TSW-219-13-F-D SAMTEC Connector (Header, Vertical) In Stock
The TSW-219-13-F-D is a SAMTEC 38-way (19-position × 2-row) through-hole vertical male header with a 5.08 mm row pitch, gold flash over nickel mating contact finish, and tin over nickel termination. It provides reliable board-to-wire or board-to-board connections and is compatible with standard 0.100" pitch receptacle housings. Available in stock worldwide with competitive pricing and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Vertical
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- TSW-219-13-F-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 38-way dual-row through-hole design with 5.08 mm row pitch provides a mechanically robust vertical header for high-density signal and power interconnects
- Gold flash over nickel mating surface delivers low contact resistance and corrosion resistance for reliable signal integrity across hundreds of mating cycles
- Through-hole termination with tin-over-nickel finish ensures strong solder joint integrity in vibration and shock environments compared to SMT alternatives
- Male contact gender and vertical orientation allow direct mating with standard 0.100" pitch female receptacle housings and ribbon cable connectors
Applications
The TSW-219-13-F-D is used in industrial control boards, embedded system backplanes, and test-and-measurement equipment as a reliable 38-pin dual-row through-hole header for connecting daughter cards, cable assemblies, and peripheral modules. Its gold flash mating contacts ensure consistent electrical performance in applications where the connector may be mated and unmated frequently during system integration and field servicing. The vertical through-hole mounting style provides superior mechanical retention for use in environments with vibration and shock loads up to 20 g.
Specifications
| Pbfree Code | Yes |
| YTEOL | 10 |
| Body Breadth | 0.2inch |
| Body Depth | 0.1inch |
| Body Length | 3.7inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD FLASH OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | POLYBUTYLENE TEREPHTHALATE |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | FLASH inch |
| Rated Current (Signal) | 5.2A |
| Reference Standard | UL |
| Terminal Pitch | 5.08mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 38 |
| UL Flammability Code | 94V-0 |
| Package | Header, Vertical |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total pin count and row configuration of the TSW-219-13-F-D?
The TSW-219-13-F-D has 38 pins arranged in 2 rows of 19 positions each, on a 0.100" (2.54 mm) within-row pitch and 5.08 mm row-to-row spacing. This dual-row 38-way format allows up to 38 signal or power lines to be routed through a single connector footprint measuring approximately 3.7 inches in total body length.
Why does the TSW-219-13-F-D use gold flash mating contacts rather than full gold plating?
Gold flash over nickel provides approximately 0.1 µm to 0.25 µm of gold on the mating surface, which is sufficient to prevent oxidation and maintain low contact resistance below 20 mΩ for applications with fewer than 100 mating cycles. Full hard gold plating (typically 1.27 µm or more) would be needed for 1000+ mate cycles. Gold flash is a cost-optimized choice for board development, test fixtures, and production wiring harnesses where mating frequency is moderate.
How does through-hole mounting of the TSW-219-13-F-D compare to SMT headers in high-vibration industrial applications?
Through-hole solder joints on the TSW-219-13-F-D penetrate through the PCB and are typically 3–5× stronger in axial pull strength than SMT solder fillets on an equivalent footprint. In industrial applications subject to vibration above 5 g RMS or shock loads of 20 g or higher, through-hole headers are preferred because SMT pads can fracture under repeated mechanical stress, whereas through-hole pins distribute force across the entire PCB thickness and barrel fillet.
Which mating connector types are compatible with the TSW-219-13-F-D for cable assembly connections?
The TSW-219-13-F-D mates with SAMTEC's TFM, SAM, and SFM series dual-row female receptacle housings on 0.100" (2.54 mm) pitch, as well as standard IDC ribbon cable connectors terminated in a 38-pin dual-row female housing with 2×19 configuration. Cable lengths from 100 mm to 600 mm are common for off-board connections using 28 AWG or 30 AWG ribbon cables rated for signals up to 1 A per conductor.
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