TSM-150-01-F-DV-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TSM-150-01-F-DV-P-TR?

• 100-position dual-row configuration at 0.100 inch (2.54 mm) pitch provides industry-leading contact density for complex multi-bus or multi-signal PCB interconnect designs
• Tape-and-reel (TR) packaging enables seamless integration into automated pick-and-place SMT assembly lines, supporting high-volume production without manual handling
• Dual-height (DV) body design provides additional mechanical clearance above the PCB, allowing decoupling capacitors and passive components to be placed beneath the connector
• Standard 0.100 inch pitch ensures broad compatibility with mating pin headers, IDC connectors, and ribbon cable assemblies across the industry

What is TSM-150-01-F-DV-P-TR used for?

The TSM-150-01-F-DV-P-TR is designed for high-density board-to-board interconnect in server backplanes, network switch linecards, and industrial PLC expansion modules where 100 simultaneous signal connections must be managed in a single compact connector. Its dual-row 0.100 inch pitch layout enables routing of multi-bus architectures including address, data, and control lines between processor boards and peripheral expansion cards. The tape-and-reel packaging and SMT termination make this connector an optimal choice for automated high-volume production of enterprise computing and telecom hardware.

Compliance & Regulatory

Where can I find the TSM-150-01-F-DV-P-TR datasheet?

Official datasheet from SAMTEC

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