TST-107-05-T-D SAMTEC Connector (Other) In Stock
SAMTEC TST-107-05-T-D is a 14-position dual-row shrouded PCB header with 0.100 inch (2.54 mm) pitch for through-hole mounting. Features gold-plated contacts rated at 3 A per pin with a polarizing key for foolproof connector mating. Available in bulk packaging for standard wave or hand soldering with worldwide distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- TST-107-05-T-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TST-107-05-T-D?
- 14-position dual-row shrouded header with 0.100 inch (2.54 mm) pitch and polarizing key preventing mis-mating in board-to-cable and board-to-board connections
- Gold-plated contacts rated at 3 A per pin and 250 V working voltage for reliable signal and low-power connections across industrial temperature ranges
- Shrouded housing with integrated polarization boss protecting pins during mating and providing strain relief for cable connections in vibration environments
- Through-hole design compatible with wave soldering and hand soldering processes, providing robust mechanical retention with 4-point solder joint per pin
What is TST-107-05-T-D used for?
The TST-107-05-T-D is designed for board-to-cable and board-to-board interconnects in industrial controls, robotics, and embedded systems where the shrouded 0.100 inch pitch header provides both electrical connectivity and physical keying to prevent incorrect assembly. It is commonly used in power distribution panels, PLC expansion modules, and test fixtures where the 14-pin dual-row layout supports mixed signal and low-voltage power routing in a single compact connector. The through-hole mounting provides superior mechanical strength compared to surface mount alternatives in applications subject to mechanical stress, vibration, or frequent cable insertion cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TST-107-05-T-D datasheet?
TST-107-05-T-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TST-107-05-T-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TST-107-05-T-D, and what contact rating does it provide?
The TST-107-05-T-D has 14 positions in a dual-row through-hole configuration with 0.100 inch (2.54 mm) pitch. Each row contains 7 pins. The gold-plated contacts are rated at 3 A per pin and 250 V working voltage, suitable for mixed signal and low-power distribution in industrial and embedded system board designs.
How does the shrouded housing of the TST-107-05-T-D prevent assembly errors?
The TST-107-05-T-D features a plastic shroud surrounding all 14 pins with an integrated polarizing boss that physically prevents mating with connectors in the wrong orientation. This keying mechanism ensures correct pin-1 alignment during cable assembly, reducing field service errors and preventing damage from reverse-polarity connections in systems with 14 signal or mixed-power channels.
What soldering methods are compatible with the TST-107-05-T-D through-hole design?
The TST-107-05-T-D is compatible with both wave soldering and hand soldering processes standard for through-hole components. The 0.100 inch pitch matches standard PCB drill patterns with 1.0 mm hole diameter, and each pin forms a 4-point solder fillet providing excellent mechanical pull-out strength exceeding 10 N per pin for vibration-resistant industrial applications.
In what applications is TST-107-05-T-D preferred over a surface mount header alternative?
The TST-107-05-T-D is preferred over surface mount headers in applications with frequent cable plug/unplug cycles exceeding 100 times, where through-hole solder joints provide far superior pull-out resistance. It is also chosen in environments with vibration levels above 5 g RMS, such as industrial machinery, transportation electronics, and field-deployed embedded systems where SMT joints risk solder fatigue cracking over time.
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