VSP01M02ZWD Texas Instruments Integrated Circuit (Other) In Stock
VSP01M02ZWD is a CCD analog front-end signal processor IC by Texas Instruments in a 100-ball TFBGA package. Key specs: 2.7V-3.6V digital supply, fine-pitch grid array package, single-function consumer imaging circuit. From $5.50, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 100
- Lifecycle
- OBSOLETE
- Datasheet
- VSP01M02ZWD Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -25.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of VSP01M02ZWD?
- Integrated CCD analog front-end combines correlated double sampling and ADC functions for complete image signal chain
- Low 2.7V to 3.6V digital supply voltage reduces power consumption in portable and consumer imaging devices
- 100-ball TFBGA fine-pitch package enables compact PCB integration in space-constrained camera modules
- Optimized for CCD sensor interfaces delivering high image quality in digital camera and scanner applications
What is VSP01M02ZWD used for?
The VSP01M02ZWD is designed for CCD image sensor signal processing in digital cameras, flatbed scanners, and document imaging systems requiring high-quality analog front-end processing. Its integrated correlated double sampling and analog-to-digital conversion reduce external component count and simplify PCB design for consumer imaging products. The low digital supply voltage makes it well-suited for portable devices and compact camera modules with strict power budgets.
What are the specifications of VSP01M02ZWD?
| YTEOL | 0 |
| Additional Feature | ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PBGA-B100 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.60 |
Where can I find the VSP01M02ZWD datasheet?
VSP01M02ZWD Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for VSP01M02ZWD?
Compatible alternatives and drop-in replacements for VSP01M02ZWD:
Frequently Asked Questions
What is the primary function of the VSP01M02ZWD?
The VSP01M02ZWD is a CCD analog front-end IC that performs correlated double sampling and analog-to-digital conversion of CCD image sensor signals, providing a complete signal conditioning chain for digital camera, scanner, and other consumer imaging applications.
What supply voltage does the VSP01M02ZWD require?
The VSP01M02ZWD requires a digital supply voltage of 2.7V to 3.6V, enabling low-power operation suitable for portable consumer electronics and battery-operated imaging devices where energy efficiency is a key design requirement.
What package is used for the VSP01M02ZWD?
The VSP01M02ZWD is housed in a 100-ball TFBGA (Thin Fine-Pitch Ball Grid Array) package with a square form factor, providing a very compact footprint ideal for integration into small camera modules and high-density PCB designs.
What types of imaging systems use the VSP01M02ZWD?
The VSP01M02ZWD is used in CCD-based imaging systems including digital still cameras, flatbed document scanners, medical imaging equipment, and industrial machine vision systems requiring precise analog signal conditioning from CCD image sensors.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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