
| Clock Frequency-Max | 1818 MHz | — | — | — |
| Combinatorial Delay of a CLB-Max | 0.25 ns | — | — | — |
| JESD-30 Code | S-PBGA-B900 | — | — | R-PDSO-G21 |
| JESD-609 Code | e1 | e3 | — | — |
| Number of CLBs | 25475 | — | — | — |
| Number of Inputs | 500 | — | — | — |
| Number of Logic Cells | 326080 | — | — | — |
| Number of Outputs | 500 | — | — | — |
| Organization | 25475 CLBS | — | — | — |
| Package Body Material | PLASTIC/EPOXY | — | — | PLASTIC/EPOXY |
| Package Equivalence Code | BGA900,30X30,40 | — | — | — |
| Package Shape | SQUARE | — | — | RECTANGULAR |
| Package Style | GRID ARRAY | — | — | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 245 | — | — | — |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | — | — | — |
| Qualification Status | Not Qualified | — | — | — |
| Supply Voltage-Max | 1.03 V | — | — | — |
| Supply Voltage-Min | 0.97 V | — | 4.5 V | — |
| Supply Voltage-Nom | 1 V | — | — | — |
| Surface Mount | YES | — | NO | YES |
| Technology | CMOS, 28 nm | — | — | — |
| Temperature Grade | OTHER | — | — | — |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | — | — | — |
| Terminal Form | BALL | — | — | GULL WING |
| Terminal Pitch | 1 mm | 1.27 mm | — | — |
| Terminal Position | BOTTOM | — | — | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | — | — | — |
| Board Mounting Option | — | PEG | — | — |
| Body Breadth | — | 0.578 inch | — | — |
| Body Depth | — | 0.24 inch | — | — |
| Body Length | — | 2.196 inch | — | — |
| Connector Type | — | BOARD CONNECTOR | — | — |
| Contact Finish Mating | — | GOLD (30) OVER NICKEL (50) | — | — |
| Contact Finish Termination | — | Tin (Sn) - with Nickel (Ni) barrier | — | — |
| Contact Gender | — | MALE | — | — |
| Contact Material | — | NOT SPECIFIED | — | — |
| Contact Pattern | — | RECTANGULAR | — | — |
| Contact Style | — | CENTRONIC | — | — |
| DIN Conformance | — | NO | — | — |
| Filter Feature | — | NO | — | — |
| IEC Conformance | — | NO | — | — |
| Insulator Material | — | LIQUID CRYSTAL POLYMER | — | — |
| MIL Conformance | — | NO | — | — |
| Mating Contact Pitch | — | 0.05 inch | — | — |
| Mixed Contacts | — | NO | — | — |
| Mounting Option 1 | — | LOCKING | — | — |
| Mounting Style | — | STRAIGHT | — | — |
| Mounting Type | — | BOARD | — | — |
| Number Of Connectors | — | ONE | — | — |
| Number Of PCB Rows | — | 10 | — | — |
| Number of Rows Loaded | — | 10 | — | — |
| Option | — | GENERAL PURPOSE | — | — |
| PCB Contact Pattern | — | RECTANGULAR | — | — |
| PCB Contact Row Spacing | — | 1.27 mm | — | — |
| Plating Thickness | — | 30u inch | — | — |
| Polarization Key | — | POLARIZED HOUSING | — | — |
| Termination Type | — | SURFACE MOUNT | — | — |
| Total Number of Contacts | — | 400 | — | — |
| Date Of Intro | — | — | 1991-04-23 | — |
| Additional Feature | — | — | UL RECOGNIZED | AVALANCHE RATED |
| Configuration | — | — | SINGLE | SINGLE WITH BUILT-IN DIODE |
| Data Rate-Nom | — | — | 2.5 MBps | — |
| Forward Current-Max | — | — | 0.01 A | — |
| Isolation Voltage-Max | — | — | 2500 V | — |
| Mounting Feature | — | — | THROUGH HOLE MOUNT | — |
| Number of Elements | — | — | 1 | 1 |
| Number of Functions | — | — | 1 | — |
| On-State Current-Max | — | — | 0.025 A | — |
| Optoelectronic Device Type | — | — | LOGIC IC OUTPUT OPTOCOUPLER | — |
| Response Time-Nom | — | — | 2.35e-7 ns | — |
| Avalanche Energy Rating (Eas) | — | — | — | 5000 mJ |
| Case Connection | — | — | — | ISOLATED |
| DS Breakdown Voltage-Min | — | — | — | 200 V |
| Drain Current-Max (ID) | — | — | — | 156 A |
| Drain-source On Resistance-Max | — | — | — | 0.0083 Ω |
| FET Technology | — | — | — | TRENCH MOSFET |
| Feedback Cap-Max (Crss) | — | — | — | 60 pF |
| Operating Mode | — | — | — | ENHANCEMENT MODE |
| Polarity/Channel Type | — | — | — | N-CHANNEL |
| Power Dissipation-Max (Abs) | — | — | — | 600 W |
| Pulsed Drain Current-Max (IDM) | — | — | — | 630 A |
| Transistor Application | — | — | — | SWITCHING |
| Transistor Element Material | — | — | — | SILICON |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 3 alternatives for XC7K325T-2FFG900C — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for XC7K325T-2FFG900C is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating XC7K325T-2FFG900C replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to XC7K325T-2FFG900C?
Known equivalents for XC7K325T-2FFG900C include ASP-134488-01, TLP2200, MMIX1F230N20T. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of XC7K325T-2FFG900C?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify XC7K325T-2FFG900C alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.