XC7K325T-2FFG900C XILINX Integrated Circuit (BGA) In Stock
XILINX - XC7K325T-2FFG900C - FPGA, KIntex-7, MMCM, PLL, 400 I/O's, 470.37 MHz, 326080 Cells, 970 mV to 1.03 V, FCBGA-900
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 900
- Lifecycle
- ACTIVE
- Datasheet
- XC7K325T-2FFG900C Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XC7K325T-2FFG900C?
- Kintex-7 FPGA with 326080 logic cells for high-density programmable logic
- Up to 1818 MHz clock-frequency specification for demanding timing designs
- 500 inputs and 500 outputs support wide parallel interfaces
- 0.25 ns maximum CLB combinatorial delay aids fast datapath implementation
- Core supply range of 970 mV to 1.03 V suits low-voltage FPGA boards
- FCBGA-900 package supports high-I/O routing density
What is XC7K325T-2FFG900C used for?
XC7K325T-2FFG900C is used in high-performance FPGA platforms for communications, industrial imaging, test equipment, and custom acceleration cards. It fits designs that need large programmable logic capacity, broad I/O connectivity, and deterministic timing control in a Kintex-7 architecture.
What are the specifications of XC7K325T-2FFG900C?
| Factory Lead Time | 24Weeks |
| YTEOL | 14 |
| Clock Frequency-Max | 1818MHz |
| Combinatorial Delay of a CLB-Max | 0.25ns |
| JESD-30 Code | S-PBGA-B900 |
| JESD-609 Code | e1 |
| Number of CLBs | 25475 |
| Number of Inputs | 500 |
| Number of Logic Cells | 326080 |
| Number of Outputs | 500 |
| Organization | 25475CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA900,30X30,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.03V |
| Supply Voltage-Min | 0.97V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | CMOS, 28 nm |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.60 |
Where can I find the XC7K325T-2FFG900C datasheet?
XC7K325T-2FFG900C Datasheet DownloadOfficial datasheet from XILINX
What are equivalent replacements for XC7K325T-2FFG900C?
Compatible alternatives and drop-in replacements for XC7K325T-2FFG900C:
Frequently Asked Questions
Which high-throughput logic designs are a good fit for XC7K325T-2FFG900C?
It suits designs needing dense programmable logic and broad interface routing, with 500 inputs and 500 outputs available for parallel buses, control planes, and custom acceleration datapaths.
How much timing headroom does this Kintex-7 speed grade provide?
The fetched specifications list a maximum clock frequency of 1818 MHz and 0.25 ns CLB combinatorial delay, giving FPGA designers strong timing margins for pipelined logic.
What board-level constraints should layout teams check before selecting this FPGA?
Layout teams should verify the FCBGA-900 footprint, 900 pins or balls, and the 970 mV to 1.03 V core supply range before committing the PCB stackup.
How should procurement teams plan sourcing risk for this Xilinx FPGA?
The context lists a 24-week factory lead time, so buyers should forecast demand early and verify the 900 pins or balls match approved AVL documentation.
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