TST-113-04-F-D SAMTEC Connector (Other) In Stock
SAMTEC TST-113-04-F-D is a 26-position dual-row shrouded PCB header with 0.100 inch (2.54 mm) pitch and through-hole mounting for robust board-level signal connections. The polarized shroud prevents incorrect mating orientation, making it reliable for industrial, embedded computing, and test equipment applications. This connector mates with standard 26-position IDC receptacles and dual-row ribbon cable assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- TST-113-04-F-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TST-113-04-F-D?
- 26-position dual-row shrouded header at 0.100 inch (2.54 mm) pitch providing polarized keyed mating for error prevention
- Through-hole mounting for mechanical robustness in applications subject to vibration or frequent cable insertion cycles
- Compatible with standard 26-position IDC ribbon cable assemblies and dual-row socket receptacles for broad interconnect flexibility
What is TST-113-04-F-D used for?
The TST-113-04-F-D is designed for through-hole PCB header applications in industrial control panels, embedded computing modules, and test and measurement systems requiring a 26-position shrouded dual-row connector at 0.100 inch pitch. Its shrouded polarized housing prevents miswiring when technicians connect ribbon cables or daughter cards in the field. The through-hole construction provides strong mechanical retention suitable for environments subject to repeated mating cycles or mechanical vibration.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TST-113-04-F-D datasheet?
TST-113-04-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TST-113-04-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What mating advantage does the shrouded design of the TST-113-04-F-D provide over an open-frame 26-position header?
The shroud on the TST-113-04-F-D physically encloses the 26 dual-row pins and incorporates a polarizing key, so only correctly oriented IDC receptacles or dual-row socket assemblies can mate. This prevents reversed insertion that would short or damage all 26 signal lines, which is critical in field-serviced industrial equipment where connector identification may be difficult.
Why does through-hole mounting benefit the TST-113-04-F-D in high-vibration or high-cycle applications?
Through-hole pins are soldered into drilled PCB vias, creating mechanical anchor points that resist pull-out forces across all 26 positions. Compared to SMT pads, through-hole solder joints withstand higher vibration amplitudes and more frequent cable insertion and removal cycles without pad delamination, making the TST-113-04-F-D suitable for industrial machinery and test fixture PCBs.
Which ribbon cable or daughter-card assemblies mate with the TST-113-04-F-D connector?
The TST-113-04-F-D accepts standard 26-position dual-row IDC ribbon cable connectors and socket receptacles designed for 0.100 inch (2.54 mm) pitch headers. Compatible assemblies are available with various ribbon cable gauges and lengths, allowing engineers to connect daughter boards, sensors, displays, or I/O modules to the host PCB across up to 26 separate signal lines.
How does the 26-position TST-113-04-F-D compare to the 22-position TST-111 for designs needing additional signal lanes?
The TST-113-04-F-D provides 4 additional positions over a 22-position header, accommodating 26 signals at 0.100 inch (2.54 mm) pitch in the same dual-row shrouded form factor. For designs where 22 positions are insufficient for additional control, power, or ground lines, the TST-113-04-F-D adds 4 pins with a moderate increase in body length while retaining identical IDC ribbon cable mating compatibility.
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