TSV358IYDTAlternatives & Equivalent Parts

About TSV358IYDT

TSV358IYDT is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterTSV358IYDTSourceTSV358IDTSV358IDT
ManufacturerSTMicroelectronicsSTMicroelectronicsSTMicroelectronics
Package TypeSmall Outline PackagesSmall Outline PackagesSmall Outline Packages
Pin Count888
Temperature Range-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C
Price$0.5403$0.4527
StockIn StockIn StockIn Stock
LifecycleACTIVEOBSOLETEACTIVE
Electrical Parameters
Factory Lead Time20 Weeks20 Weeks
YTEOL808
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.15 µA0.15 µA0.15 µA
Bias Current-Max (IIB) @25C0.125 µA0.13 µA0.13 µA
Common-mode Reject Ratio-Min60 dB65 dB60 dB
Common-mode Reject Ratio-Nom80 dB80 dB80 dB
Frequency CompensationYESYESYES
Input Offset Current-Max (IIO)0.06 µA
Input Offset Voltage-Max3000 µV3000 µV3000 µV
JESD-30 CodeR-PDSO-G8R-PDSO-G8R-PDSO-G8
JESD-609 Codee3e4e4
Low-BiasNONONO
Low-OffsetNONONO
MicropowerYESYESYES
Number of Functions888
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP8,.25SOP8,.25SOP8,.25
Package ShapeRECTANGULARRECTANGULARRECTANGULAR
Package StyleSMALL OUTLINESMALL OUTLINESMALL OUTLINE
Packing MethodTRTUBETR
Peak Reflow Temperature (Cel)260NOT SPECIFIED
PowerNONONO
Programmable PowerNONONO
Qualification StatusNot QualifiedNot QualifiedNot Qualified
Screening LevelAEC-Q100
Slew Rate-Min0.42 V/us0.42 V/us0.42 V/us
Slew Rate-Nom0.6 V/us0.6 V/us0.6 V/us
Supply Current-Max1.75 mA1.75 mA1.75 mA
Supply Voltage Limit-Max7 V7 V7 V
Supply Voltage-Nom (Vsup)3 V3 V3 V
Surface MountYESYESYES
TechnologyBICMOSBICMOSBICMOS
Temperature GradeAUTOMOTIVEAUTOMOTIVEAUTOMOTIVE
Terminal FinishMatte Tin (Sn) - annealedNICKEL PALLADIUM GOLDNickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormGULL WINGGULL WINGGULL WING
Terminal Pitch1.27 mm1.27 mm1.27 mm
Terminal PositionDUALDUALDUAL
Unity Gain BW-Nom130013001300
Voltage Gain-Min501150005000
WidebandNONONO
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Need pricing on these alternatives?

Get one quote covering all 2 alternatives for TSV358IYDT — response within 24 hours.

Quick Links

TSV358IDby STMicroelectronics Operational

Amplifier, 8 Func, 3000uV Offset-Max, BICMOS, PDSO2

TSV358IDTby STMicroelectronics

Operational Amplifier, 8 Func, 3000uV Offset-Max, BICMOS, PDSO2

Why Look for Alternatives?

Finding alternatives for TSV358IYDT is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating TSV358IYDT replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to TSV358IYDT?

Known equivalents for TSV358IYDT include TSV358ID, TSV358IDT. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of TSV358IYDT?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify TSV358IYDT alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.