VSP01M01ZWDR Texas Instruments Integrated Circuit (Other) In Stock
VSP01M01ZWDR is a CCD analog front-end IC by Texas Instruments designed for digital imaging signal processing. Key specs: 2.7V to 3.6V digital supply, 100-ball TFBGA package, single-function consumer imaging circuit. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 100
- Lifecycle
- OBSOLETE
- Datasheet
- VSP01M01ZWDR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -25.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of VSP01M01ZWDR?
- Integrated CCD analog front-end with correlated double sampling (CDS) and programmable gain amplifier for low-noise image sensor signal conditioning
- 2.7V to 3.6V digital supply voltage enables direct integration with 3.3V digital imaging processors and FPGAs in consumer camera designs
- 100-ball TFBGA package (PBGA-B100) provides a compact, fine-pitch footprint suited for high-density imaging module PCB layouts
What is VSP01M01ZWDR used for?
The VSP01M01ZWDR is used in digital camera image sensor signal chains where low-noise analog conditioning of CCD output signals is required before analog-to-digital conversion. It integrates correlated double sampling and gain control functions that reduce kTC noise and fixed-pattern noise from CCD arrays in consumer digital cameras, flatbed scanners, and document imaging systems. The device is also applicable in machine vision and industrial imaging equipment where precise CCD signal conditioning directly impacts image quality and resolution.
What are the specifications of VSP01M01ZWDR?
| YTEOL | 0 |
| Pbfree Code | Yes |
| Additional Feature | ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY |
| Consumer IC Type | CONSUMER CIRCUIT |
| JESD-30 Code | S-PBGA-B100 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Temperature Grade | OTHER |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| HTS Code | 8542.39.00.60 |
Where can I find the VSP01M01ZWDR datasheet?
VSP01M01ZWDR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for VSP01M01ZWDR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What digital supply voltage range does the VSP01M01ZWDR require for correct operation?
The VSP01M01ZWDR requires a digital supply voltage of 2.7V to 3.6V for its digital interface and control logic. This range is compatible with standard 3.3V digital imaging processors, making it straightforward to power from a single regulated 3.3V rail in consumer camera designs.
Which imaging noise reduction technique does the VSP01M01ZWDR use to improve CCD image quality?
The VSP01M01ZWDR employs correlated double sampling (CDS) to cancel reset noise (kTC noise) from each CCD pixel readout, significantly improving signal-to-noise ratio. This technique is essential for achieving low-noise imagery in digital cameras and flatbed scanners operating at standard pixel clock rates.
In which package does the VSP01M01ZWDR come and how does it affect imaging module board layout?
The VSP01M01ZWDR is housed in a 100-ball thin fine-pitch BGA (TFBGA) package with a fine-pitch ball grid array footprint. This compact package minimizes the PCB area consumed by the analog front-end, which is important in space-constrained digital camera modules where the image sensor, AFE, and ADC must fit within a small board area.
For a flatbed scanner design, how does the VSP01M01ZWDR simplify the signal chain compared to discrete CDS implementations?
By integrating correlated double sampling, programmable gain amplification, and signal buffering into a single 100-ball IC, the VSP01M01ZWDR replaces multiple discrete op-amps and sample-hold capacitors. This reduces the flatbed scanner analog front-end from roughly 15 to 20 discrete components to a single-chip solution, lowering BOM cost and PCB area by an estimated 40%.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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