TSV358AID STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock
TSV358AID is a dual rail-to-rail operational amplifier from STMicroelectronics, with 1.4 MHz gain-bandwidth product, 80 dB CMRR, 1 mV max offset voltage, and 65 dB minimum CMRR, in an 8-pin SO package for precision analog signal conditioning.
- Manufacturer
- STMicroelectronics
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- TSV358AID Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSV358AID?
- Rail-to-rail input and output swing on 3 V to 5 V single supply for maximum dynamic range
- 1.4 MHz gain-bandwidth product supporting audio and low-frequency signal amplification
- 80 dB typical CMRR for effective common-mode noise rejection in sensor interfaces
- Input offset voltage of 1000 µV maximum ensuring acceptable DC accuracy in low-gain stages
- Dual amplifier topology in a compact 8-pin SO package reduces board area versus two singles
- 0.15 µA maximum bias current minimises error with high-impedance source resistances
What is TSV358AID used for?
The TSV358AID is suited for low-power single-supply analog front-ends in portable medical devices, battery-powered data loggers, and IoT sensor conditioning circuits where rail-to-rail output maximises the usable signal swing at 3 V to 5 V. Its 1.4 MHz gain-bandwidth product and 80 dB CMRR make it effective for instrumentation-quality amplification of bridge sensor outputs, microphone preamplifiers, and current sensing in consumer electronics. Industrial 4–20 mA transmitters and HVAC control boards also use the TSV358AID for its reliable DC accuracy and low input bias current across the full operating temperature range.
What are the specifications of TSV358AID?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.15 µA |
| Bias Current-Max (IIB) @25C | 0.13 µA |
| Common-mode Reject Ratio-Min | 65dB |
| Common-mode Reject Ratio-Nom | 80dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 1000 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Min | 0.42V/us |
| Slew Rate-Nom | 0.6V/us |
| Supply Current-Max | 1.75mA |
| Supply Voltage Limit-Max | 7V |
| Supply Voltage-Nom (Vsup) | 3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 1300 |
| Voltage Gain-Min | 5000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TSV358AID datasheet?
TSV358AID Datasheet DownloadOfficial datasheet from STMicroelectronics
What are equivalent replacements for TSV358AID?
Compatible alternatives and drop-in replacements for TSV358AID:
Frequently Asked Questions
Which design use cases are a practical fit for TSV358AID?
TSV358AID is a Integrated Circuit from STMicroelectronics suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 8 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.
How should engineers check package compatibility for TSV358AID during layout review?
Use the Small Outline Packages package information together with 8 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.
What should procurement keep aligned when cross-referencing TSV358AID against alternates?
Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as -40°C to 125°C. Matching these details lowers substitution risk across 1 approved BOM.
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Why Buy from FindMyChip
About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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