TSV358AID STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock

TSV358AID is a dual rail-to-rail operational amplifier from STMicroelectronics, with 1.4 MHz gain-bandwidth product, 80 dB CMRR, 1 mV max offset voltage, and 65 dB minimum CMRR, in an 8-pin SO package for precision analog signal conditioning.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
TSV358AIDSmall Outline Packages
Quick Facts
Manufacturer
STMicroelectronics
Package
Small Outline Packages
Pin Count
8
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TSV358AID?

  • Rail-to-rail input and output swing on 3 V to 5 V single supply for maximum dynamic range
  • 1.4 MHz gain-bandwidth product supporting audio and low-frequency signal amplification
  • 80 dB typical CMRR for effective common-mode noise rejection in sensor interfaces
  • Input offset voltage of 1000 µV maximum ensuring acceptable DC accuracy in low-gain stages
  • Dual amplifier topology in a compact 8-pin SO package reduces board area versus two singles
  • 0.15 µA maximum bias current minimises error with high-impedance source resistances

What is TSV358AID used for?

The TSV358AID is suited for low-power single-supply analog front-ends in portable medical devices, battery-powered data loggers, and IoT sensor conditioning circuits where rail-to-rail output maximises the usable signal swing at 3 V to 5 V. Its 1.4 MHz gain-bandwidth product and 80 dB CMRR make it effective for instrumentation-quality amplification of bridge sensor outputs, microphone preamplifiers, and current sensing in consumer electronics. Industrial 4–20 mA transmitters and HVAC control boards also use the TSV358AID for its reliable DC accuracy and low input bias current across the full operating temperature range.

What are the specifications of TSV358AID?

YTEOL0
Amplifier TypeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.15 µA
Bias Current-Max (IIB) @25C0.13 µA
Common-mode Reject Ratio-Min65dB
Common-mode Reject Ratio-Nom80dB
Frequency CompensationYES
Input Offset Voltage-Max1000 µV
JESD-30 CodeR-PDSO-G8
JESD-609 Codee4
Low-BiasNO
Low-OffsetNO
MicropowerYES
Number of Functions8
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeSOP8,.25
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE
Packing MethodTUBE
PowerNO
Programmable PowerNO
Qualification StatusNot Qualified
Slew Rate-Min0.42V/us
Slew Rate-Nom0.6V/us
Supply Current-Max1.75mA
Supply Voltage Limit-Max7V
Supply Voltage-Nom (Vsup)3V
Surface MountYES
TechnologyBICMOS
Temperature GradeAUTOMOTIVE
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch1.27mm
Terminal PositionDUAL
Unity Gain BW-Nom1300
Voltage Gain-Min5000
WidebandNO
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8542.33.00.01

Where can I find the TSV358AID datasheet?

TSV358AID Datasheet Download

Official datasheet from STMicroelectronics

What are equivalent replacements for TSV358AID?

Compatible alternatives and drop-in replacements for TSV358AID:

TSV358AIYDTSTMicroelectronics Operational

Amplifier, 8 Func, 1000uV Offset-Max, BICMOS, PDSO2

View Part →
TSV358AIDTSTMicroelectronics

Operational Amplifier, 8 Func, 1000uV Offset-Max, BICMOS, PDSO2

View Part →

Frequently Asked Questions

Which design use cases are a practical fit for TSV358AID?

TSV358AID is a Integrated Circuit from STMicroelectronics suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 8 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.

How should engineers check package compatibility for TSV358AID during layout review?

Use the Small Outline Packages package information together with 8 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.

What should procurement keep aligned when cross-referencing TSV358AID against alternates?

Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as -40°C to 125°C. Matching these details lowers substitution risk across 1 approved BOM.

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About STMicroelectronics

STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.

AvailabilityIn Stock
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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