TSW-210-13-G-Q SAMTEC Connector (Header, Vertical) In Stock
SAMTEC TSW-210-13-G-Q is a 20-position, 5.08 mm pitch through-hole vertical single-row male header with gold-over-nickel contact finish and square post terminations for reliable PCB interconnect. Rated for 3 A per contact with 5.08 mm grid spacing compatible with standard 0.200" breadboard and PCB layouts. From $3.20 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Vertical
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TSW-210-13-G-Q Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position single-row vertical through-hole header with 5.08 mm (0.200") pitch for standard breadboard and PCB layouts
- Gold (10 µin) over nickel contact finish on mating surface for low-resistance, corrosion-resistant connections over hundreds of cycles
- Square post (Q) termination style provides robust mechanical anchoring through PCB holes with 3 A per contact current rating
- 5.08 mm body pitch compatible with standard 0.200" grid wire-wrap, screw-terminal, and prototyping interconnect systems
Applications
The TSW-210-13-G-Q is used as a vertical board header in industrial control panels, prototyping platforms, and test fixtures requiring reliable 20-pin single-row connections at 5.08 mm pitch. Its through-hole mounting provides mechanical robustness for applications subject to vibration or frequent cable mating in field-service equipment. Gold-over-nickel contacts ensure consistent low-contact-resistance signal and power connections in instrumentation and embedded development boards.
Specifications
| Pbfree Code | Yes |
| YTEOL | 10 |
| Body Breadth | 0.3inch |
| Body Depth | 0.1inch |
| Body Length | 1.9inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | POLYBUTYLENE TEREPHTHALATE |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.2inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 5.08mm |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 5.2A |
| Reference Standard | UL |
| Terminal Length | 0.9inch |
| Terminal Pitch | 5.08mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Header, Vertical |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin count does TSW-210-13-G-Q provide, and what systems is it compatible with?
The TSW-210-13-G-Q has 20 positions at 5.08 mm (0.200") pitch in a single-row through-hole vertical configuration, making it compatible with standard 0.200" grid PCB layouts, screw-terminal blocks, and wire-wrap boards used in industrial control and prototyping systems.
What contact finish does TSW-210-13-G-Q use and how does it affect mating performance?
Contacts are finished with 10 µin gold over nickel on the mating surface, providing contact resistance below 30 mΩ, resistance to oxidation over more than 200 mating cycles, and reliable signal integrity for low-level analog and digital signals in the range of millivolts.
For which industrial applications is the TSW-210-13-G-Q's 5.08 mm pitch particularly well suited?
The 5.08 mm pitch aligns with industrial terminal block and I/O connector standards, making the TSW-210-13-G-Q suitable for PLC I/O modules, relay driver boards, power distribution panels, and field-wiring PCBs where wire gauges up to 16 AWG require wider-pitch pin spacings than 2.54 mm.
How does through-hole mounting of TSW-210-13-G-Q compare to SMT headers for vibration-prone enclosures?
Through-hole mounting increases solder joint shear strength by a factor of 3 to 5 compared to SMT pads, as pins pass through the PCB and are soldered on the back side, making the TSW-210-13-G-Q more resistant to mechanical stress in vibration environments above 5 g acceleration typical of motor drive and transportation equipment.
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