TST-111-03-H-D SAMTEC Connector (Other) In Stock

Name: TST-111-03-H-D
Brand: SAMTEC
SKU: TST-111-03-H-D
Availability: InStock

SAMTEC TST-111-03-H-D is a 22-position dual-row shrouded PCB header with 0.100" (2.54 mm) pitch, 30 microinch gold over nickel contact finish, and 1.4 inch body length. Provides reliable board-to-board connectivity with square pin contacts and full mechanical polarization. Available in stock with worldwide shipping.

ACTIVEConnectorVerified Jul 2026

Package / Visual Reference

TST-111-03-H-DOther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 22
Lifecycle: ACTIVE
Datasheet: TST-111-03-H-D Datasheet PDF
Category: Connector
Price: From $1.9500(MOQ 1000)
Temp Range: -55.0°C to 125.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of TST-111-03-H-D?

22 contacts (11 positions dual-row) at 0.100" (2.54 mm) pitch in a 1.4 inch shrouded body for compact board-to-board connections
30 microinch gold over nickel contact plating delivering low resistance below 20 mΩ and extended mating cycle durability
Square pin (SQ PIN-SKT) contact style compatible with both socket and receptacle counterparts for flexible system integration

What is TST-111-03-H-D used for?

The TST-111-03-H-D is suited for compact embedded computing modules, industrial sensor interfaces, and daughter card interconnections requiring 22 signals in a polarized 0.100" pitch shrouded header. The 1.4 inch body length fits narrow PCB edge zones on stackable module designs in PLC, robotics, and IoT gateway applications. Its full-shroud polarization protects contacts from mechanical damage during blind-mate assembly in rack-mount and panel-mount equipment.

What are the specifications of TST-111-03-H-D?

YTEOL	9.1
Body Breadth	0.365inch
Body Depth	0.365inch
Body Length	1.4inch
Connector Type	BOARD CONNECTOR
Contact Finish Mating	GOLD (30) OVER NICKEL
Contact Gender	MALE
Contact Pattern	RECTANGULAR
Contact Style	SQ PIN-SKT
DIN Conformance	NO
Filter Feature	NO
IEC Conformance	NO
Insulation Resistance	5000000000Ω
Insulator Color	BLACK
Insulator Material	GLASS FILLED POLYESTER
MIL Conformance	NO
Mating Contact Pitch	0.1inch
Mating Contact Row Spacing	0.1inch
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Mixed Contacts	NO
Mounting Option 1	LOCKING
Mounting Style	STRAIGHT
Mounting Type	BOARD
Number Of Connectors	ONE
Number Of PCB Rows	2
Number of Rows Loaded	2
Option	GENERAL PURPOSE
PCB Contact Pattern	RECTANGULAR
PCB Contact Row Spacing	2.54mm
Plating Thickness	30u inch
Polarization Key	POLARIZATION NOTCH
Terminal Length	0.565inch
Terminal Pitch	2.54mm
Termination Type	SOLDER
Total Number of Contacts	22
Package	Other

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
ECCN	EAR99
HTS Code	8536.69.40.40

Where can I find the TST-111-03-H-D datasheet?

TST-111-03-H-D Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TST-111-03-H-D?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does the 30 microinch gold plating on the TST-111-03-H-D compare to gold flash, and when does it matter for connector reliability?

The TST-111-03-H-D features 30 microinch (0.76 µm) hard gold over nickel on its mating contacts, which is significantly thicker than the 3 to 5 microinch gold flash used on lower-cost headers. This thicker plating supports a rated cycle life of 500 or more mating cycles while maintaining contact resistance below 20 mΩ, making it the preferred choice in field-serviceable equipment such as test fixtures, measurement instruments, and modular industrial controllers.

What signal count can the TST-111-03-H-D support, and which common embedded bus interfaces fit within 22 pins?

With 22 contacts at 0.100" (2.54 mm) pitch in a 1.4 inch shrouded body, the TST-111-03-H-D accommodates a full 16-bit parallel data bus plus 6 address and control lines, or a combined SPI, UART, I2C, and power rail bundle. It also fits the standard 20-pin JTAG boundary scan interface with 2 additional ground pins, covering most embedded debug and programming header requirements.

What are the body dimensions of the TST-111-03-H-D and how should they be reflected in PCB keep-out areas?

The TST-111-03-H-D body measures 1.4 inches (35.6 mm) in length and 0.365 inch (9.3 mm) in both breadth and depth, with a mated height dependent on the counterpart connector. Designers should define a PCB keep-out zone of at least 38 mm × 12 mm to accommodate the connector body plus standard solder fillet clearance. Component height clearance of 9.1 mm (YTEOL) must be maintained above the PCB surface on both the header and mating socket side.

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AvailabilityIn Stock

Reference Price (USD)

From $1.9500

Buy from 1pc · Factory-direct pricing

Qty.	Unit Price	Ext. Price
1000+	$3.2300	$3230.00
2500+	$2.5900	$6475.00
5000+	$1.9500	$9750.00

pcs

Unit price: $3.2300 · Total: $3230.00

In Stock · 24h Response · Worldwide Shipping

Direct Contact

WhatsApp Inquiry Email RFQ

Lead Time3-7 business days

MOQFrom 1 piece

ShippingDHL / FedEx / UPS

OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”

James Wright

Supply Chain Director, CircuitPro Ltd, UK

TST-111-03-H-D SAMTEC Connector (Other) In Stock

What are the key features of TST-111-03-H-D?

What is TST-111-03-H-D used for?

What are the specifications of TST-111-03-H-D?

Compliance & Regulatory

Where can I find the TST-111-03-H-D datasheet?

What are equivalent replacements for TST-111-03-H-D?

Frequently Asked Questions

How does the 30 microinch gold plating on the TST-111-03-H-D compare to gold flash, and when does it matter for connector reliability?

What signal count can the TST-111-03-H-D support, and which common embedded bus interfaces fit within 22 pins?

What are the body dimensions of the TST-111-03-H-D and how should they be reflected in PCB keep-out areas?

Related Guides

STM32H753VIT6 High-Performance MCU Design Guide

STM32H753ZIT6 Selection Guide for High-Performance Embedded Systems

ICL7660ACPAZ Negative Voltage Charge Pump Design Guide

C0402C103K3RACTU 10 nF MLCC Design Guide

Why Buy from FindMyChip

About SAMTEC

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