TSW-210-13-G-Q SAMTEC Connector (Header, Vertical) In Stock

SAMTEC TSW-210-13-G-Q is a 20-position, 5.08 mm pitch through-hole vertical single-row male header with gold-over-nickel contact finish and square post terminations for reliable PCB interconnect. Rated for 3 A per contact with 5.08 mm grid spacing compatible with standard 0.200" breadboard and PCB layouts. From $3.20 in stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSW-210-13-G-QHeader, Vertical
Quick Facts
Manufacturer
SAMTEC
Package
Header, Vertical
Pin Count
20
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 20-position single-row vertical through-hole header with 5.08 mm (0.200") pitch for standard breadboard and PCB layouts
  • Gold (10 µin) over nickel contact finish on mating surface for low-resistance, corrosion-resistant connections over hundreds of cycles
  • Square post (Q) termination style provides robust mechanical anchoring through PCB holes with 3 A per contact current rating
  • 5.08 mm body pitch compatible with standard 0.200" grid wire-wrap, screw-terminal, and prototyping interconnect systems

Applications

The TSW-210-13-G-Q is used as a vertical board header in industrial control panels, prototyping platforms, and test fixtures requiring reliable 20-pin single-row connections at 5.08 mm pitch. Its through-hole mounting provides mechanical robustness for applications subject to vibration or frequent cable mating in field-service equipment. Gold-over-nickel contacts ensure consistent low-contact-resistance signal and power connections in instrumentation and embedded development boards.

Specifications

Pbfree CodeYes
YTEOL10
Body Breadth0.3inch
Body Depth0.1inch
Body Length1.9inch
Body/Shell StyleRECEPTACLE
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (10) OVER NICKEL
Contact Finish TerminationGold (Au) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialPOLYBUTYLENE TEREPHTHALATE
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.1inch
Mating Contact Row Spacing0.2inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing5.08mm
Plating Thickness10u inch
Rated Current (Signal)5.2A
Reference StandardUL
Terminal Length0.9inch
Terminal Pitch5.08mm
Termination TypeSOLDER
Total Number of Contacts20
UL Flammability Code94V-0
PackageHeader, Vertical

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginUSA

Datasheet

TSW-210-13-G-Q Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pitch and pin count does TSW-210-13-G-Q provide, and what systems is it compatible with?

The TSW-210-13-G-Q has 20 positions at 5.08 mm (0.200") pitch in a single-row through-hole vertical configuration, making it compatible with standard 0.200" grid PCB layouts, screw-terminal blocks, and wire-wrap boards used in industrial control and prototyping systems.

What contact finish does TSW-210-13-G-Q use and how does it affect mating performance?

Contacts are finished with 10 µin gold over nickel on the mating surface, providing contact resistance below 30 mΩ, resistance to oxidation over more than 200 mating cycles, and reliable signal integrity for low-level analog and digital signals in the range of millivolts.

For which industrial applications is the TSW-210-13-G-Q's 5.08 mm pitch particularly well suited?

The 5.08 mm pitch aligns with industrial terminal block and I/O connector standards, making the TSW-210-13-G-Q suitable for PLC I/O modules, relay driver boards, power distribution panels, and field-wiring PCBs where wire gauges up to 16 AWG require wider-pitch pin spacings than 2.54 mm.

How does through-hole mounting of TSW-210-13-G-Q compare to SMT headers for vibration-prone enclosures?

Through-hole mounting increases solder joint shear strength by a factor of 3 to 5 compared to SMT pads, as pins pass through the PCB and are soldered on the back side, making the TSW-210-13-G-Q more resistant to mechanical stress in vibration environments above 5 g acceleration typical of motor drive and transportation equipment.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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